streetfighter 2
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Disclaimer: This is an experiment I performed and am providing a write-up in the hopes that useful information can be gleaned from it by other users. (It sure did help me!) Please do your own research before making potentially dangerous decisions.
This article assumes readers have prior familiarity with certain technical terms. If you aren't comfortable with these terms or would like to freshen up I recommend the following as a primer:
http://www.hardwaresecrets.com/arti...e-Motherboard-Voltage-Regulator-Circuit/616/1
Purpose:
The Biostar TA790GX series boards are notorious for problems with the CPU’s PWM circuit due to the lack of any stock cooling apparatus. In most cases when the board is run with stock clocks and typical ambient temperatures (0C) there should be no serious stability issues. However, if the board is pushed in the presence of an already high TDP CPU there is a serious risk of critical system failure such as in Figure 1.
Figure 1: MOSFET which caught fire as a result of poor cooling and high stress. Sorry for the picture quality. (Source: zif33rs, rebelshavenforum.com)
The TA790GX 128M uses a 3+1 phase PWM circuit with three MOSFETs per phase which dictates two important facts. Firstly the PWM circuit is not the most sophisticated or the best in providing stable power to the CPU. Secondly the CPU’s voltage regulation is accomplished by only a small handful of components which translates to large amounts of heat in a concentrated area. The heat is not merely relegated to the MOSFETs, chokes can also be a substantial contributor to heat as shown in Figure 2, but are less likely to explode or catch fire (citation needed).
Figure 2: Coil type inductors shown under load exceeding the temperatures of the MOSFETs. (Source: bing, overclockers.com)
The common solution to this issue is aftermarket cooling such as the Thermalright HR-09S, Enzotech MOS-C1 and custom modified heatsinks. Several of these methods are shown in Figure 3. Although clearly better than nothing at all, the efficiency of the various aftermarket sinks does not appear to be well studied. Unfortunately I do not have access to many of the solutions so I will only be testing one of them, the Enzotech MOS-C1.
Figure 3: A variety of MOSFET heatsink designs for TA790GX series boards. From upper left going clockwise: official Biostar heatsink only available in China (source needed), modified Biostar Cooler Harbor (source), Thermalright HR-09S (source), modified aluminum heatsink (source)
Test System:
Motherboard: Biostar TA790GX 128M with Enzotech MOS-C1 MOSFET heatsinks
CPU: AMD Phenom II X2 550BE unlocked and running as an X4 B50 at 3.7GHz 1.41V (1.39V effective)
CPU MOSFETs: NTD4863N made in week 43 of 2008 (datasheet)
Procedure:
The test was divided into two stages, the first stage involved letting the computer heat up while recording the MOSFET temperature. The second stage involved measuring the temperatures of all the MOSFETs and chokes while at max load with all components fully heated.
To measure the temperature of the MOSFETs and chokes on the board a K type exposed junction thermocouple was placed in metal-to-metal contact with the top center of the MOS-C1 heatsink on the MOSFET closest to the rear I/O panel’s ethernet port as shown in Figure 5. (This particular MOSFET was chosen for the warm-up stage of the test because it is the same as the one which exploded in Figure 1.) Prime95 x64 was then run with 4 threads and in-place large FFTs for 40 minutes with the temperature recorded each minute which is shown in Figure 6. An Extech 22-816 multimeter collected temperatures from the MOSFET’s thermocouple while another thermal probe placed just outside of the case provided actual ambient temperature measurements as shown in Figure 4. Since the door of the case was open during the test the air conditioning was shut off in an attempt to replicate the environment of the case if the door was closed.
Figure 4: Test setup. The ambient temperature sensor is visible as the grey wire just in front of the GPU towards the right. Yes, I noticed my desk is dusty, I’m getting a new one anyway.
Figure 5: Exposed junction thermocouple wedged into MOS-C1 making direct contact with the heatsink surface.
Figure 6: Recording data into a spreadsheet during the test.
After the 40 minute warm up period elapsed and while Prime95 was still running, the thermocouple was placed on most of the MOSFETs and left until an accurate reading could be taken. Finally the thermocouple was placed on the four chokes and measurements were taken.
Results:
Figure 7: The warm-up stage of the experiment. The measured MOSFET reached a maximum temperature of 72C.
The MOSFET measured during the warm-up stage, labeled by a red circle in Figure 8, took around 8 minutes to reach a relatively stable temperature whereas the CPU took approximately 6 minutes and the NB (not shown) crawled from 41C to 47C and apparently would have kept increasing even after the test time elapsed. The case’s ambient temperature stayed fairly constant during the test and averaged around 27C, which, with any luck, is hotter than most users’ computer cases.
Figure 8: PWM section of the TA790GX 128M where the MOSFET measured in stage one is marked by the red circle; the MOSFETs with the white circles were the hottest; the MOSFETs labeled 7, 8 and 9 correspond to data points 7, 8, 9 in Figure 9; the chokes are labeled as 1, 2, 3 and 4.
