Go ahead, but I'll let you know that my 7900XT has been showing some level of 21-23C from day one between hotspot and the rest and its really quite fine like that. Only on a max board TDP OC will the hotspot run over 100C. And its way into inefficiency territory like that, noisy... just not pleasant overall to really use like that.
There is a minor risk you fumble your job in some way, overtighten something, ESD shock your gear, etc. Every time you fiddle with hardware.
I say this because I've done my share of successful and failure tweaks and cleaning jobs, and the reality is, you really don't need to touch that thermal application at all, if the initial one was OK. Don't fix what ain't broken, because you can indeed break something along the way. Most people that have to ask here whether they should, shouldn't.
I've had a GTX 1080 run for a whoppin 6,5 years with just a few times of blowing air through the thing to get dust out. No paste involved. And it has been running for almost a year now with its new owner... still doing what it has always done, flawlessly. That's >7 years on one paste job.
That being said... PTM is a great upgrade and will definitely get those temps improved. Its on my bucket list too. But I'll do it way after the warranty term has expired, and the extra performance from an OC is actually going to make a dent somewhere. The far better way to run RDNA3 though is slightly undervolted (some -0,025-0,050 mv) and clock capped at around 2500mhz. Efficient, silent, perfectly stable and at virtually 100% perf - and a bit more in the applications that matter most (RT enabled generally reduces clocks and will still make the GPU go all out).
