Intel "Tiger Lake" Leverages 10 nm+ SuperFin and SuperMIM Technologies
Intel's upcoming 11th Generation Core "Tiger Lake" processors introduce the company's first major refinement of its 10 nanometer silicon fabrication node, dubbed 10 nm+. The node introduces two key features that work to improve the power characteristics of the silicon, allowing Intel to yield more performance without raising power/thermals over the previous generation. VideoCardz scored a major scoop on 10 nm+, including the introduction of the new SuperFin transistor, and SuperMIM capacitor.
SuperFin is a redesigned FinFET, a nanoscale transistor, which offers increased gate pitch, yielding higher drive current, improved channel mobility, and an improved source/drain, yielding in lower resistance. The other key component of 10 nm+ is SuperMIM, delivering a 5 times increase in metal-insulator-metal capacitance. Intel is yet to put out energy efficiency gain numbers for the process, but promises a "dramatic increase in frequency" over the previous generation, which lines up with leaks of the Core i7-1185G7 shipping with significantly higher clock speeds.
SuperFin is a redesigned FinFET, a nanoscale transistor, which offers increased gate pitch, yielding higher drive current, improved channel mobility, and an improved source/drain, yielding in lower resistance. The other key component of 10 nm+ is SuperMIM, delivering a 5 times increase in metal-insulator-metal capacitance. Intel is yet to put out energy efficiency gain numbers for the process, but promises a "dramatic increase in frequency" over the previous generation, which lines up with leaks of the Core i7-1185G7 shipping with significantly higher clock speeds.