AEWIN is excited to unveil the SCB-1953 Series, 2U/1U performant network appliances powered by Intel's latest Xeon 6 processors built upon Intel 3. Equipped with a single Intel Xeon 6700/6500-series processor, it is a series of flagship products supporting up to 144 E-cores or 86 P-cores for high density and compute-intensive workloads pursued in the market. SCB-1953 series has multiple SKU with various PCIe slots options for exceptional scalability to fulfill customers' diverse solution requirements.

SCB-1953-2U is a 2U network computing platform with 8x DDR5 RDIMM up to 6400 MT/s or MRDIMM up to 8000 MT/s. The series of SCB-1953-2U has 4x 8038 fans with BMC control for optimized thermal management. One is SCB-1953A featuring 8x PCIe 5.0 expansion slots for AEWIN wide coverage NIC cards with 1G/10/25/40/100G/200G copper/fiber interfaces or other Accelerators & NVMe SSDs for flexible functionality enhancement. The other is SCB-1953C supporting 1x PCIe x16 slot by switching two PCIe slots to one standard PCIe form factor which can install off-the-shelf add-on card for expanded function required.

Today, Lenovo announced three new infrastructure solutions, powered by Intel Xeon 6 processors, designed to modernize and elevate data centers of any size to AI-enabled powerhouses. The solutions include next generation Lenovo ThinkSystem V4 servers that deliver breakthrough performance and exceptional versatility to handle any workload while enabling powerful AI capabilities in compact, high-density designs. Whether deploying at the edge, co-locating or leveraging a hybrid cloud, Lenovo is delivering the right mix of solutions that seamlessly unlock intelligence and bring AI wherever it is needed.

The new Lenovo ThinkSystem servers are purpose-built to run the widest range of workloads, including the most compute intensive - from algorithmic trading to web serving, astrophysics to email, and CRM to CAE. Organizations can streamline management and boost productivity with the new systems, achieving up to 6.1x higher compute performance than previous generation CPUs with Intel Xeon 6 with P-cores and up to 2x the memory bandwidth when using new MRDIMM technology, to scale and accelerate AI everywhere.

MSI introduces new server platforms powered by the latest Intel Xeon 6 family of processors with the Performance Cores (P-Cores). Engineered for high-density performance, seamless scalability, and energy-efficient operations, these servers deliver exceptional throughput, dynamic workload flexibility, and optimized power efficiency. Optimized for AI-driven applications, modern data centers, and cloud-native workloads, MSI's new platforms help lower total cost of ownership (TCO) while maximizing infrastructure efficiency and resource optimization.

"As data-driven transformation accelerates across industries, businesses require solutions that not only deliver performance but also enable sustainable growth and operational agility," said Danny Hsu, General Manager of MSI's Enterprise Platform Solutions. "Our Intel Xeon 6 processor-based servers are designed to support this shift by offering high-core scalability, energy-efficient performance, and dynamic workload optimization. These capabilities empower organizations to maximize compute density, streamline their digital ecosystems, and respond to evolving market demands with greater speed and efficiency."

Supermicro, Inc. (SMCI), a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, is showcasing the latest solutions for the retail industry in collaboration with NVIDIA at the National Retail Federation (NRF) annual show. As generative AI (GenAI) grows in capability and becomes more easily accessible, retailers are leveraging NVIDIA NIM microservices, part of the NVIDIA AI Enterprise software platform, for a broad spectrum of applications.

"Supermicro's innovative server, storage, and edge computing solutions improve retail operations, store security, and operational efficiency," said Charles Liang, president and CEO of Supermicro. "At NRF, Supermicro is excited to introduce retailers to AI's transformative potential and to revolutionize the customer's experience. Our systems here will help resolve day-to-day concerns and elevate the overall buying experience."

MiTAC Computing Technology Corporation, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Holdings Corporation (TSE:3706), is unveiling its new server lineup at SC24, booth #2543, in Atlanta, Georgia. MiTAC Computing's servers integrate the latest AMD EPYC 9005 Series CPUs, AMD Instinct MI325X GPU accelerators, Intel Xeon 6 processors, and professional GPUs to deliver enhanced performance optimized for HPC and AI workloads.

