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Sheetak is expanding their flagship CENTUM product line, based on newly patented thermoelectric device structures, that offer the highest temperature difference with significant increases to cooling power and COP. These new trailblazing CENTUM C3 chips are now available for sample orders. High-volume manufacturing will start in Q2 2023 at Sheetak's Austin facility.
CENTUM C3 chips have been characterized, using standard thermoelectric testing methods, and demonstrate significant increases in maximum temperature differentials, cooling power, and efficiency (COP). The new chips attain temperature differentials more than 115°C for 2-stage coolers with hot-side at 50°C, and more than 160°C for 4-stage devices. The performance and cost metrics are unchallenged by other commercially available products.
"The new multistage architecture allows for the highest performing multistage product in the market," says Dr. Uttam Ghoshal, President and CEO. "Multistage coolers have been limited in cooling power and maximum temperature difference with existing designs and assembly methods. This new device structure allows for the highest performing multistage products and is designed for automated mass-production when compared to thermoelectric devices currently in the market."
"Sheetak's CENTUM C3 Chips will improve the system thermal performance and cost in various applications such as electronics, cold chain, mobile refrigeration, medical freezers, LiDAR, CMOS and other vision systems," says Brandon Noska, Director of Product Management and Sales. "We are excited to bring this new technology to the market."
The CENTUM C3 Chips and technology, structures, and methods and the ability to increase cooling performance are covered under "Thermoelectric Device Structures" (US 11,462,669 B2 by the United States Patent and Trademark Office). More details about the patent can be found at https://bit.ly/SheetakUS11462669B2.
View at TechPowerUp Main Site | Source
CENTUM C3 chips have been characterized, using standard thermoelectric testing methods, and demonstrate significant increases in maximum temperature differentials, cooling power, and efficiency (COP). The new chips attain temperature differentials more than 115°C for 2-stage coolers with hot-side at 50°C, and more than 160°C for 4-stage devices. The performance and cost metrics are unchallenged by other commercially available products.
"The new multistage architecture allows for the highest performing multistage product in the market," says Dr. Uttam Ghoshal, President and CEO. "Multistage coolers have been limited in cooling power and maximum temperature difference with existing designs and assembly methods. This new device structure allows for the highest performing multistage products and is designed for automated mass-production when compared to thermoelectric devices currently in the market."
"Sheetak's CENTUM C3 Chips will improve the system thermal performance and cost in various applications such as electronics, cold chain, mobile refrigeration, medical freezers, LiDAR, CMOS and other vision systems," says Brandon Noska, Director of Product Management and Sales. "We are excited to bring this new technology to the market."
The CENTUM C3 Chips and technology, structures, and methods and the ability to increase cooling performance are covered under "Thermoelectric Device Structures" (US 11,462,669 B2 by the United States Patent and Trademark Office). More details about the patent can be found at https://bit.ly/SheetakUS11462669B2.
View at TechPowerUp Main Site | Source
