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Frore Systems AirJet Delivers 50% Performance Boost to the Samsung Galaxy Book4 Edge 14"

GFreeman

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Frore Systems has demonstrated the massive increase in performance possible with AirJet solid-state active cooling chips in the new Samsung Galaxy Book4 Edge 14", the thinnest Notebook on the market at just 10.9 mm. The proof-of-concept Samsung Galaxy Book4 Edge 14", upgraded with AirJet, achieves an incredible 50% increase in sustained CPU & AI performance, showing that now, consumers really can demand it all. Frore Systems will be showcasing the upgraded Samsung Notebook in January at CES 2025.

Frore Systems achieved the 50% performance boost in the Samsung Galaxy Book4 Edge 14", from 12 Watts to 18 Watts, by replacing the two large fans currently used in the Notebook with four AirJet chips. This innovative solution reduces the cooling solution footprint by 45% - the fans consuming 8,800 mm² of space vs the AirJet footprint of just 4,800 mm². Therefore, the extremely compact AirJet solution creates additional space inside the Galaxy Book4 Edge 14", potentially allowing for increasing the battery size from the current 55.9 Wh to 64.8 Wh - a 16% increase - improving video runtime from 20 hours to 23.2 hours.



The AirJet solution achieves this while allowing for a sleeker ID that is dustproof and water-resistant, no longer requiring the fan inlet holes across the back cover of the Galaxy Book4 Edge, all while maintaining its silent operation and super thin form factor of just 10.9 mm - retaining its coveted position as the slimmest notebook available.

Compared to the MacBook Air 15" which is thicker at 11.5 mm, the Galaxy Book4 Edge upgraded with AirJet is not only thinner, but also surpasses the MacBook Air, in both performance and battery life by a staggering 50% and 29% respectively. The Galaxy Book4 Edge 14" with AirJet demonstrating 18 Watts sustained CPU & AI performance and 23.2 hrs video runtime vs the MacBook Air 15" running at an inferior 12 Watts and 18 hrs.

"The Samsung Galaxy Book4 Edge 14" is an incredible Notebook, already delivering impressive performance and battery life made possible by the amazing Qualcomm Snapdragon X Elite processor", said Dr. Seshu Madhavapeddy, the founder and CEO of Frore Systems. "This all-new Microsoft Co-Pilot+ PC experience is transforming how users create, communicate and play. Just imagine the endless possibilities with additional 50% increase in sustained CPU & AI performance and 16% longer battery life enabled by AirJet. The future of AI is truly being unleashed by AirJet solid-state active cooling."

See the upgraded Samsung Galaxy Book4 Edge 14" with AirJet in action at CES 2025, together with a range of commercially available products, manufactured by Frore Systems' customers and featuring AirJet solid-state active cooling. Frore Systems will be demonstrating many more proof-of-concept devices upgraded with AirJet chips and, AirJet PAKs, which are plug-and-play solid-state active cooling modules targeting Industrial and Smart Cities Edge AI devices and delivering uncompromising AI performance in industrial grade casings that are ultra compact, light, silent, vibration free, dustproof and water-resistant.

View at TechPowerUp Main Site | Source
 
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They should have a chat with Valve for looking maybe get a deal for in the Steam Deck 2. That said I do think it will be too expensive but who knows it could also be a good pr move for Frore
 

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They should have a chat with Valve for looking maybe get a deal for in the Steam Deck 2. That said I do think it will be too expensive but who knows it could also be a good pr move for Frore
Knowing what a pretty basic heatpipe with heatsink costs, I don't think there will be a huge cost difference, as heatpipes aren't that cheap to make, even in quantities of 10k+.
Not that I know what these things costs, but design wise, it's also a lot more effort that goes into a laptop cooler, compared to this.
I would also hazard a guess that there's a lot more testing that goes into the laptop coolers to get the right balance of noise and cooling.
 

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Is that the only way they got funding? If they stuck "AI" in the wording? It's a great product on it's own.
 
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Each unit (according to the company's datasheets at https://www.froresystems.com/) can only dissipate just over 5 watts of heat. So with the Steamdeck's 15W TDP, three of these would cover that (under ideal conditions). But most likely you'd need more than that.

Also, the dimensions listed on Frore's datasheet are 27.5mmx41.5mmx2.65mm for a single unit. Considering the space for ~4 of these and that you still need a heatpipe to move heat from the APU, I doubt it makes much sense currently.

