NVIDIA Revises "Blackwell" Architecture Production Roadmap for More Complex Packaging

[AleksandarK]

According to a well-known industry analyst, Ming-Chi Kuo, NVIDIA has restructured its "Blackwell" architecture roadmap, emphasizing dual-die designs using CoWoS-L packaging technology. The new roadmap eliminates several single-die products that would have used CoWoS-S packaging, changing NVIDIA's manufacturing strategy. The 200 Series will exclusively use dual-die designs with CoWoS-L packaging, featuring the GB200 NVL72 and HGX B200 systems. Notably absent is the previously expected B200A single-die variant. The 300 Series will include both dual-die and single-die options, though NVIDIA and cloud providers are prioritizing the GB200 NVL72 dual-die system. Starting Q1 2025, NVIDIA will reduce H series production, which uses CoWoS-S packaging, while ramping up 200 Series production. This transition indicates significantly decreased demand for CoWoS-S capacity through 2025.

While B300 systems using single-die CoWoS-S are planned for 2026 mass production, the current focus remains on dual-die CoWoS-L products. From TSMC's perspective, the transition between Blackwell generations requires minimal process adjustments, as both use similar front-end-of-line processes with only back-end-of-line modifications needed. Supply chain partners heavily dependent on CoWoS-S production face significant impact, reflected in recent stock price corrections. However, NVIDIA maintains this change reflects product strategy evolution rather than market demand weakness. TSMC continues expanding CoWoS-R capacity while slowing CoWoS-S expansion, viewing AI and high-performance computing as sustained growth drivers despite these packaging technology transitions.



View at TechPowerUp Main Site | Source

 

[mamisano]

For those that were wondering, you can find technical info on CoWoS-S and CoWoS-L at the following TSMC site: https://3dfabric.tsmc.com/english/dedicatedFoundry/technology/cowos.htm