Leading Performance and Density for AI-Driven Data Center Workloads
MiTAC Computing's new servers, powered by AMD EPYC 9005 Series CPUs, are optimized for high-performance AI workloads. At SC24, MiTAC highlights two standout AI/HPC products: the 8U dual-socket MiTAC G8825Z5, featuring AMD Instinct MI325X GPU accelerators, up to 6 TB of DDR5 6000 memory, and eight hot-swap U.2 drive trays, ideal for large-scale AI/HPC setups; and the 2U dual-socket MiTAC TYAN TN85-B8261, designed for HPC and deep learning applications with support for up to four dual-slot GPUs, twenty-four DDR5 RDIMM slots, and eight hot-swap NVMe U.2 drives. For mainstream cloud applications, MiTAC offers the 1U single-socket MiTAC TYAN GC68C-B8056, with twenty-four DDR5 DIMM slots and twelve tool-less 2.5-inch NVMe U.2 hot-swap bays. Also featured is the 2U single-socket MiTAC TYAN TS70A-B8056, designed for high-IOPS NVMe storage, and the 2U 4-node single-socket MiTAC M2810Z5, supporting up to 3,072 GB of DDR5 6000 RDIMM memory and four easy-swap E1.S drives per node.

AEWIN is glad to introduce our latest storage adapter cards, RS110A and RS118A. Each card has two hot-swappable E1.S trays while RS110A in a Standard PCIe x8 FHHL form factor and RS118A is in AEWIN Expansion Module form factor. RS118A can be installed in current AEWIN platforms with AEWIN expansion module bays while RS110A is suitable for platforms with standard PCIe slots for flexible storage expansion. With RS110A and RS118A, two E1.S NVMe SSDs with Maximum 9.5 mm and 15 mm height can be applied to existing systems for excellent scalability.

Market researchers have reported that the E1.S form factor is projected to become the most widely adopted small form factor for enterprise SSDs of data center in the coming years. E1.S NVMe storage features better thermal management solutions and can utilize bigger power consumption of 20 W which can overcome the scaling issue that M.2 is having. In addition, E1.S storage has hot-swappable features to minimize downtime and perform easier maintenance for replacement or capacity upgrade of the servers.

MSI, a leading global provider of high-performance server solutions, is excited to showcase its comprehensive lineup of motherboards and servers based on the OCP Modular Hardware System (DC-MHS) architecture at the OCP Global Summit from October 15-17 at booth A6. These cutting-edge solutions represent a breakthrough in server designs, enabling flexible deployments for cloud and high-density data centers. Featured innovations include CXL memory expansion servers and AI-optimized servers, demonstrating MSI's leadership in pushing the boundaries of AI performance and computing power.

DC-MHS Series Motherboards and Servers: Enabling Flexible Deployment in Data Centers
"The rapidly evolving IT landscape requires cloud service providers, large-scale data center operators, and enterprises to handle expanding workloads and future growth with more flexible and powerful infrastructure. MSI's new rage of DC-MHS-based solutions provides the needed flexibility and efficiency for modern data center environments," said Danny Hsu, General Manager of Enterprise Platform Solutions.

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is accelerating the industry's transition to liquid-cooled data centers with the NVIDIA Blackwell platform to deliver a new paradigm of energy-efficiency for the rapidly heightened energy demand of new AI infrastructures. Supermicro's industry-leading end-to-end liquid-cooling solutions are powered by the NVIDIA GB200 NVL72 platform for exascale computing in a single rack and have started sampling to select customers for full-scale production in late Q4. In addition, the recently announced Supermicro X14 and H14 4U liquid-cooled systems and 10U air-cooled systems are production-ready for the NVIDIA HGX B200 8-GPU system.

"We're driving the future of sustainable AI computing, and our liquid-cooled AI solutions are rapidly being adopted by some of the most ambitious AI Infrastructure projects in the world with over 2000 liquid-cooled racks shipped since June 2024," said Charles Liang, president and CEO of Supermicro. "Supermicro's end-to-end liquid-cooling solution, with the NVIDIA Blackwell platform, unlocks the computational power, cost-effectiveness, and energy-efficiency of the next generation of GPUs, such as those that are part of the NVIDIA GB200 NVL72, an exascale computer contained in a single rack. Supermicro's extensive experience in deploying liquid-cooled AI infrastructure, along with comprehensive on-site services, management software, and global manufacturing capacity, provides customers a distinct advantage in transforming data centers with the most powerful and sustainable AI solutions."

ASRock Rack Inc., a leading innovative server company, today announced the launch of its new server platforms, powered by Intel Xeon 6900 series processors with Performance-Cores (P-Cores). These advanced platforms are designed to deliver exceptional performance across a wide range of demanding workloads, including High-Performance Computing (HPC), Artificial Intelligence (AI), storage, and networking.

