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Hynix A or M die for "futureproofed" AM5 build?

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Searching the interwebs for DDR5 memory advice I've seen most people recommend modules using Hynix chips (and surprisingly recommend staying away from Micron, apparently :eek:). However, there seems to be a difference of opinion on whether Hynix A or M dice are the better choice. Apparently, A dice can clock higher while M dice have tighter timings.

Since current AMD CPUs cannot use higher clocked RAM as well as Intel ones, many people recommend going with M dice for AM5. But what about future AM5 CPUs (for instance Zen6/"Medusa")? Would it not make sense to prefer A dice, since Zen5 already has somewhat better memory support (as far as the current IO die can handle it) and Zen6 is sure to greatly improve on that, considering it'll get a brand new IO die?

I'm looking for memory that'll serve me well now, and, hopefully, even better once Zen6 comes around. Bonus question: Is A or M the newest iteration?
 

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Whats wrong with the micron chips?

 
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Whats wrong with the micron chips?

The general consensus seems to be that Hynix is best and Micron is worst for DDR5, with Samsung somewhere in the middle. I bet for stock JEDEC speeds it's probably a toss-up.
 

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More like splitting hairs than anything

Go with what fits your budget and roll with it
 
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Depends on the motherboard. AMD is perfectly capable of high memory frequency otherwise. That's where A/M-die is desired. 8000mt/s ranges.
 
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Depends on what speeds you're trying to hit. If you want the highest speeds, get the 24gb m dies, some call it v2 m dies. If you want the tightest timings up to 8200mt/s, get a highly binned a die.

My suggestion would be the 24gb m dies, as you get 1.5x more capacity and slightly higher speed ceiling at the expense of slightly looser timings which don't make too much of a difference unless you're chasing records
 

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Searching the interwebs for DDR5 memory advice I've seen most people recommend modules using Hynix chips (and surprisingly recommend staying away from Micron, apparently :eek:). However, there seems to be a difference of opinion on whether Hynix A or M dice are the better choice. Apparently, A dice can clock higher while M dice have tighter timings.

Since current AMD CPUs cannot use higher clocked RAM as well as Intel ones, many people recommend going with M dice for AM5. But what about future AM5 CPUs (for instance Zen6/"Medusa")? Would it not make sense to prefer A dice, since Zen5 already has somewhat better memory support (as far as the current IO die can handle it) and Zen6 is sure to greatly improve on that, considering it'll get a brand new IO die?

I'm looking for memory that'll serve me well now, and, hopefully, even better once Zen6 comes around. Bonus question: Is A or M the newest iteration?

Who has been recommending 16Gb M over 16Gb A-die?? :confused: just get 16A unless there's some kind of fire sale on 16M, it's 2025

24Gb M-die would be my choice since it is pretty much the equivalent of 16Gb A-die yet gives you access to the 48GB capacities.
 

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16GB A-Die will give you the lowest timings possible if you are willing to do some manual adjustments.

24GB all have higher tRFC which is higher latency . For AMD that equals lower performance. Easy fix if you just type in the 16GB tRFC values instead.

Is the op looking for best out of box performance (set EXPO and forget) or something a little extra on the side.
 
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16GB A-Die will give you the lowest timings possible if you are willing to do some manual adjustments.

24GB all have higher tRFC which is higher latency . For AMD that equals lower performance. Easy fix if you just type in the 16GB tRFC values instead.

Is the op looking for best out of box performance (set EXPO and forget) or something a little extra on the side.
Fully tuned, a die still has a trfc advantage. In reality, with a maxed out 65k tref, it doesn't matter all that much in the end and 24g is still the one to get.
 
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The general consensus seems to be that Hynix is best and Micron is worst for DDR5, with Samsung somewhere in the middle. I bet for stock JEDEC speeds it's probably a toss-up.
Yeah for JEDEC speeds its never going to matter. For OCing or EXPO just forget about Micron entirely.
 

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My first set is a pair of A-Die to get me running, next set will be 2R M-Die I reckon.

Have to see how my first set runs first though..
 
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Yeah for JEDEC speeds its never going to matter. For OCing or EXPO just forget about Micron entirely.

The way I conceptualize it is to remember Micron can't make 20gbps GDDR6. Their chips can't overclock to hit 20gbps.
If you translate the difference from NRZ to PAM4, this is still true for GDDR6x. If you translate from NRZ to PAM3, this is true for GDDR7.
Samsung/Hynix ofc offer 20/40gbps. This translates elsewhere.