The average temperature of the MOSFET in Figure 7 was 68C after the first seven minutes which, while high, is not enough to cause alarm. Prime95 is not considered a good measure of typical processor loads so this particular MOSFET lead me to the early conclusion that MOSFET temperatures were more than acceptable.
Unfortunately during the second stage of the test when I examined the temperatures of the other MOSFETs I found that the MOSFET measured during the first stage was relatively cool. A random sampling of the other MOSFET temperatures is shown in Figure 9.
Figure 9: Random sampling of CPU MOSFET temperatures at full load after 40 minutes.
One of the MOSFETs reached a horrifying 86C. Though the maximum junction temperature of the MOSFETs is listed as 175C, the performance degrades long before that and the temperature measured during the experiment was only the temperature of the MOSFET heatsink, which is sure to be lower than the actual junction temperature (source). Several of the high temperatures recorded in Figure 9 are cause for alarm, but only in regards to stability. I sincerely doubt that these temperatures could cause a MOSFET to explode or catch fire.
Even more interesting was the discovery that the phases were unevenly loaded. The MOSFET temperatures corresponding to the phases of chokes 1 and 4 in Figure 8 were up to 36C cooler than the hottest recorded MOSFET temperature. This unexpected result can be partly attributed to the fact that one of the phases is the sole provider of a separate voltage for the CPUs memory controller, which at the time, was not fully loaded. From the data recorded I would assume that the phase corresponding to choke 1 provided this extra voltage because it had the lowest average temperature of all the other phases. The data in Figure 9 correlates well with the choke temperatures shown in Figure 10, where cooler MOSFETs aligned with cooler chokes. Oddly though the hottest MOSFET temperature (86C) was recorded on one of choke 3’s MOSFETs, not choke 2 as would be expected from the data in Figure 10. I couldn’t retrieve a datasheet for the chokes that were tested; however I feel that 70C is still a safe temperature.
Figure 10: Choke temperatures measured after 40 minutes at full load. The choke number corresponds to the labeling in Figure 8.
From this data it’s obvious that the PWM circuit on the TA790GX 128M is hot, very hot, probably even dangerously hot. On the other hand the MOS-C1 heatsinks appear to be doing their job. A comparison of results with and without the MOSFET heatsinks would be preferential but I was unable to remove the MOS-C1s (which are stuck on there really good). I’m going to place a fan nearby blowing directly on them and rerun the test to see how much that improves the temperatures.
Special thanks to TPU users Velvet Wafer and Wile E for inspiring the test.
Notes: If I made any errors (logic, textual or otherwise) please feel free to mention them so they can be corrected. Thanks
This article assumes readers have prior familiarity with certain technical terms. If you aren't comfortable with these terms or would like to freshen up I recommend the following as a primer:
http://www.hardwaresecrets.com/arti...e-Motherboard-Voltage-Regulator-Circuit/616/1
Purpose:
The Biostar TA790GX series boards are notorious for problems with the CPU’s PWM circuit due to the lack of any stock cooling apparatus. In most cases when the board is run with stock clocks and typical ambient temperatures (0C) there should be no serious stability issues. However, if the board is pushed in the presence of an already high TDP CPU there is a serious risk of critical system failure such as in Figure 1.
Figure 1: MOSFET which caught fire as a result of poor cooling and high stress. Sorry for the picture quality. (Source: zif33rs, rebelshavenforum.com)
The TA790GX 128M uses a 3+1 phase PWM circuit with three MOSFETs per phase which dictates two important facts. Firstly the PWM circuit is not the most sophisticated or the best in providing stable power to the CPU. Secondly the CPU’s voltage regulation is accomplished by only a small handful of components which translates to large amounts of heat in a concentrated area. The heat is not merely relegated to the MOSFETs, chokes can also be a substantial contributor to heat as shown in Figure 2, but are less likely to explode or catch fire (citation needed).
Figure 2: Coil type inductors shown under load exceeding the temperatures of the MOSFETs. (Source: bing, overclockers.com)
The common solution to this issue is aftermarket cooling such as the Thermalright HR-09S, Enzotech MOS-C1 and custom modified heatsinks. Several of these methods are shown in Figure 3. Although clearly better than nothing at all, the efficiency of the various aftermarket sinks does not appear to be well studied. Unfortunately I do not have access to many of the solutions so I will only be testing one of them, the Enzotech MOS-C1.
Figure 3: A variety of MOSFET heatsink designs for TA790GX series boards. From upper left going clockwise: official Biostar heatsink only available in China (source needed), modified Biostar Cooler Harbor (source), Thermalright HR-09S (source), modified aluminum heatsink (source)
Test System:
Motherboard: Biostar TA790GX 128M with Enzotech MOS-C1 MOSFET heatsinks
CPU: AMD Phenom II X2 550BE unlocked and running as an X4 B50 at 3.7GHz 1.41V (1.39V effective)
CPU MOSFETs: NTD4863N made in week 43 of 2008 (datasheet)
Procedure:
The test was divided into two stages, the first stage involved letting the computer heat up while recording the MOSFET temperature. The second stage involved measuring the temperatures of all the MOSFETs and chokes while at max load with all components fully heated.