The Intel Xeon 6900 Series Processors are optimized for high performance per core and are delivered in a new class of Intel server platform design. They offer up to 12 memory channels, providing greater memory bandwidth to support demanding environments such as cloud, AI, and HPC. Leveraging these processors, ASRock Rack's newly released platforms—the 1U all-flash storage server 1U8E1S-GNRAPDNO and the GNRAPD12DNO server motherboard—fully maximize throughput with unprecedented compute capability.

With the new ES 2U Reservoir, Alphacool is launching a versatile all-in-one reservoir for servers. Thanks to the integrated flow and temperature sensors, the cooling system can be continuously monitored at all times.

The Alphacool All-in-One reservoir has been specially developed for 2U server cases and is characterized by its compact design, which takes up minimal space. The cooling system can be filled and vented quickly and easily using the quick-release fasteners on the front. The illuminated inspection window makes it possible to check the fill level in the system at all times.

During Computex 2024, Alphacool presented its latest case lineup optimized for water cooling, in addition to more water cooling componentry. The Apex Pro Skeleton Carbon Case is a modular enclosure optimized for advanced water cooling setups. It is crafted from real carbon fiber tubes and reinforced with CNC-milled aluminium corners. It can be completely dismantled and reconfigured to suit the user's precise requirements. By utilizing a modular approach, users can change the system layout, optimize airflow, and achieve their unique cooling goals. Previously showcased at Computex 2023, the plan was for two SKU: Alphacool Apex Pro Skeleton Carbon Case and the Alphacool Apex Skeleton aluminium Case, the latter of which does not include a distribution plate or support for a vertical graphics card. The Apex Pro case with a custom distro plate will be available for $899, while the case-only solution will be available for $499.

Silverstone in its 2024 Computex booth showcased the brand's pivot toward premium cases meant for workstations and servers used in the development or acceleration of AI applications. These cases span across industry-standard rackmount form-factors, as well as full-towers, so SMBs and startups could have on-floor AI acceleration machines set up. For AI on the edge, Silverstone showcased the GM1000 2U Gold, a 1000 W redundant PSU, the XE02-4677, a 2U cooling solution for Socket LGA4677, and the RM22-312 2U chassis.

For the general purpose server and SMB AI acceleration markets, the company showcased its RM44 4U case that can be used both as a tower and in a rack, The XE360-4677, which is a 360 mm x 120 mm AIO liquid CPU cooler for LGA4677, and the Gemini 900A Gold, an 80 Plus Gold rated 900 W redundant power supply. AI development systems see the lion's share of Silverstone's signature aesthetics and innovations, as these cases blur the lines between high-end desktops and workstations. The Alta D1 is an ATX full-tower, which can hold an SSI-EEB motherboard with up to 11 expansion slots for multiple GPUs, provision for either redundant PSUs or 5.25-inch cages that can be used as mounts for multiple SSDs; and provision for a couple of large radiators, to cool the CPU.

Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, delivers an expanded portfolio of purpose-built infrastructure solutions to accelerate performance and increase efficiency in 5G and telecom workloads. With one of the industry's most diverse offerings, Supermicro enables customers to expand public and private 5G infrastructures with improved performance per watt and support for new and innovative AI applications. As a long-term advocate of open networking platforms and a member of the O-RAN Alliance, Supermicro's portfolio incorporates systems featuring 5th Gen Intel Xeon processors, AMD EPYC 8004 Series processors, and the NVIDIA Grace Hopper Superchip.

"Supermicro is expanding our broad portfolio of sustainable and state-of-the-art servers to address the demanding requirements of 5G and telco markets and Edge AI," said Charles Liang, president and CEO of Supermicro. "Our products are not just about technology, they are about delivering tangible customer benefits. We quickly bring data center AI capabilities to the network's edge using our Building Block architecture. Our products enable operators to offer new capabilities to their customers with improved performance and lower energy consumption. Our edge servers contain up to 2 TB of high-speed DDR5 memory, 6 PCIe slots, and a range of networking options. These systems are designed for increased power efficiency and performance-per-watt, enabling operators to create high-performance, customized solutions for their unique requirements. This reassures our customers that they are investing in reliable and efficient solutions."

TYAN, a leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced upgraded server platforms and motherboards based on the brand-new 5th Gen Intel Xeon Scalable Processors, formerly codenamed Emerald Rapids.

