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Intel Reports Second-Quarter 2023 Financial Results, Foundry Services Business up

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Intel Corporation today reported second-quarter 2023 financial results. "Our Q2 results exceeded the high end of our guidance as we continue to execute on our strategic priorities, including building momentum with our foundry business and delivering on our product and process roadmaps," said Pat Gelsinger, Intel CEO. "We are also well-positioned to capitalize on the significant growth across the AI continuum by championing an open ecosystem and silicon solutions that optimize performance, cost and security to democratize AI from cloud to enterprise, edge and client."

David Zinsner, Intel CFO, said, "Strong execution, including progress towards our $3 billion in cost savings in 2023, contributed to the upside in the quarter. We remain focused on operational efficiencies and our Smart Capital strategy to support sustainable growth and financial discipline as we improve our margins and cash generation and drive shareholder value." In the second quarter, the company generated $2.8 billion in cash from operations and paid dividends of $0.5 billion.



Business Unit Summary
Intel previously announced the organizational change to integrate its Accelerated Computing Systems and Graphics Group into its Client Computing Group and Data Center and AI Group. This change is intended to drive a more effective go-to-market capability and to accelerate the scale of these businesses, while also reducing costs. As a result, the company modified its segment reporting in the first quarter of 2023 to align to this and certain other business reorganizations. All prior-period segment data has been retrospectively adjusted to reflect the way the company internally receives information and manages and monitors operating segment performance starting in fiscal year 2023.



Business Highlights
  • ▪ Intel remains on track to meet its goal of achieving five nodes in four years and to regain transistor performance and power performance leadership by 2025. The company announced an industry-first implementation of backside power using Intel PowerVia in a test chip, resulting in notable performance and efficiency gains. PowerVia will be incorporated into Intel 20A, expected to launch in the first half of 2024.
  • IFS announced that Boeing and Northrop Grumman have committed to joining the U.S. Department of Defense's RAMP-C program, led by Intel. The program is intended to assure domestic access to next-generation semiconductors by establishing and demonstrating a U.S.-based foundry ecosystem to develop and fabricate chips on Intel 18A.
  • DCAI announced the general availability of cloud instances of its 4th Gen Intel Xeon Scalable processors by Google Cloud. In addition, Intel's AI acceleration capabilities were recognized through third-party validation from MLCommons, which published MLPerf Training performance benchmark data showing that 4th Gen Xeon and Habana Gaudi 2 are two compelling, open alternatives in the AI market that compete on both performance and price. This follows Intel's recent collaboration with Boston Consulting Group to deliver enterprise-grade, secure generative AI to customers leveraging Intel's Gaudi and 4th Gen Xeon offerings.
  • In CCG, Intel continued to see strong demand for its 13th Gen Intel Core processor family, with more than 300 designs expected from OEM partners this year. It also announced a collaboration with Microsoft to drive the development of AI on personal computing, and previewed AI-enabled capabilities of Intel's upcoming Meteor Lake client PC processors at Microsoft's Build 2023 conference. In addition, Intel introduced the Intel Arc Pro A60 and Pro A60M as new members of the Intel Arc Pro A-series professional range of graphics processing units (GPUs).
  • For NEX, Intel, Ericsson and HPE successfully demonstrated the industry's first vRAN solution running on the 4th Gen Intel Xeon Scalable processor with Intel vRAN Boost. Intel also recently completed an agreement with Ericsson to partner broadly on its next-generation optimized 5G infrastructure, under which Ericsson will utilize Intel's 18A process technology for its future custom 5G SoC. In addition, Intel and Ericsson will expand the collaboration announced at Mobile World Congress 2023 to accelerate industry-scale open RAN utilizing standard Intel Xeon-based platforms as telcos transform to a foundation of programmable, software-defined infrastructure.
  • Mobileye continued to generate strong profitability in the second quarter and demonstrated traction with its advanced product portfolio by announcing a SuperVision eyes-on, hands-off design win with Porsche and a mobility-as-a-service collaboration with Volkswagen Group that will soon begin testing.
Intel continues to strategically invest in manufacturing capacity to further advance IDM 2.0, and during the quarter announced the selection of Wrocław, Poland, as the site of a new cutting-edge semiconductor assembly and test facility. This facility, in which Intel expects to invest as much as $4.6 billion, will help meet critical demand for assembly and test capacity that Intel anticipates by 2027. Additionally, Intel and the German federal government signed a revised letter of intent for Intel's planned leading-edge wafer fabrication site in Magdeburg, Germany. The agreement encompasses Intel's expanded investment in the site, now expected to be more than 30 billion euros for two first-of-a-kind semiconductor facilities in Europe, along with increased government support that includes incentives. Together, these investments represent a major step toward a balanced and resilient supply chain for Europe.

Intel also agreed to sell an approximately 20% stake in its IMS Nanofabrication GmbH business to Bain Capital Special Situations in a transaction that values IMS at approximately $4.3 billion. This investment will position IMS to capture the significant market opportunity for multi-beam mask writing tools, which are critical to the semiconductor ecosystem for enabling EUV (extreme ultraviolet lithography) technology, by accelerating innovation and enabling deeper cross-industry collaboration.

Q3 2023 Dividend
The company announced that its board of directors declared a quarterly dividend of $0.125 per share on the company's common stock, which will be payable on Sept. 1, 2023, to shareholders of record as of Aug. 7, 2023.

Business Outlook
Intel's guidance for the third quarter of 2023 includes both GAAP and non-GAAP estimates. Reconciliations between GAAP and non-GAAP financial measures are included below.



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Q2 2023 was expected to be as bad as the last quarter, when Intel recorded its biggest ever quarterly loss. So the return to profitability is unexpected even though the decline since last year continues. Within its $6.780 billion Client Computing Group income the desktop sector actually increased to $2.370 billion against $2.289 billion a year ago. Notebook and laptop CPU sales were down from $4.751 billion to $3.896 billion and Other (desktop graphics, NUC) also down from $638 million to $514 million. In its other sectors Intel continues to struggle and the rest of the year could be difficult.
 
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Now we wait for AMD's results to see if the market is turning, or Intel winning back lost market.
 
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Date for AMD's Q2 2023 results expected to be the first of August so not long now.
Yes I know. AMD follows Intel's financial results usually 2 days latter. We have weekend, so it goes a few days latter. Usually Intel announces Tuesday, AMD Thursday.
I think it was one time a couple years ago where AMD had announced results before Intel. But that happened only once.
Nvidia usually is about 20-30 days latter than these two.
 
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