To measure the temperature of the MOSFETs and chokes on the board a K type exposed junction thermocouple was placed in metal-to-metal contact with the top center of the MOS-C1 heatsink on the MOSFET closest to the rear I/O panel’s ethernet port as shown in Figure 5. (This particular MOSFET was chosen for the warm-up stage of the test because it is the same as the one which exploded in Figure 1.) Prime95 x64 was then run with 4 threads and in-place large FFTs for 40 minutes with the temperature recorded each minute which is shown in Figure 6. An Extech 22-816 multimeter collected temperatures from the MOSFET’s thermocouple while another thermal probe placed just outside of the case provided actual ambient temperature measurements as shown in Figure 4. Since the door of the case was open during the test the air conditioning was shut off in an attempt to replicate the environment of the case if the door was closed.
Figure 4: Test setup. The ambient temperature sensor is visible as the grey wire just in front of the GPU towards the right. Yes, I noticed my desk is dusty, I’m getting a new one anyway.
Figure 5: Exposed junction thermocouple wedged into MOS-C1 making direct contact with the heatsink surface.
Figure 6: Recording data into a spreadsheet during the test.
After the 40 minute warm up period elapsed and while Prime95 was still running, the thermocouple was placed on most of the MOSFETs and left until an accurate reading could be taken. Finally the thermocouple was placed on the four chokes and measurements were taken.
Results:
Figure 7: The warm-up stage of the experiment. The measured MOSFET reached a maximum temperature of 72C.
The MOSFET measured during the warm-up stage, labeled by a red circle in Figure 8, took around 8 minutes to reach a relatively stable temperature whereas the CPU took approximately 6 minutes and the NB (not shown) crawled from 41C to 47C and apparently would have kept increasing even after the test time elapsed. The case’s ambient temperature stayed fairly constant during the test and averaged around 27C, which, with any luck, is hotter than most users’ computer cases.
Figure 8: PWM section of the TA790GX 128M where the MOSFET measured in stage one is marked by the red circle; the MOSFETs with the white circles were the hottest; the MOSFETs labeled 7, 8 and 9 correspond to data points 7, 8, 9 in Figure 9; the chokes are labeled as 1, 2, 3 and 4.
The average temperature of the MOSFET in Figure 7 was 68C after the first seven minutes which, while high, is not enough to cause alarm. Prime95 is not considered a good measure of typical processor loads so this particular MOSFET lead me to the early conclusion that MOSFET temperatures were more than acceptable.
Unfortunately during the second stage of the test when I examined the temperatures of the other MOSFETs I found that the MOSFET measured during the first stage was relatively cool. A random sampling of the other MOSFET temperatures is shown in Figure 9.
Figure 9: Random sampling of CPU MOSFET temperatures at full load after 40 minutes.
One of the MOSFETs reached a horrifying 86C. Though the maximum junction temperature of the MOSFETs is listed as 175C, the performance degrades long before that and the temperature measured during the experiment was only the temperature of the MOSFET heatsink, which is sure to be lower than the actual junction temperature (source). Several of the high temperatures recorded in Figure 9 are cause for alarm, but only in regards to stability. I sincerely doubt that these temperatures could cause a MOSFET to explode or catch fire.
Even more interesting was the discovery that the phases were unevenly loaded. The MOSFET temperatures corresponding to the phases of chokes 1 and 4 in Figure 8 were up to 36C cooler than the hottest recorded MOSFET temperature. This unexpected result can be partly attributed to the fact that one of the phases is the sole provider of a separate voltage for the CPUs memory controller, which at the time, was not fully loaded. From the data recorded I would assume that the phase corresponding to choke 1 provided this extra voltage because it had the lowest average temperature of all the other phases. The data in Figure 9 correlates well with the choke temperatures shown in Figure 10, where cooler MOSFETs aligned with cooler chokes. Oddly though the hottest MOSFET temperature (86C) was recorded on one of choke 3’s MOSFETs, not choke 2 as would be expected from the data in Figure 10. I couldn’t retrieve a datasheet for the chokes that were tested; however I feel that 70C is still a safe temperature.
Figure 10: Choke temperatures measured after 40 minutes at full load. The choke number corresponds to the labeling in Figure 8.
From this data it’s obvious that the PWM circuit on the TA790GX 128M is hot, very hot, probably even dangerously hot. On the other hand the MOS-C1 heatsinks appear to be doing their job. A comparison of results with and without the MOSFET heatsinks would be preferential but I was unable to remove the MOS-C1s (which are stuck on there really good). I’m going to place a fan nearby blowing directly on them and rerun the test to see how much that improves the temperatures.
Special thanks to TPU users Velvet Wafer and Wile E for inspiring the test.
Notes: If I made any errors (logic, textual or otherwise) please feel free to mention them so they can be corrected. Thanks
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