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SolidRun has announced the world's first rugged system design that combines 8-core AMD Ryzen 7040 series processors with multiple Hailo-8 AI accelerators to create its Bedrock R7000 Edge AI for artificial intelligence (AI) applications. This new member in SolidRun's Bedrock family of fanless modular industrial PCs is specifically designed to meet demanding vision-based situational awareness in harsh environments.
The new system integrates with the AMD Ryzen 7840HS processor, a state-of-the-art 4 nm APU with 8C/16T Zen 4 CPU and integrated RDNA 3 Radeon 780M GPU. The 20 native PCIe Gen 4 lanes and up to three Hailo-8 AI accelerators can be fully utilized together with NVMe Gen4x4 storage, dual 2.5 Gbit Ethernet and 4x4K displays. The CPU and all devices are passively cooled by the innovative fanless cooling system of the Bedrock R7000 in an industrial temperature range of -40°C to 85°C.
Demand for such high-performance Edge AI box-PCs is growing in all segments of the embedded market, including Industry 4.0, robotics, autonomous guided vehicles, healthcare, transportation, smart cities, retail, agriculture, defense, and utility.
"Efficiency and scalability are key factors in advanced edge AI," said Irad Stavi, IPC Product Line Manager at SolidRun. "Bedrock R7000 stands out as the first fanless IPC based on the ultra-efficient AMD Ryzen 7040 processor and the innovative modular design which enables out-of-the-box integration of 3 Hailo-8 AI accelerators, each with 26 Tera Operations per Second (TOPS), or even more with a simple customization."
"An important feature of Hailo-8 AI accelerator and Hailo AI Software Suite is linear scaling of the inference performance simply by adding modules," said Dima Caplan, Product Manager at Hailo. "SolidRun's new Edge AI platform exhibits ample system resources which enable high AI performance at perfect scaling."
Bedrock R7000 features
The Bedrock R7000 is equipped with an AMD Ryzen 7 7840HS / 7840U processor, featuring 8 cores and 16 threads running at up to 5.1 GHz based on the AMD Zen 4 4 nm microarchitecture that also integrates the AMD Radeon 780M GPU with up to 12 CUs @ 2700 MHz. CPU power can be precisely adjusted in BIOS in an extremely wide range between 8 W - 54 W.
For Edge AI workloads, up to 3 Hailo-8 AI accelerators can be installed with combined inferencing performance of up to 78 TOPS.
RAM and storage are modular with 2x SODIMMs supporting 64 GB DDR5 ECC/non-ECC, and 3 NVMe 2280 PCIE Gen4x4 devices, including enterprise-grade NVMe with power loss protection (PLP). RAM and storage are conduction-cooled for reliable operation at extreme temperatures.
I/O includes 4 displays comprising HDMI 2.1 + 3x DP 2.1, dual 2.5 Gbit Ethernet (Intel I226), optional WiFi 6E + BT 5.3, 5G or LTE modem, 4 USB 3.2 ports and a console port. All I/O is conveniently organized on a single face to simplify integration.
Bedrock R7000 supports all major PC operating systems, including most Linux distributions, Windows Desktop, Server and IoT.
Power, mechanical and thermal design
Bedrock R7000 electronic design is modular, SoM based. Power input is by a dedicated interchangeable module for supporting various deployment use cases. The default PM 1260 supports a wide voltage range of 12 V to 60 V.
The enclosure is made of heavy-duty machined aluminium with an anodized finish. It is offered in 3 variants - 1.0 liter enclosure for dissipating up to 30 W by convection, 1.6 liter for 60 W and an 0.6 liter "Tile" variant for conduction cooling. The enclosure is ideal for DIN-Rail mounting with a specially designed zero-force locking bracket.
Bedrock R7000 fanless design can handle up to 60 W, which is over 3 times the cooling capacity of typical fanless PCs of similar size. Cooling innovations include liquid metal TIM, 360º stacked heat pipes, dual-layer chimney effect heat exchanger and thermal coupling of all internal devices.
The system operates reliably at a temperature range of -40°C to 85°C.
