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Wizmax Micronics PC Cooling at CES: MA Frigate and MA Falcon CPU Coolers, Warp Shield Heatsinks

btarunr

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Wizmax by Micronics introduced a handful new CPU coolers and purpose-build heatsinks at the 2023 International CES. The CPU cooler lineup is led by the MA Frigate series. The MA4 Frigate, a thick single aluminium fin-stack tower-type cooler. Five 6 mm-thick copper heatpipes make direct contact with the CPU at the base, conveying heat through a thick aluminium fin-stack, which is ventilated by a custom-design 130 mm fan. With this fan in place, the cooler measures 132 mm x 95 mm x 156.4 mm (WxDxH), weighing 990 g. The fan turns at speeds of up to 1,500 RPM, pushing up to 71.7 CFM of airflow at 1.9 mm H₂O static-pressure. The MA4 Frigate is rated for handling thermal loads of up to 210 W.

The Wizmax MA6 Frigate is the larger sibling, with a type-D dual fin-stack design. Six 6 mm-thick nickel-plated copper heatpipes make indirect contact with the CPU through a copper base, conveying heat to two fin-stacks, which are ventilated by a pair of 140 mm fans in push-pull arrangement. One-third of the fins in the two fin-stacks are made of copper, and the rest aluminium. Each of the two 140 mm fans turns at speeds of up to 1,500 RPM, pushing up to 83 CFM of airflow at 2.2 mm H₂O. With the fans in place, the cooler measures 146 mm x 165 mm x 165 mm (WxDxH), weighing 1.6 kg. The MA6 Frigate is rated for 250 W thermal loads. Both coolers support the latest CPU socket types, including AM5 and LGA1700.



The MA-400 Falcon stands out for its unique graffiti-infused die-cast metal shroud, and a "caged" fan, with an industrial look. This is an aluminium fin-stack tower-type cooler. Its heatsink uses four 6 mm-thick copper heatpipes that make direct contact with the CPU at the base; conveying heat to a fin-stack that's ventilated by a 120 mm addressable-RGB LED fan with rifle-bearings. This fan turns at speeds of up to 1,800 RPM, pushing up to 75.81 CFM of airflow, at 1.98 mm H₂O static pressure. Measuring 128 mm x 88 mm x 160 mm (WxDxH), the cooler weighs 590 g, and is rated for thermal loads of 130 W. Sockets LGA1700 and AM5 are supported.



The Warp Shield S and Warp Shield S are two nifty SSD heatsinks designed for M.2-2280 drives. The Warp Shield S is designed with a copper base-plate that makes contact with an aluminium fin-stack using a flattened single copper heatpipe. Micronics claims a 40% reduction in controller temperatures with this heatsink. The Warp Shield H is a slightly taller heatsink that uses the same copper base-plate, but two flattened heatpipes to convey heat to a taller aluminium fin-stack. While the manufacturer rates the cooler's benefit at the same 40% reduction in controller temperatures, the actual reduction could be superior to that of the Warp Shield S.



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That huge but no copper block with direct pipe contact?
 
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I keep hearing folks on TPU suggesting direct pipe contact as a superior option to a baseplate. It’s not. Exposed heat pipes lead to uneven contact and force a reliance on thermal paste to transfer heat from the CPU to the heat pipes. A soldered baseplate has better contact, is more efficient, and requires less paste. There’s a reason all of the best performing coolers, including every dual-tower I’m aware of, use baseplates rather than exposed heat pipes.
 
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The frigate looks like an interesting cooler would be nice to see a full review of it
 
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Great to see the MA6's copper fins are already turning brown. Any exposed copper heatsinks always look great out of the box but then turn into a brown mess from oxidation a few months later.
 

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keep hearing folks on TPU suggesting direct pipe contact as a superior option to a baseplate.
You would never hear those words leave my mouth :)

I prefer my heatpipes.. unmolested.
 
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#justsayno2pHatassCoolers#

1.6KB.... seriously ?

w.T.f.....
 
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I keep hearing folks on TPU suggesting direct pipe contact as a superior option to a baseplate. It’s not. Exposed heat pipes lead to uneven contact and force a reliance on thermal paste to transfer heat from the CPU to the heat pipes. A soldered baseplate has better contact, is more efficient, and requires less paste. There’s a reason all of the best performing coolers, including every dual-tower I’m aware of, use baseplates rather than exposed heat pipes.
I think they do it because it is easier not better.
 
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