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Rambus Inc., one of the world's premier technology licensing companies specializing in high-speed memory architectures, today announces the implementation of its award-winning XDR memory architecture using an ultra low-cost LQFP package. In a paper to be presented at DesignCon, Rambus will discuss the benefits of differential signaling delivering high memory bandwidth in a cost-effective package, ideal for consumer electronics such as set-top boxes and HDTVs.
"Today's consumer electronics require high bandwidth and low-cost manufacturability," said Martin Scott, senior vice president of Research and Technology Development at Rambus. "Our team has demonstrated that the superior signal integrity of the XDR memory architecture, which enables the highest data rates of any DRAM technology, also makes possible high-speed operation in very low-cost device packaging."
To showcase the capability of its XDR memory architecture to operate at multi-gigabit data rates in an ultra low-cost package, Rambus has implemented an XDR memory controller in an LQFP package that can operate reliably at data rates of up to 3.2Gbps. Rambus will demonstrate this achievement at DesignCon (booth #205). The paper titled, Feasibility of Multi-Gigabit Memory Interface in LQFP Packages, will be presented at DesignCon on February 4, 2009 and will be available on http://www.rambus.com.
View at TechPowerUp Main Site
"Today's consumer electronics require high bandwidth and low-cost manufacturability," said Martin Scott, senior vice president of Research and Technology Development at Rambus. "Our team has demonstrated that the superior signal integrity of the XDR memory architecture, which enables the highest data rates of any DRAM technology, also makes possible high-speed operation in very low-cost device packaging."
To showcase the capability of its XDR memory architecture to operate at multi-gigabit data rates in an ultra low-cost package, Rambus has implemented an XDR memory controller in an LQFP package that can operate reliably at data rates of up to 3.2Gbps. Rambus will demonstrate this achievement at DesignCon (booth #205). The paper titled, Feasibility of Multi-Gigabit Memory Interface in LQFP Packages, will be presented at DesignCon on February 4, 2009 and will be available on http://www.rambus.com.
View at TechPowerUp Main Site