Why wouldn’t be correct today?
I already explained it. If this was a problem years ago, why would the entire industry, that is the processor makers, OEM coolers and all of the aftermarket cooler makers, continue to use inferior products that could not even stand up to normal, expected (not overclocking) use? Common sense needs to kick in here. If thermal pads could not properly cool a CPU
during normal use (that is, for whatever the computer was marketed for, and
at default clock settings), that clearly would make those manufacturer's products look bad. They would get bad reviews, upset customers, and sales would plummet. If they did nothing, the competition would move in. So the CPU and heatsink makers started using better solutions.
What did both AMD and Intel do after everyone complained year ago the OEM coolers they provided with their CPUs failed to properly cool their CPUs? Or even if they did provide adequate cooling, it sounded like a jet engine in the room? They included much better OEM coolers that had bigger heatsinks, bigger and quieter fans, and better quality TIM.
What does AMD and Intel do for their high-performance CPUs that cannot be properly cooled with their OEM coolers? They don't include coolers in the packaging - forcing us to buy aftermarket coolers.
That's just simple Marketing 101. If technologies did not allow for superior pads, they would have all started using pastes.
The TIM makers, CPU makers and aftermarket cooler makers have not been sitting on their thumbs for the last 15 years. That's why it is not correct today.
You made the statement as a blanket statement. Therefore, that includes OEM coolers that came with pads, as well as aftermarket coolers that came with pads.
The same applies to graphics card makers. No card maker is going to use a thermal solution that cannot adequately cool the processor on their cards (
when the card is used as advertised - that is, with default settings).
It has always been paraffin. Silicone polymers do indeed make up a large portion of the solids that are left behind once the paraffin melts away. But the paraffin is what allows the thermal pads to rapidly melt and distribute the actual TIM components across the IHS and heatsink mating surfaces the first time the CPU fires up,
Yes crack the die if you apply the pressure required for the thermal to offer the rated w/mk , IHS ? I thought op was asking about a laptop , do laptops CPUs come with an IHS nowadays ??
Huh? No! You crack the die if you don't have a clue what you are doing, fail to learn proper procedures, do something stupid when you had no business being in there in the first place!!
Of course they use an IHS. It seems you are unclear what the IHS (integrate heat spreader) is. The IHS is that metal cover as seen below. The actual CPU die is under that cover.
You might want to read up on
delidding a CPU.
that doesn’t mean there no pressure requirement
I never said there is no pressure requirement. I said, "
It is not an exact science because it does not need to be." It is not like applying proper torque to an engine bolt so it never works its way loose. Why do you think heat sink mounting mechanisms commonly mount with 1/4 turn mounting screws? It is because the springs in those mechanisms apply the needed pressure. How exact to suppose those springs are? Not very, that's for sure. And that pressure just needs to be enough to keep the heatsink fixed in place. If it is able to move, it will break the cured bond and that will allow insulating air to get in between the mating surfaces - a bad thing.
Silicon, as used in TIM, when properly applied, is NOT fragile. This is why TIM can easily last 10, 15 years or even longer
AS LONG AS the cured bond is not broken.
I think you misunderstand the purpose of TIM in the first place.
The most efficient transfer of heat occurs with direct metal to metal contact. But Man cannot create perfection 100% of the time. The IHS and heatsink mating surfaces are NOT perfectly flat and totally free of imperfections. So as noted in Posts # 10 and 13 above, the purpose of TIM is to fill the microscopic pits and valleys in the mating surfaces that may trap insulating air.
Any excess TIM is in the way and
counterproductive to the most efficient transfer of heat.
Now for sure, if the user is modifying the voltage and clock defaults to increase performance, thus increasing heat generation and the requirement to extract that heat, then a good quality TIM "paste" is universally accepted to be the better option.
But now i want to replace paste for VRM and VRAM too
Why? Are you having heat related problems?
"
If it's not broken, don't fix it!"
Let me add one more thing. Proper cooling is absolutely essential. No disputing that. Achieving the coolest temperatures possible is not - except for bragging rights.