Innodisk, a leading global AI solution provider, has introduced its new E1.S SSD, which is specifically designed to meet the demands of growing edge computing applications. The E1.S edge server SSD offers exceptional performance, reliability, and thermal management capabilities to address the critical needs of modern data-intensive environments and bridge the gap between traditional industrial SSDs and data center SSDs.

As AI and 5G technologies rapidly evolve, the demands on data processing and storage continue to grow. The E1.S SSD addresses the challenges of balancing heat dissipation and performance, which has become a major concern for today's SSDs. Traditional industrial and data center SSDs often struggle to meet the needs of edge applications. Innodisk's E1.S eliminates these bottlenecks with its Enterprise and Data Center Standard Form Factor (EDSFF) design and offers a superior alternative to U.2 and M.2 SSDs.

Late Tuesday, Microsoft Azure shared an interesting picture on its social media platform X, showcasing the pinnacle of GPU-accelerated servers—NVIDIA "Blackwell" GB200-powered AI systems. Microsoft is one of NVIDIA's largest customers, and the company often receives products first to integrate into its cloud and company infrastructure. Even NVIDIA listens to feedback from companies like Microsoft about designing future products, especially those like the now-canceled NVL36x2 system. The picture below shows a massive cluster that roughly divides the compute area into a single-third of the entire system, with a gigantic two-thirds of the system dedicated to closed-loop liquid cooling.

The entire system is connected using Infiniband networking, a standard for GPU-accelerated systems due to its lower latency in packet transfer. While the details of the system are scarce, we can see that the integrated closed-loop liquid cooling allows the GPU racks to be in a 1U form for increased density. Given that these systems will go into the wider Microsoft Azure data centers, a system needs to be easily maintained and cooled. There are indeed limits in power and heat output that Microsoft's data centers can handle, so these types of systems often fit inside internal specifications that Microsoft designs. There are more compute-dense systems, of course, like NVIDIA's NVL72, but hyperscalers should usually opt for other custom solutions that fit into their data center specifications. Finally, Microsoft noted that we can expect to see more details at the upcoming Microsoft Ignite conference in November and learn more about its GB200-powered AI systems.

ASRock Rack Inc., a leading innovative server company, today announced the launch of its new server platforms, powered by Intel Xeon 6900 series processors with Performance-Cores (P-Cores). These advanced platforms are designed to deliver exceptional performance across a wide range of demanding workloads, including High-Performance Computing (HPC), Artificial Intelligence (AI), storage, and networking.

The Intel Xeon 6900 Series Processors are optimized for high performance per core and are delivered in a new class of Intel server platform design. They offer up to 12 memory channels, providing greater memory bandwidth to support demanding environments such as cloud, AI, and HPC. Leveraging these processors, ASRock Rack's newly released platforms—the 1U all-flash storage server 1U8E1S-GNRAPDNO and the GNRAPD12DNO server motherboard—fully maximize throughput with unprecedented compute capability.

MSI, a leading global server provider, today announced the availability of high-performance server platforms supporting AMD EPYC 4004 Processors for small and medium businesses and regional-hosted IT service providers to deliver essential security capabilities and energy efficiency. "Businesses across all scales are discovering the advantages of advanced computing, connectivity, and analytics capabilities as applications and services become more widespread," said Danny Hsu, General Manager of Enterprise Platform Solutions. "MSI server platforms, supporting AMD EPYC 4004 Processors, empower our customers to implement high-performance computing with cost-effective, ease of deployment, and manageability features. This capability addresses challenges such as system costs, limited IT expertise, and other infrastructure constraints that were previously prohibitive."

"The new AMD EPYC 4004 Series CPUs, along with our strong ecosystem of technology partners, bring enterprise solutions to a traditionally underserved market and ensure that small and medium businesses have access to highly-performant technologies that help them stay competitive," said John Morris, corporate vice president, Enterprise and HPC Business Group, AMD. "The AMD EPYC 4004 CPUs fill an important market gap, providing cost-optimized solutions with enterprise-grade dependability, scalability and security in cost-optimized system configurations that make sense for smaller businesses and dedicated hosters."