5th Gen Intel Xeon processor has increased to 64 cores, featuring a larger shared cache, higher UPI and DDR5 memory speed, as well as PCIe 5.0 with 80 lanes. Growing and excelling with workload-optimized performance, 5th Gen Intel Xeon delivers more compute power and faster memory within the same power envelope as the previous generation. "5th Gen Intel Xeon is the second processor offering inside the 2023 Intel Xeon Scalable platform, offering improved performance and power efficiency to accelerate TCO and operational efficiency", said Eric Kuo, Vice President of Server Infrastructure Business Unit, MiTAC Computing Technology Corporation. "By harnessing the capabilities of Intel's new Xeon CPUs, TYAN's 5th-Gen Intel Xeon-supported solutions are designed to handle the intense demands of HPC, data centers, and AI workloads.

TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, debuts its new server line-up for 4th Gen AMD EPYC & AMD Ryzen Processors at SC23, Booth #1917, in the Colorado Convention Center, Denver, CO, November 13-16.

AMD EPYC 9004 processor features leadership performance and is optimized for a wide range of HPC, cloud-native computing and Generative AI workloads
TYAN offers server platforms supporting the AMD EPYC 9004 processors that provide up to 128 Zen 4C cores and 256 MB of L3 Cache for dynamic cloud-native applications with high performance, density, energy efficiency, and compatibility.

TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, unveils an immersion cooling solution that delivering significant PUE (Power Usage Effectiveness) enhancement and showcases its latest server platforms powered by 4th Gen. Intel Xeon Scalable Processors targeting HPC, AI and Cloud Computing applications at SC23, Booth #1917.

Significant PUE Enhancement shown in an Immersion-cooling Tank vs. Conventional Air-cooling Operation Cabinet
The immersion cooling system live demonstrated at TYAN booth during SC23 is a 4U hybrid single phase tank enclosure equipped with 4 units of TYAN GC68A-B7136 cloud computing servers. Comparing to conventional Air-cooling operating cabinet, this hybrid immersion cooling system could offer huge improvement of PUE which makes it become an ideal mission-critical solution for the users aimed in energy-saving and green products.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing that its entire line of H13 AMD based-systems is now available with support for 4th Gen AMD EPYC processors, based on "Zen 4c" architecture, and 4th Gen AMD EPYC processors with AMD 3D V-Cache technology. Supermicro servers powered by 4th Gen AMD EPYC processors for cloud-native computing, with leading thread density and 128 cores per socket, deliver impressive rack density and scalable performance with energy efficiency to deploy cloud native workloads in more consolidated infrastructure. These systems are targeted for cloud operators to meet the ever-growing demands of user sessions and deliver AI-enabled new services. Servers featuring AMD 3D V-Cache technology excel in running technical applications in FEA, CFD, and EDA. The large Level 3 cache enables these types of applications to run faster than ever before. Over 50 world record benchmarks have been set with AMD EPYC processors over the past few years.

"Supermicro continues to push the boundary of our product lines to meet customers' requirements. We design and deliver resource-saving, application-optimized servers with rack scale integration for rapid deployments," said Charles Liang, president, and CEO of Supermicro. "With our growing broad portfolio of systems fully optimized for the latest 4th Gen AMD EPYC processors, cloud operators can now achieve extreme density and efficiency for numerous users and cloud-native services even in space-constrained data centers. In addition, our enhanced high performance, multi-socket, multi-node systems address a wide range of technical computing workloads and dramatically reduce time-to-market for manufacturing companies to design, develop, and validate new products leveraging the accelerated performance of memory intensive applications."

ASRock Rack, the leading innovative server company, today announced its support of 4th Gen AMD EPYC processors with AMD "Zen 4c" architecture and 4th Gen AMD EPYC processors with AMD 3D V-Cache technology, as well as the expansion of their new products ranging from high-density storage, GPU, multi-nodes servers all for the new AMD processors.

"4th Gen AMD EPYC processors offer the highest core density of any x86 processor in the world and will deliver outstanding performance and efficiency for cloud-native workloads," said Lynn Comp, corporate vice president, Server Product and Technology Marketing, AMD. "Our latest family of data center processors allow customers to balance workload growth and flexibility with critical infrastructure consolidation mandates, enabling our customers to do more work, with more energy efficiency at a time when cloud native computing is transforming the data center."

