On the contrary, Ryzen 9 should be getting the better yields of IO die, simply because the twin-chiplet Ryzen 9 processors require the better yields of IO die for two reasons:
In production terms, that means it's far more likely to be the purer silicon towards the middle of the wafer - so whilst it's still a lottery - you are getting better odds than you would if you were using a single-chiplet model like a Ryzen7 or Ryzen 5.
- to meet TDP requirements at stock speeds - the Ryzen 9 TDP is harder to meet with two chiplets, so they need to waste as little of the power budget on the IO die as possible.
- All of the IF logic to communicate with the chiplets needs to be functional. One assumes that Ryzen 7 and Ryzen 5 models may be making use of IO dies where defects in one of the IF chiplet interconnects is defective, but just deactivated.
I'm speculating, obviously - but this is the exact sort of thing both AMD and Intel have done before to maximise their profits - and that is their #1 priority, after all!
All you can do is try. Even if it won't run all 64GB at 3600MHz, you have the ability to tweak the timings around a bit.
It's worth noting that 1usmus just updated the Ryzen DRAM Calculator today.
HOORAY!!!!
I am totally sold on these Micron E die DDR4 sticks. Been running Prime95 memory stress test for about an hour with no issues yet. 4x16 at 3600MHz and 16 CAS latency and 1T command rate. All according to XMP specs. This kit seems to be a great match for the 3900x on x570.
Not bad at all for $185 MSRP per 2x16GB kit!
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