Leaked Samsung PBSSD presentation material popped up online a couple of days prior to the kick-off day of NVIDIA's GTC 2024 conference (March 18)—reports (at the time) jumped on the potential introduction of a "petabyte (PB)-level SSD solution," alongside an enterprise subscription service for the US market. Tom's Hardware took the time to investigate this matter—in-person—on the showroom floor up in San Jose, California. It turns out that interpretations of pre-event information were slightly off—according to on-site investigations: "despite the name, PBSSD is not a petabyte-scale solid-state drive (Samsung's highest-capacity drive can store circa 240 TB), but rather a 'petascale' storage system that can scale-out all-flash storage capacity to petabytes."

Samsung showcased a Supermicro Petascale server design, but a lone unit is nowhere near capable of providing a petabyte of storage—the Tom's Hardware reporter found out that the demonstration model housed: "sixteen 15.36 TB SSDs, so for now the whole 1U unit can only pack up to 245.76 TB of 3D NAND storage (which is pretty far from a petabyte), so four of such units will be needed to store a petabyte of data." Company representatives also had another Supermicro product at their booth: "(an) H13 all-flash petascale system with CXL support that can house eight E3.S SSDs (with) four front-loading E3.S CXL bays for memory expansion."

Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, delivers an expanded portfolio of purpose-built infrastructure solutions to accelerate performance and increase efficiency in 5G and telecom workloads. With one of the industry's most diverse offerings, Supermicro enables customers to expand public and private 5G infrastructures with improved performance per watt and support for new and innovative AI applications. As a long-term advocate of open networking platforms and a member of the O-RAN Alliance, Supermicro's portfolio incorporates systems featuring 5th Gen Intel Xeon processors, AMD EPYC 8004 Series processors, and the NVIDIA Grace Hopper Superchip.

"Supermicro is expanding our broad portfolio of sustainable and state-of-the-art servers to address the demanding requirements of 5G and telco markets and Edge AI," said Charles Liang, president and CEO of Supermicro. "Our products are not just about technology, they are about delivering tangible customer benefits. We quickly bring data center AI capabilities to the network's edge using our Building Block architecture. Our products enable operators to offer new capabilities to their customers with improved performance and lower energy consumption. Our edge servers contain up to 2 TB of high-speed DDR5 memory, 6 PCIe slots, and a range of networking options. These systems are designed for increased power efficiency and performance-per-watt, enabling operators to create high-performance, customized solutions for their unique requirements. This reassures our customers that they are investing in reliable and efficient solutions."

At CES 2024 in Las Vegas, case maker InWin displayed several innovative new models for custom PC builds. The company continues its reputation for eye-catching designs with the debut of the adjustable flatpack POC One case and highly modular Mini Mod-II and Mod-III chassis. The POC One features interlocking panels for easy snap-together assembly, an advancement over the original April-launched POC line. It includes repositionable top or side handles for portable or horizontal setups. Using a mix of aluminium, other metals, and acrylic, the POC One initially comes in black/orange or blue/silver styles. Despite its minimalist flatpack form, it fits full-size components like 335 mm long triple-slot GPUs, 140 mm tall CPU coolers, and standard ATX power supplies. Three PCIe slots and an included riser allow vertical graphics card mounting.

TYAN, a leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced upgraded server platforms and motherboards based on the brand-new 5th Gen Intel Xeon Scalable Processors, formerly codenamed Emerald Rapids.

5th Gen Intel Xeon processor has increased to 64 cores, featuring a larger shared cache, higher UPI and DDR5 memory speed, as well as PCIe 5.0 with 80 lanes. Growing and excelling with workload-optimized performance, 5th Gen Intel Xeon delivers more compute power and faster memory within the same power envelope as the previous generation. "5th Gen Intel Xeon is the second processor offering inside the 2023 Intel Xeon Scalable platform, offering improved performance and power efficiency to accelerate TCO and operational efficiency", said Eric Kuo, Vice President of Server Infrastructure Business Unit, MiTAC Computing Technology Corporation. "By harnessing the capabilities of Intel's new Xeon CPUs, TYAN's 5th-Gen Intel Xeon-supported solutions are designed to handle the intense demands of HPC, data centers, and AI workloads.

TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, debuts its new server line-up for 4th Gen AMD EPYC & AMD Ryzen Processors at SC23, Booth #1917, in the Colorado Convention Center, Denver, CO, November 13-16.

AMD EPYC 9004 processor features leadership performance and is optimized for a wide range of HPC, cloud-native computing and Generative AI workloads
TYAN offers server platforms supporting the AMD EPYC 9004 processors that provide up to 128 Zen 4C cores and 256 MB of L3 Cache for dynamic cloud-native applications with high performance, density, energy efficiency, and compatibility.

TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, unveils an immersion cooling solution that delivering significant PUE (Power Usage Effectiveness) enhancement and showcases its latest server platforms powered by 4th Gen. Intel Xeon Scalable Processors targeting HPC, AI and Cloud Computing applications at SC23, Booth #1917.

Significant PUE Enhancement shown in an Immersion-cooling Tank vs. Conventional Air-cooling Operation Cabinet
The immersion cooling system live demonstrated at TYAN booth during SC23 is a 4U hybrid single phase tank enclosure equipped with 4 units of TYAN GC68A-B7136 cloud computing servers. Comparing to conventional Air-cooling operating cabinet, this hybrid immersion cooling system could offer huge improvement of PUE which makes it become an ideal mission-critical solution for the users aimed in energy-saving and green products.

ASUS, a global infrastructure solution provider, is excited to announce its participation in the 2023 OCP Global Summit, which is taking place from October 17-19, 2023, at the San Jose McEnery Convention Center. The prestigious annual event brings together industry leaders, innovators and decision-makers from around the world to explore and discuss the latest advancements in open infrastructure and cloud technologies, providing a perfect stage for ASUS to unveil its latest cutting-edge products.

The ASUS theme for the OCP Global Summit is Solutions beyond limits—ASUS empowers AI, cloud, telco and more. We will showcase an array of products:

Intel Innovation 2023 -- Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing future support for the upcoming 5th Gen Intel Xeon processors. In addition, Supermicro will soon offer early shipping and free remote early access testing of the new Systems via its JumpStart Program for qualified customers. To learn more, go to www.supermicro.com/x13 for details. The Supermicro 8x GPU optimized servers, the SuperBlade servers, and the Hyper Series will soon be ready for customers to test their workloads on the new CPU.

"Supermicro's range of Generative High-Performance AI systems, including recently launched GPUs, continues to lead the industry in AI offerings with its broad range of X13 family of servers designed for various workloads, from the edge to the cloud," said Charles Liang, president, and CEO, Supermicro. "Our support for the upcoming 5th Gen Intel Xeon processors, with more cores, an increased performance per watt, and the latest DDR5-5600 MHz memory, will allow our customers to realize even greater application performance and power efficiency for AI, Cloud, 5G Edge, and Enterprise workloads. These new features will help customers accelerate their business and maximize their competitive advantage."

TYAN, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, today announced availability of new single-socket server platforms supporting AMD EPYC 8004 Series processors. These platforms are purpose built for cloud services and intelligent edge deployments while offering lower operating costs and delivering impressive energy efficiency.

"The AMD EPYC 8004 Series CPUs deliver a great combination of impressive performance and streamlined platform componentry which enables us to develop business-relevant server configurations for our customers," said Eric Kuo, Vice President of the Server Infrastructure Business Unit at MiTAC Computing Technology. "TYAN's innovative server platform, fueled by EPYC 8004 Series CPUs, empowers us to provide our customers with cost-effective solutions while also expanding into new markets."

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the AMD based Supermicro H13 generation of WIO Servers, optimized to deliver strong performance and energy efficiency for edge and telco datacenters powered by the new AMD EPYC 8004 Series processors. The new Supermicro H13 WIO and short-depth front I/O systems deliver energy-efficient single socket servers that lower operating costs for enterprise, telco, and edge applications. These systems are designed with a dense form factor and flexible I/O options for storage and networking, making the new servers ideal for deploying in edge networks.

"We are excited to expand our AMD EPYC-based server offerings optimized to deliver excellent TCO and energy efficiency for data center networking and edge computing," said Charles Liang, president and CEO of Supermicro. "Adding to our already industry leading edge-to-cloud rack scale IT solutions, the new Supermicro H13 WIO systems with PCIe 5.0 and DDR5-4800 MHz memory show tremendous performance for edge applications."

IBASE Technology Inc. (TPEx: 8050), a global leader in network appliances and embedded solutions, proudly announces the release of the INA8505 enterprise 1U edge server. Powered by the Intel Xeon D-2700 processor and offering versatile connectivity options, this state-of-the-art appliance is specifically designed to excel in demanding 5G Open vRAN & MEC applications such as real-time data analytics, autonomous vehicles, and smart city deployments. It enables full control over resource allocation in the RAN and MEC, and has the potential to seamlessly integrate AI capabilities to dynamically optimize network performance in real time at the edge of the 5G network infrastructure.