Specifications
For more information about the SolidRun Bedrock R7000 and its feature set please visit: www.solid-run.com/fanless-computers/bedrock-r7000/
View at TechPowerUp Main Site | Source
The new system integrates with the AMD Ryzen 7840HS processor, a state-of-the-art 4 nm APU with 8C/16T Zen 4 CPU and integrated RDNA 3 Radeon 780M GPU. The 20 native PCIe Gen 4 lanes and up to three Hailo-8 AI accelerators can be fully utilized together with NVMe Gen4x4 storage, dual 2.5 Gbit Ethernet and 4x4K displays. The CPU and all devices are passively cooled by the innovative fanless cooling system of the Bedrock R7000 in an industrial temperature range of -40°C to 85°C.
Demand for such high-performance Edge AI box-PCs is growing in all segments of the embedded market, including Industry 4.0, robotics, autonomous guided vehicles, healthcare, transportation, smart cities, retail, agriculture, defense, and utility.
"Efficiency and scalability are key factors in advanced edge AI," said Irad Stavi, IPC Product Line Manager at SolidRun. "Bedrock R7000 stands out as the first fanless IPC based on the ultra-efficient AMD Ryzen 7040 processor and the innovative modular design which enables out-of-the-box integration of 3 Hailo-8 AI accelerators, each with 26 Tera Operations per Second (TOPS), or even more with a simple customization."
"An important feature of Hailo-8 AI accelerator and Hailo AI Software Suite is linear scaling of the inference performance simply by adding modules," said Dima Caplan, Product Manager at Hailo. "SolidRun's new Edge AI platform exhibits ample system resources which enable high AI performance at perfect scaling."
Bedrock R7000 features
The Bedrock R7000 is equipped with an AMD Ryzen 7 7840HS / 7840U processor, featuring 8 cores and 16 threads running at up to 5.1 GHz based on the AMD Zen 4 4 nm microarchitecture that also integrates the AMD Radeon 780M GPU with up to 12 CUs @ 2700 MHz. CPU power can be precisely adjusted in BIOS in an extremely wide range between 8 W - 54 W.
For Edge AI workloads, up to 3 Hailo-8 AI accelerators can be installed with combined inferencing performance of up to 78 TOPS.
RAM and storage are modular with 2x SODIMMs supporting 64 GB DDR5 ECC/non-ECC, and 3 NVMe 2280 PCIE Gen4x4 devices, including enterprise-grade NVMe with power loss protection (PLP). RAM and storage are conduction-cooled for reliable operation at extreme temperatures.
I/O includes 4 displays comprising HDMI 2.1 + 3x DP 2.1, dual 2.5 Gbit Ethernet (Intel I226), optional WiFi 6E + BT 5.3, 5G or LTE modem, 4 USB 3.2 ports and a console port. All I/O is conveniently organized on a single face to simplify integration.
Bedrock R7000 supports all major PC operating systems, including most Linux distributions, Windows Desktop, Server and IoT.
Power, mechanical and thermal design
Bedrock R7000 electronic design is modular, SoM based. Power input is by a dedicated interchangeable module for supporting various deployment use cases. The default PM 1260 supports a wide voltage range of 12 V to 60 V.
The enclosure is made of heavy-duty machined aluminium with an anodized finish. It is offered in 3 variants - 1.0 liter enclosure for dissipating up to 30 W by convection, 1.6 liter for 60 W and an 0.6 liter "Tile" variant for conduction cooling. The enclosure is ideal for DIN-Rail mounting with a specially designed zero-force locking bracket.
Bedrock R7000 fanless design can handle up to 60 W, which is over 3 times the cooling capacity of typical fanless PCs of similar size. Cooling innovations include liquid metal TIM, 360º stacked heat pipes, dual-layer chimney effect heat exchanger and thermal coupling of all internal devices.
The system operates reliably at a temperature range of -40°C to 85°C.
Specifications
For more information about the SolidRun Bedrock R7000 and its feature set please visit: www.solid-run.com/fanless-computers/bedrock-r7000/
View at TechPowerUp Main Site | Source