Their current manufacturing lines are similar to the 'older' hynix/samsung manufacturing lines.

I don't know if Samsung is so bad, as much as they don't bin their chips very well (the way they do it is kind of odd).
Hynix is much more consistent imho, and this translates into their system DRAM offerings being preferred for that reason.

I also think Hynix is generally cheaper than Samsung. Micron is very cheap, but just not on the same level.
They're good for keeping prices in-check though, given we've had price-fixing in the past.
 
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16GB A-Die will give you the lowest timings possible if you are willing to do some manual adjustments.

24GB all have higher tRFC which is higher latency . For AMD that equals lower performance. Easy fix if you just type in the 16GB tRFC values instead.

Is the op looking for best out of box performance (set EXPO and forget) or something a little extra on the side.
Could say that I have tried to reduce the tRFC and tRAS values on my 24Gb M-die to something apparently stable and close to A-die values, which did not give sufficiently visible performance increases for my current uses, and caused crashes on weekly basis. Running stock A-XMP with a little less voltage at least mostly cured the crashes.

Yep, I've had enough RAM tuning for the moment.
 

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My first set is a pair of A-Die to get me running, next set will be 2R M-Die I reckon.

Have to see how my first set runs first though..

96GB :love:

I stick to 50k tREFI anyways, so I would love to get my hands on an extra 32GB of capacity
 

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Yeah for JEDEC speeds its never going to matter. For OCing or EXPO just forget about Micron entirely.
What's the reason? I mean I provided a link for their oc line which iirc is what xmp/docp/expo do via spd tables installed on the modules.

Also there is Mushkin
 
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96GB :love:

I stick to 50k tREFI anyways, so I would love to get my hands on an extra 32GB of capacity
96GB may sound like a lot, and to be honest is a lot, but it does feel even more helpless when you have the workload to fill it all up and then ask for more. :roll:

Plus currently there are limits on more than tREFI compared to 64GB, though whether it matters all that much in real world is debatable.

I wonder what 128GB would be like, when and if 32Gb chips roll out.
 

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I just want the 9900/9950X3D to be released so I can make my choice so I can try my ram.. I almost bought a 9900X today but I don't want to kick myself later.
 
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It's hard to say because no one knows what Zen 6's Memory controller will be able to handle, or what speeds Zen 6's IF will run. I don't know if CU-DIMMs will be the next 'have to buy thing' for Zen 6. Don't know until we get there, which is a long way away.

24GB DIMMs seem to typically be M-dies and 16GB or 32GB DIMMs seem to typically be A-dies. Memory prices will most likely be different when late 2026/early 2027 comes around than they are today. Paying more for higher spec memory today might not pan out in two years.
 

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24GB DIMMs seem to typically be M-dies and 16GB or 32GB DIMMs seem to typically be A-dies. Memory prices will most likely be different when late 2026/early 2027 comes around than they are today. Paying more for higher spec memory today might not pan out in two years.
24GB DIMM can only be Micron or Hynix 24Gbit M-De.

16 and 32 DIMM can be a number of things. Even 16Gbit M-Die.

Anyways I agree with you about not knowing what the future holds. I would buy for the current platform.
 
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Thank you all for your input. It's made me quite a bit more enlightened.

The choice I need to make is actually between 16Gb A or 24Gb M. Wasn't aware that 16Gb M even existed.

So with 24Gb M being more or less equal to 16Gb A it seems to come down to if I want to have 64GB or 96GB in my new build. Either 2x 32GB A or 2x 48GB M (50% more RAM at 50% higher price). Decisions, decisions...
 
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For futureproofing I would go 16gb A-die or 24gb M-die. They can both do 8000+, M-die can do 10000+. No ram from Micron or Samsung can to my knownledge di that atm. Hynix 16gb M can only do 7000-7600. Samsung and Micron do 5600-7600 max with worse timings than Hynix.
 
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Got another, related, question for you guys. Is memory from v-color any good? They have some very tasty kits. Although not sure if the highest-binned ones are worth the markup.
 
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Got another, related, question for you guys. Is memory from v-color any good? They have some very tasty kits. Although not sure if the highest-binned ones are worth the markup.
I'm sure they're fine. I like Team simply bc they have decent settings programmed and are usually pretty cheap for their bins. Also, I remember their origin back in the day and their rep on XS. Nostalgia ftw.

I haven't kept up if there's a 'very particular kit' that's all the rage these days. I stopped doing that when OCZ got out of the biz. Now I just make sure the bin/chips are what I want.

GLHF.
 
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