The INA8505 delivers unmatched performance, scalability, and efficiency with flexible storage, offering two SATA/NVMe 2.5" HDD/SSD slots, 2x M.2 (M-key) SATA/PCI-E storage slots, and one 16 GB/32 GB/64 GB eMMC. With an FHFL PCI-E (x16) Gen 4 (supports 75 W) and an FHFL PCI-E (x8) Gen 4 (supports 75 W) configurable as PCI-E (x16) Gen 4 double FHFL (supports 120 W), the INA8505 adapts effortlessly into different network environments and meet future demands for increased scalability. It boasts a rich array of I/O connectivity options, including a VGA port from BMC (Aspeed 2600, IPMI 2.0 support), two USB2.0 Type-A ports, an RJ45 console port, and four 25 GbE SFP28 ports, ensuring enhanced adaptability to various connectivity needs.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is delivering a high-throughput, low latency E3.S storage solutions supporting the industry's first PCIe Gen 5 drives and CXL modules to meet the demands of large AI Training and HPC clusters, where massive amounts of unstructured data must be delivered to the GPUs and CPUs to achieve faster results.

Supermicro's Petascale systems are a new class of storage servers supporting the latest industry standard E3.S (7.5 mm) Gen 5 NVMe drives from leading storage vendors for up to 256 TB of high throughput, low latency storage in 1U or up to a half petabyte in 2U. Inside, Supermicro's innovative symmetrical architecture reduced latency by ensuring the shortest signal paths for data and maximized airflow over critical components, allowing them to run at optimal speeds. With these new systems, a standard rack can now hold over 20 Petabytes of capacity for high throughput NVMe-oF (NVMe over Fabrics) configurations, ensuring that GPUs remain saturated with data. Systems are available with either the 4th Gen Intel Xeon Scalable processors or 4th Gen AMD EPYC processors.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing that its entire line of H13 AMD based-systems is now available with support for 4th Gen AMD EPYC processors, based on "Zen 4c" architecture, and 4th Gen AMD EPYC processors with AMD 3D V-Cache technology. Supermicro servers powered by 4th Gen AMD EPYC processors for cloud-native computing, with leading thread density and 128 cores per socket, deliver impressive rack density and scalable performance with energy efficiency to deploy cloud native workloads in more consolidated infrastructure. These systems are targeted for cloud operators to meet the ever-growing demands of user sessions and deliver AI-enabled new services. Servers featuring AMD 3D V-Cache technology excel in running technical applications in FEA, CFD, and EDA. The large Level 3 cache enables these types of applications to run faster than ever before. Over 50 world record benchmarks have been set with AMD EPYC processors over the past few years.

"Supermicro continues to push the boundary of our product lines to meet customers' requirements. We design and deliver resource-saving, application-optimized servers with rack scale integration for rapid deployments," said Charles Liang, president, and CEO of Supermicro. "With our growing broad portfolio of systems fully optimized for the latest 4th Gen AMD EPYC processors, cloud operators can now achieve extreme density and efficiency for numerous users and cloud-native services even in space-constrained data centers. In addition, our enhanced high performance, multi-socket, multi-node systems address a wide range of technical computing workloads and dramatically reduce time-to-market for manufacturing companies to design, develop, and validate new products leveraging the accelerated performance of memory intensive applications."

ASRock Rack, the leading innovative server company, today announced its support of 4th Gen AMD EPYC processors with AMD "Zen 4c" architecture and 4th Gen AMD EPYC processors with AMD 3D V-Cache technology, as well as the expansion of their new products ranging from high-density storage, GPU, multi-nodes servers all for the new AMD processors.

"4th Gen AMD EPYC processors offer the highest core density of any x86 processor in the world and will deliver outstanding performance and efficiency for cloud-native workloads," said Lynn Comp, corporate vice president, Server Product and Technology Marketing, AMD. "Our latest family of data center processors allow customers to balance workload growth and flexibility with critical infrastructure consolidation mandates, enabling our customers to do more work, with more energy efficiency at a time when cloud native computing is transforming the data center."

Nfina announces the addition of two new server systems to its lineup, customized for small to medium businesses and virtualized environments. Featuring 3rd Gen Intel Xeon Scalable Processors, these scalable server systems fill a void in the marketplace, bringing exceptional multi-socket processing performance, easy setup, operability, and Nfina's five-year warranty.