Instead, I think it's more likely that you'll see this in a "gaming" smartphone. Active cooling to prevent thermal throttling could be a strong selling point.
 
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Each unit (according to the company's datasheets at https://www.froresystems.com/) can only dissipate just over 5 watts of heat. So with the Steamdeck's 15W TDP, three of these would cover that (under ideal conditions). But most likely you'd need more than that.

Also, the dimensions listed on Frore's datasheet are 27.5mmx41.5mmx2.65mm for a single unit. Considering the space for ~4 of these and that you still need a heatpipe to move heat from the APU, I doubt it makes much sense currently.

Instead, I think it's more likely that you'll see this in a "gaming" smartphone. Active cooling to prevent thermal throttling could be a strong selling point.
Basically anything that needs to be thin and light. Even regular phones would benefit with having a little extra cooling.

The company also used to have a larger AirJet prototype besides the Mini that was slightly smaller than a standard 2.5" SSD that could do about 20-25w TDP if I'm not misremembering, and they did talk about eventually making those available too. My guess is they chose to move forwards with the Mini series since there's far more things those can be squeezed into, but if they ever bring the larger AirJet to market, it could also be useful in more of the "gaming"-oriented tablets and thinbooks that could use the extra cooling power of 2-3 of those or even a mix of AirJets and Minis.
 

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Each unit (according to the company's datasheets at https://www.froresystems.com/) can only dissipate just over 5 watts of heat. So with the Steamdeck's 15W TDP, three of these would cover that (under ideal conditions). But most likely you'd need more than that.
It's basically their AirJet Pak 3C. And if it works for Jettson Nano Orin with 15W TDP, I'm pretty sure it'll be just fine for newer iterations of SteamDeck. Even the stock 1st gen portables are going to be fine, since it runs at 15W default, and most power users like to downtune it to 10W to keep thermals in check and improve battery life.

Knowing what a pretty basic heatpipe with heatsink costs, I don't think there will be a huge cost difference, as heatpipes aren't that cheap to make, even in quantities of 10k+.
I don't remember the exact $$$, but when dummy Linus of all people did a very first review of this thing, they mentioned something about the price and it wasn't outrageous at all, considering it's a totally new tech.
AirJet also list Zotac MiniPCs that use it, and these aren't hi-end NUCs. ZBOX pico PI430AJ retails somewhere between $450-$600 depending on configuration, so if Zotac can afford it, Valve has no excuse not to use it. That's actually one of the tech tings I'm really excited about. It can give us cool things, like actively cooled tablets, or super-slim laptops that won't throttle any time you look at it the wrong way.
 

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AirJet solid-state active cooling.

So is this a TEC? Would that not utilize more battery power and create more hotspots? I must be missing it, but reading the OP I don't know what this is.
 
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So is this a TEC? Would that not utilize more battery power and create more hotspots? I must be missing it, but reading the OP I don't know what this is.
No, it's not a TEC. Here's the datasheet. It basically causes ultrasonic vibrations across an area that forces airflow and thus removal of heat. Currently only capable of limited power ranges, but it's a cool tech.
 

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So is this a TEC? Would that not utilize more battery power and create more hotspots? I must be missing it, but reading the OP I don't know what this is.
Not TEC. And it's not "solid state" either, and that's the only aspect of it which I have a beef with.
It's still technically a "mechanical" cooling, only instead of fans they use many-many tiny flexible flaps to move the air. They are charged/discharged to flap and pulse the air at ultrasonic frequencies. It consumes a bit more power than a fan (those small 5W modules may need up to 1W of power), but they are wa-a-a-ay thinner and smaller overall. While official datasheets don't really tell us the whole story, there are lots of YT videos that go into detail.
 
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I've seen this company in the news multiple times by now over the last years (first time @ LTT) and still market adoption is very low.
There must be a very serious catch, if they're not straight up lying these should be a nobrainer.
Price seems unlikely considering LTT said they weren't cheap but not overly expensive or something.
 

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market adoption is very low.
As far as I can see, it's wa-a-ay higher than I expected for this new tech. They went from R&D to production-ready in only few years, and from last-year's mass media campaign, to being in several commercial devices in only 1 year. That's impressive.
 

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We have a few of the Book 4 Edge,14" and 16" in the house so I'll be watching for more info on this at CES.
 
