Is there potential for AMD to change the world with this x3D technology combined with gallium cooling techniques?

[Space Lynx]

I was reading this article here, and it seems really interesting.

Startup wants to use lasers to cool chips in a weirdly precise way

That startup is Maxwell Labs, which has been collaborating with researchers from Sandia National Labs on a cutting-edge cooling method that precisely targets heat buildups using focused...

www.techspot.com

The article specifically mentions 3D stacking designs would need to be implemented, and that this is very difficult to do. Doesn't AMD already have a lot of experience doing this, so they could technically lead the way on an innovative chip design like this? Should be a piece of cake for AMD no?

From the article:
Then there's the challenge of integrating GaAs components with traditional silicon chips, likely requiring advanced 3D chip stacking and bonding techniques. It's not impossible – just currently too complex and costly with today's technology.

 

[tabascosauz]

The article specifically mentions 3D stacking designs would need to be implemented, and that this is very difficult to do. Doesn't AMD already have a lot of experience doing this, so they could technically lead the way on an innovative chip design like this? Should be a piece of cake for AMD no?

Can't treat 2.5D/3D packaging as a monolithic thing......Vcache is a tiny drop in sea of novel packaging. Just because SoIC is great for Vcache that doesn't mean it really works for other things. And it's TSMC that's coming up with these methods, AMD merely came up with a design that leveraged it.

I don't think you read further down into the article, it's talking about 3D stacking the GaAs plates used in the novel cooling idea, together with regular silicon dies. GaAs is a semiconductor but it isn't silicon, it isn't a thing in consumer processors now, and it isn't cheap. Full 3D packaging for regular silicon is tough enough already.

So unless you or AMD suddenly stumbled upon Raytheon level wealth......

 

[Space Lynx]

Can't treat 2.5D/3D packaging as a monolithic thing......Vcache is a tiny drop in sea of novel packaging. Just because SoIC is great for Vcache that doesn't mean it really works for other things. And it's TSMC that's coming up with these methods, AMD merely came up with a design that leveraged it.

I don't think you read further down into the article, it's talking about 3D stacking the GaAs plates used in the novel cooling idea, together with regular silicon dies. GaAs is a semiconductor but it isn't silicon, it isn't a thing in consumer processors now, and it isn't cheap. Full 3D packaging for regular silicon is tough enough already.

So unless you or AMD suddenly stumbled upon Raytheon level wealth......

I read the entire article, I don't understand all of it though, which is why I asked a question here.

Well, AMD may indeed get that level of wealth someday... none the less this is interesting to contemplate.

 

[tabascosauz]

I read the entire article, I don't understand all of it though, which is why I asked a question here.

Well, AMD may indeed get that level of wealth someday... none the less this is interesting to contemplate.

Gallium arsenide ≠ gallium from liquid metal

Think telecoms and AESA radars