"We are excited to add two new 3rd generation Intel systems to Nfina's lineup. Performance, scalability, and flexibility are key deciding factors when expanding our offerings," says Warren Nicholson, President and CEO of Nfina. "Both servers are optimized for high- performance computing, virtualized environments, and growing data needs." He continues by saying, "The two servers can also be leased through our managed services division. We provide customers with choices that fit the size of their application and budget - not a one size fits all approach."

TerraMaster, a professional brand that focuses on providing innovative storage products for homes and businesses, has a new model of 4-bay U4-423 short depth rackmount NAS with dual 2.5GbE interfaces which provides a network bandwidth up to 5 Gb via link aggregation and up to 88 TB storage space. TerraMaster U4-423 adopts 1U rackmount case with a depth of only 360 mm (14.17 inches) weighs merely 3.2kgs, which is applicable to most 2-column cabinets and wall-mounted small cabinets with simple installation.

Space-saving: TerraMaster U4-423 has a shorter chassis depth and takes up less rack space than traditional NAS, which is very useful for environments with limited space, such as home basements, small offices, computer rooms, etc.

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, will showcase its latest cloud server platforms powered by AMD EPYC 9004 Series processors and 4th Gen Intel Xeon Scalable processors for next-generation data centers at CloudFest 2023, Booth #H12 in Europa-Park from March 21-23.

"With the exponential advancement of technologies like AI and Machine Learning, data centers require robust hardware and infrastructure to handle complex computations while running AI workloads and processing big data," said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure BU. "TYAN's cloud server platforms with storage performance and computing capability can support the ever-increasing demand for computational power and data processing."

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the latest addition to its revolutionary ultra-high performance, high-density petascale class all-flash NVMe server family. Supermicro systems in this high-performance storage product family will support the next-generation EDSFF form factor, including the E3.S and E1.S devices, in form factors that accommodate 16- and 32 high-performance PCIe Gen 5 NVMe drive bays.

The initial offering of the updated product line will support up to one-half of a petabyte of storage space in a 1U 16 bay rackmount system, followed by a full petabyte of storage space in a 2U 32 bay rackmount system for both Intel and AMD PCIe Gen 5 platforms. All of the Supermicro systems that support either the E1.S or E3.s form factors enable customers to realize the benefits in various application-optimized servers.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the latest addition to its revolutionary ultra-high performance, high-density petascale class all-flash NVMe server family. Supermicro systems in this high performance storage product family will support the next-generation EDSFF form factor, including the E3.S and E1.S devices, in form factors that accommodate 16- and 32 high-performance PCIe Gen 5 NVMe drive bays.

The initial offering of the updated product line will support up to one-half of a petabyte storage space in a 1U 16 bay rackmount system, followed by a fully petabyte storage space in 2U 32 bay rackmount system for both Intel and AMD PCIe Gen 5 platforms.

EK, the leading liquid cooling gear manufacturer, is announcing the availability of two high-performance liquid cooling solutions for the AMD Ryzen processor family based on the AMD AM5 socket. These single-socket AM5 water blocks are available in both the standard and the 1U-compatible format designed specifically for server racks.

EK-Pro CPU WB AM5 Ni + Inox
Being a dedicated workstation-grade water block for AMD AM5 processors, the EK-Pro CPU WB AM5 Ni + Inox water block features two standard G1/4" threaded ports on its top. Built with performance, reliability, serviceability, and no compromises in mind, this enterprise-grade cooling solution is intended for desktops, workstations, and taller server racks. The water block's top is CNC-machined from durable black POM Acetal, and the hold-down bracket is made of laser-cut stainless steel.

Powerful coolers for large processors on Intel Socket LGA 4677! With the new Enterprise Solution Jet and Stream CPU coolers, Alphacool presents progressive solutions for CPU cooling in server and workstation systems.

The Alphacool ES Jet CPU Cooler is equipped with a new complex 4-nozzle technology. For the first time, it distributes water evenly over the cooler base via four nozzles incorporated into the cooler. Thereby, all cores of the high-performance processor are optimally supplied and thus effectively and precisely cooled. The organic water flow ensures a disturbance-free water flow and thus increases the cooling performance. This method makes it possible to optimally dissipate waste heat of up to 800 watts. The chrome-plated cooler base is made of copper and is ideally suited for server and workstation systems with its extremely high thermal conductivity.