Tyan, subsidary of MiTAC, showed off their new range of AMD EPYC based servers with a distinct focus on compute density. These included new introductions to their Transport lineup of configurable servers which now host EPYC 9004 "Genoa" series processors with up to 96-cores each. The new additions come as 2U servers each with a different specialty focus. First up is the Transport SX TN85-B8261, aimed squarely at HPC and AI/ML deployment, with support for up to dual 96-Core EPYC "Genoa" processors, 3 TB of registered ECC DDR5-4800, dual 10GbE via an Intel x550-AT2 as well as 1GbE for IPMI, six PCI-E Gen 5 x16 slots with support for four GPGPUs for ML/HPC compute, and eight NVMe drives at the front of the chassis. An optional more storage focused configuration if you choose not to install GPUs is to have 24 total NVMe SSDs at the front soaking up the 96 lanes of PCI-E.

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, will showcase its latest cloud server platforms powered by AMD EPYC 9004 Series processors and 4th Gen Intel Xeon Scalable processors for next-generation data centers at CloudFest 2023, Booth #H12 in Europa-Park from March 21-23.

"With the exponential advancement of technologies like AI and Machine Learning, data centers require robust hardware and infrastructure to handle complex computations while running AI workloads and processing big data," said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure BU. "TYAN's cloud server platforms with storage performance and computing capability can support the ever-increasing demand for computational power and data processing."

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the latest addition to its revolutionary ultra-high performance, high-density petascale class all-flash NVMe server family. Supermicro systems in this high-performance storage product family will support the next-generation EDSFF form factor, including the E3.S and E1.S devices, in form factors that accommodate 16- and 32 high-performance PCIe Gen 5 NVMe drive bays.

The initial offering of the updated product line will support up to one-half of a petabyte of storage space in a 1U 16 bay rackmount system, followed by a full petabyte of storage space in a 2U 32 bay rackmount system for both Intel and AMD PCIe Gen 5 platforms. All of the Supermicro systems that support either the E1.S or E3.s form factors enable customers to realize the benefits in various application-optimized servers.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the latest addition to its revolutionary ultra-high performance, high-density petascale class all-flash NVMe server family. Supermicro systems in this high performance storage product family will support the next-generation EDSFF form factor, including the E3.S and E1.S devices, in form factors that accommodate 16- and 32 high-performance PCIe Gen 5 NVMe drive bays.

The initial offering of the updated product line will support up to one-half of a petabyte storage space in a 1U 16 bay rackmount system, followed by a fully petabyte storage space in 2U 32 bay rackmount system for both Intel and AMD PCIe Gen 5 platforms.

Powerful coolers for large processors on Intel Socket LGA 4677! With the new Enterprise Solution Jet and Stream CPU coolers, Alphacool presents progressive solutions for CPU cooling in server and workstation systems.

The Alphacool ES Jet CPU Cooler is equipped with a new complex 4-nozzle technology. For the first time, it distributes water evenly over the cooler base via four nozzles incorporated into the cooler. Thereby, all cores of the high-performance processor are optimally supplied and thus effectively and precisely cooled. The organic water flow ensures a disturbance-free water flow and thus increases the cooling performance. This method makes it possible to optimally dissipate waste heat of up to 800 watts. The chrome-plated cooler base is made of copper and is ideally suited for server and workstation systems with its extremely high thermal conductivity.

Dell Technologies expands the industry's top selling server portfolio, with an additional 13 next-generation Dell PowerEdge servers, designed to accelerate performance and reliability for powerful computing across core data centers, large-scale public clouds and edge locations. Next-generation rack, tower and multi-node PowerEdge servers, with 4th Gen Intel Xeon Scalable processors, include Dell software and engineering advancements, such as a new Smart Flow design, to improve energy and cost efficiency. Expanded Dell APEX capabilities will help organizations take an as-a-Service approach, allowing for more effective IT operations that make the most of compute resources while minimizing risk.

"Customers come to Dell for easily managed yet sophisticated and efficient servers with advanced capabilities to power their business-critical workloads," said Jeff Boudreau, president and general manager, Infrastructure Solutions Group, Dell Technologies. "Our next-generation Dell PowerEdge servers offer unmatched innovation that raises the bar in power efficiency, performance and reliability while simplifying how customers can implement a Zero Trust approach for greater security throughout their IT environments."

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced 4th Gen Intel Xeon Scalable processor-based server platforms highlighting built-in accelerators to improve performance across the fastest-growing workloads in AI, analytics, cloud, storage, and HPC.

"Greater availability of new technology like 4th Gen Intel Xeon Scalable processors continue to drive the changes in the business landscape", said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit. "The advances in TYAN's new portfolio of server platforms with features such as DDR5, PCIe 5.0 and Compute Express Link 1.1 are bringing high levels of compute power within reach from smaller organizations to data centers."