Raevenlord
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You certainly remember the whole controversy surrounding Intel's X299 platform VRM "disaster". As a surmise, this refers to what basically amounts to inadequate engineering in the VRM cooling components of some motherboards (from varied manufacturers) for Intel's latest HEDT X299 platform. The issue has been discussed frequently, and one of the most recognized voices initially calling out to this issue was overclocker prodigy Der8auer.
In a new video, overclocker Der8auer has basically made an anouncement to ASUS's impending VRM heatsink update for their X299 ROG Rampage VI Apex motherboard. The new design, which has added engineering hours behind it compared to the original solution, sports threaded fins to increase airflow through the VRM cooling block. Previously, this block was just that - a solid one - which didn't facilitate or take advantage of any airflow your case might offer. In addition, ASUS has also added mounting points for a small, dedicated fan for an increased cooling capacity. Also worth mentioning is the addition of a backplate behind the VRM area of the motherboard, so as to further increase heat dissipation. This redesign comes after ASUS contacted Der8auer directly for collaboration on the new heatsink design, taking input from the renowned overclocker towards the final instance of it.
View at TechPowerUp Main Site
![](https://www.techpowerup.com/img/x8q5abRsPM4IYcs1_thm.jpg)
![](https://www.techpowerup.com/img/LGnYVunsabViRtPS_thm.jpg)
![](https://www.techpowerup.com/img/eKXyd9FZ1lhoWtRe_thm.jpg)
In a new video, overclocker Der8auer has basically made an anouncement to ASUS's impending VRM heatsink update for their X299 ROG Rampage VI Apex motherboard. The new design, which has added engineering hours behind it compared to the original solution, sports threaded fins to increase airflow through the VRM cooling block. Previously, this block was just that - a solid one - which didn't facilitate or take advantage of any airflow your case might offer. In addition, ASUS has also added mounting points for a small, dedicated fan for an increased cooling capacity. Also worth mentioning is the addition of a backplate behind the VRM area of the motherboard, so as to further increase heat dissipation. This redesign comes after ASUS contacted Der8auer directly for collaboration on the new heatsink design, taking input from the renowned overclocker towards the final instance of it.
View at TechPowerUp Main Site
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