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STMicroelectronics and GlobalFoundries to advance FD-SOI ecosystem with new 300mm manufacturing facility in France

TheLostSwede

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STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and GlobalFoundries Inc., a global leader in feature-rich semiconductor manufacturing, today announced they have signed a Memorandum of Understanding to create a new, jointly-operated 300 mm semiconductor manufacturing facility adjacent to ST's existing 300 mm facility in Crolles, France. This facility is targeted to ramp at full capacity by 2026, with up to 620,000 300 mm wafer per year production at full build-out (~42% ST and ~58% GF).

ST and GF are committed to building capacity for their European and global customer base. This new facility will support several technologies, in particular FD-SOI-based technologies, and will cover multiple variants. This includes GF's market leading FDX technology and ST's comprehensive technology roadmap down to 18 nm, which are expected to remain in high demand for Automotive, IoT, and Mobile applications for the next few decades. FD-SOI technology has origins in the Grenoble (France) area. It has been part of ST technology and product roadmap in its Crolles facility since the early beginnings, and it was later enabled with differentiation and commercialized for manufacturing at GF's Dresden facility. FD-SOI offers substantial benefits for designers and customers, including ultra-low power consumption as well as easier integration of additional features such as RF connectivity, mmWave and security.




ST and GF will receive significant financial support from the State of France for the new facility. This facility will strongly contribute to the objectives of the European Chips Act, including the goal of Europe reaching 20% of worldwide semiconductor production by 2030. In addition to the sizeable, multi-year investment in advanced semiconductor manufacturing in Europe, it will support the leadership and resilience of the European technology ecosystems, from R&D (with the recently announced cooperation on R&D among ST, GF, CEA-Leti and Soitec) to large-volume manufacturing, and support European and global customers with additional capacity in complex, advanced technologies for key end-markets including automotive, industrial, IoT, and communication infrastructure. The new manufacturing facility will be a substantial contributor to global digital and green transformations - delivering key enabling technologies and products. It will generate additional employment at the ST Crolles site (approximately 1,000 additional staff for the new manufacturing facility) and across its ecosystem of partners, suppliers and stakeholders.

By working together, ST and GF will leverage the economies of scale at the Crolles site as they accelerate semiconductor capacity the world needs with high capital efficiency.

"This new manufacturing facility will support our $20 billion+ revenue ambition. Working with GF will allow us to go faster, lower the risk thresholds, and reinforce the European FD-SOI ecosystem. We will have more capacity to support our European and global customers as they transition to digitalization and decarbonization" said Jean-Marc Chery, President and CEO of STMicroelectronics. "ST is transforming its manufacturing base. We already have a unique position in our 300 mm wafer fab in Crolles, France which will be further strengthened by today's announcement. We continue to invest into our new 300 mm wafer fab in Agrate (near Milan, Italy), ramping up in H1 2023 with an expected full saturation by end 2025, as well as in our vertically integrated silicon carbide and gallium nitride manufacturing."

"Our customers are seeking broad access to 22FDX capacity for auto and industrial applications.

The new facility will include GF dedicated foundry capacity for our customers offering GF's unique innovation and will be managed by GF personnel onsite. This jointly operated, new manufacturing capacity expansion leverages ST's Crolles existing facility infrastructure enabling GF to accelerate our growth while benefiting from economies of scale to deliver additional capacity in a highly capital efficient manner on our differentiated 22FDX platform, that has shipped more than one billion chips. With today's announcement, we are expanding GF's presence within Europe's dynamic technology ecosystem and reinforcing our position as the leading semiconductor foundry in Europe," said Dr. Thomas Caulfield, CEO GF. "Our global footprint enables GF to not only meet our customers capacity needs but also provides them supply chain security. The partnership investment with the French government, along with our long-term customer agreements, creates the right economic model for GF's investment."

The project is subject to the execution of definitive agreements and various regulatory approvals, including from the European Commission's DG Competition, and to the completion of the consultation with ST's French Works Council.

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So many text that just confusing the main idea that's in the first paragraph: new 300mm wafer production facility.

Cool, there's no advantage having new fabs everywhere if there's no wafers for them to use.
 
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So many text that just confusing the main idea that's in the first paragraph: new 300mm wafer production facility.

Cool, there's no advantage having new fabs everywhere if there's no wafers for them to use.
No, GF and STM don't make wafers. Nobody makes wafers.

(I mean, Intel and TSMC and Samsung don't, so I'm sure that those two companies don't and won't, either. They all buy from specialized bakeries like Shin-Etsu, Sumco and GlobalWafers.)
 
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No, GF and STM don't make wafers. Nobody makes wafers.

(I mean, Intel and TSMC and Samsung don't, so I'm sure that those two companies don't and won't, either. They all buy from specialized bakeries like Shin-Etsu, Sumco and GlobalWafers.)

Hmm ok, i'll rephrase then: so many text and I wasn't able to understand shit

Why did they focus on the 300mm wafers on the beggining then!? Never ceases to amaze me how badly companies write some of these press releases ffs
 
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Hmm ok, i'll rephrase then: so many text and I wasn't able to understand shit

Why did they focus on the 300mm wafers on the beggining then!? Never ceases to amaze me how badly companies write some of these press releases ffs
Because 200mm are old tech in terms of wafer sizes, 300mm are current tech, 450mm has been on the Horizon for the past decade if not more but always seems to run into issues in roll out. It would be an AMAZING thing if it actually came to fruition in the long run.

For example on current 300mm wafers it is theoretically possible to get ~84 3090 dies minus any lost due to imperfections etc. 450mm for the same 3090 die would be over 200.

So as it will be this is most likely not going to be pushing the latest and greatest tech in terms of Fab equipment but the shortages we have heard in cars etc has not been on the lastest 3/5/6/7nm its been on the 14nm/20nm and greater. So it will alleviate issues in those supply chains. GlobakFoundries discontinued their pursuit of the latest and greatest tech migrating from 14nm and lower so I suspect this will be a 20/14nm plant.
 
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Hmm ok, i'll rephrase then: so many text and I wasn't able to understand shit

Why did they focus on the 300mm wafers on the beggining then!? Never ceases to amaze me how badly companies write some of these press releases ffs
Yeah, press releases that find their way to the TPU are often written for a very different public. For example, investors. They're supposed to understand sentences containing "billion", "investment", "capital efficient" and "global customers", not much more, and some of the rest may be intentionally unclear.
 
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