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You'd think Apple would be all over this....
 
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You'd think Apple would be all over this....
Not that anybody is allowed to admit working with Apple (and if you do work with them you're not allowed to say their name)...so, let's just say I've worked with a company called "Voldemort" before...well from my experience, what that company would do with new tech like this is wait until their next gen Voldemort product is about 90% developed, then assign an internal group to drive a vendor like Frore to develop a version for said product (knowing it's almost definitely impossible all along).

They'd give them about 1/4-1/2 of the necessary time to develop a good solution, say "you need to give us x# of sample units so we can confirm it works as needed before we'll pay you, then we'll buy tons of these, promise!", then change the requirements during said short development time several times...causing that short window of time which the vendor was trying to crunch into already to be missed. Then, after some initial quantity of units are delivered ("late"), Voldemort says "well, they're good, but we're too late to get them into this product cycle. We'll try again next time". Then they disappear for a year or so until the next gen is already late and has no time to cram in a component development...again. Meanwhile, you haven't been paid for any of the NRE you expended the first cycle...but you shouldn't care about that because you should just be happy that you are privileged to work with such a prestigious and well known name like "Voldemort" (just don't tell anybody his name).

Well...you can see how most companies wouldn't want to do business with Voldemort anymore after being burned once or twice. I have no idea what their internal developments look like, but they are set up in a way that all but guarantees their vendors get hosed. Sometimes I think they just try to tie up people from working with their competitors. Of course this is definitely just my opinion about a company called Voldemort I've worked with before and not about "Apple". I'm not grumpy about it though...definitely not lol
 
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Very...uh...bold claim that a 50% increase in thermal power leads to a 50% increase in performance. I still can't figure out if this cooling system has any real advantages. Other than that a very limited number of commenters are willing to own it. I wonder if the ultrasound isn't harmful by accelerating material fatigue. And what about ultrasound influence on human health?
 
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Not that anybody is allowed to admit working with Apple (and if you do work with them you're not allowed to say their name)...so, let's just say I've worked with a company called "Voldemort" before...well from my experience, what that company would do with new tech like this is wait until their next gen Voldemort product is about 90% developed, then assign an internal group to drive a vendor like Frore to develop a version for said product (knowing it's almost definitely impossible all along).

They'd give them about 1/4-1/2 of the necessary time to develop a good solution, say "you need to give us x# of sample units so we can confirm it works as needed before we'll pay you, then we'll buy tons of these, promise!", then change the requirements during said short development time several times...causing that short window of time which the vendor was trying to crunch into already to be missed. Then, after some initial quantity of units are delivered ("late"), Voldemort says "well, they're good, but we're too late to get them into this product cycle. We'll try again next time". Then they disappear for a year or so until the next gen is already late and has no time to cram in a component development...again. Meanwhile, you haven't been paid for any of the NRE you expended the first cycle...but you shouldn't care about that because you should just be happy that you are privileged to work with such a prestigious and well known name like "Voldemort" (just don't tell anybody his name).

Well...you can see how most companies wouldn't want to do business with Voldemort anymore after being burned once or twice. I have no idea what their internal developments look like, but they are set up in a way that all but guarantees their vendors get hosed. Sometimes I think they just try to tie up people from working with their competitors. Of course this is definitely just my opinion about a company called Voldemort I've worked with before and not about "Apple". I'm not grumpy about it though...definitely not lol
Sounds like that Voldemort did some similar stuff to team blue as well surrounding modems and it might clear up some stuff about them and team green too if one speculates a bit.
 

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I still can't figure out if this cooling system has any real advantages.
Besides being small enough to fit even in a phone? It's quiet AF: nearly inaudible at full power.
It's scaled by simple stacking, which is also a con which makes me doubt it'll ever be used in high-power devices.
I wonder if the ultrasound isn't harmful by accelerating material fatigue. And what about ultrasound influence on human health?
That's a bit of a stretch for a tiny 1W device. Technically your VRM in on GPU/Motherboard/Laptop/TV also generates ultrasound. Though I don't see anyone complaining or ringing a health scare bell.
.bold claim that a 50% increase in thermal power leads to a 50% increase in performance.
I think you misread the slide. They meant the performance of a cooling system (since that's what this is about), and not the performance of the CPU.
 
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If these were available(amazon, new-egg, best buy), I'd get one for the M2 behind the video card.

Frore could sell a lot of these.
 
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