MSI has provided a detailed look into its motherboard production facilities through a new interactive webpage. The company has outlined the 15-step manufacturing process that transforms bare circuit boards into complete motherboards. The process begins with solder paste printing, where a precise layer of conductive paste is applied to the bare PCB. This is followed by automated inspection using imaging systems to verify proper paste placement. High-speed machines then position electronic components onto the board before they move through reflow ovens that permanently bond the components. Multiple inspection stages are integrated throughout the assembly line, including automated optical systems that check both sides of the board. Specialized machines handle routing, component insertion, wave soldering, and alloy welding.

Each board undergoes circuit testing and receives mechanical components through automated screw-locking systems before final functional testing and molding. The complexity of modern motherboard manufacturing requires rigorous quality checks and final power tests before the motherboard leaves manufacturing facilities. For interested enthusiasts, MSI's new landing page is here. The manufacturing reveal accompanies MSI's launch of two new motherboard series—Z790 and B860. To celebrate this launch, MSI has announced promotional events running from January 20 to March 31, 2025, including Steam game codes with select product purchases. A new reward program offers points for product reviews and referrals.

G.SKILL International Enterprise Co., Ltd, the world's leading brand of performance overclock memory and PC components, demonstrates high-speed DDR5 CSO-DIMM memory operating at DDR5-8133 with 48 GB (2x24GB) kit capacity on the newly announced ASRock DeskMini B860 system. CSO-DIMM is a relatively new form factor that adds a clock driver (CKD) onto the compact SO-DIMM design, and is supported by the latest platform generation with Intel Core Ultra 200 series processors.

DDR5-8133 48 GB (2x24GB) Extreme Speed with CSO-DIMM Modules
Thanks to the ASRock DeskMini B860 system that implements DDR5 CSO-DIMM support and provides outstanding memory overclock performance, G.SKILL is able to unleash the ultimate overclock potential of the new high-speed CSO-DIMM memory kits. The screenshot below shows the G.SKILL CSO-DIMM memory kit with 48 GB (2x24GB) running at DDR5-8133 CL46-52-52-130 with the ASRock B860M-STX motherboard and the Intel Core Ultra 9 285 desktop processor.

GIGABYTE, the world's leading computer brand, unveils the new generation of Intel B860 and AMD B850 series motherboards at CES 2025. These new series are designed to unleash the performance of the latest Intel Core Ultra and AMD Ryzen processors by leveraging AI-enhanced technology and user-friendly design for a seamless gaming and PC-building experience. Equipped with all digital power and enhanced thermal design, GIGABYTE B800 series motherboards are the gateway to mainstream PC gamers.

GIGABYTE achieved the remarkable milestone of claiming the highest market share on X870 series motherboards due to fully supporting AMD Ryzen 5 7000 and 9000 series X3D processors. The new B800 series motherboards are also adopted with ultra-durable and high-end components and the revolutionary AI suite, D5 Bionics Corsa, integrates software, hardware, and firmware to boost DD5 memory performance up to 8600 MT/s on AMD B850 models and 9466 MT/s on Intel B860 motherboards. The AI SNATCH is an exclusive AI-based software for enhancing DDR5 performance with just a few clicks. Meanwhile, the AI-Driven PCB Design ensures low signal reflection for peak performance across multiple layers through AI simulation. Plus, HyperTune BIOS integrates AI-driven optimizations to fine-tune the Memory Reference Code on Intel B860 series motherboards for high-demand gaming and multitasking. Specially built for AMD Ryzen 9000 series X3D processors, GIGABYTE applies X3D Turbo mode on AMD B850 series motherboards by adjusting core count to boost gaming performance.

Earlier in the week, ASRock debuted its Intel B860/H810 and full range of AMD B850 motherboards—the TechPowerUp team headed across CES 2025's showroom floor to check whether the Taiwanese manufacturer had some of these newly announced products on display. Various white Steel Legend models were present, including an intriguing B850 mainboard sample sporting ASRock's back mount design (BMD). The B860M Pro BMD board was not in sight (or not captured on camera)—according to a press release from earlier in the week, BMD had its premiere on this Intel-based solution.

AsRock reps happily showed off two Intel B860-chipset Steel Legend boards with traditional all-front facing connectors—an ATX option as well as an M-ATX (B860M) model were examined from close-up. A Phantom Gaming B860 Lightning Wi-Fi model was presented to TechPowerUp—its darker aesthetic contrasts sharply when lined up against its pale Steel Legend neighbors.

ASUS extended its line of motherboards at CES 2025, featuring a design that moves power connectors to the back of the board. The company calls this approach "BTF" (Back To Future), aiming to improve cable management in PC builds. The TUF GAMING B850-BTF WIFI and B860-PLUS WIFI models demonstrate this new design, which can deliver up to 600 watts through the motherboard to support modern graphics cards. The boards include Wi-Fi 7 connectivity, PCIe 5.0 support, and multiple M.2 slots for storage devices. In the high-end segment, ASUS presented the ROG Maximus Z890 HERO BTF, compatible with Intel's LGA1851 processors. This board features DDR5 memory support, dual Thunderbolt 4 ports, and tools like Q-Release for easier graphics card removal.

For professional users, ASUS released the ProArt Z890 CREATOR WIFI, equipped with Thunderbolt 4 ports and specialized cooling systems. The company also showed new gaming-focused models including the ROG Crosshair X870E APEX, for the fastest Ryzen 9000X3D series gaming processors. The motherboards share several technical features across different price points. All models support PCIe 5.0 for graphics cards and storage, while most include Wi-Fi 7 capabilities. ASUS has added tool-free installation mechanisms for M.2 drives across the lineup. ASUS has not yet announced pricing or specific release dates for the new motherboards. The BTF design represents a significant change in motherboard layout, though it will require compatible PC cases and power supplies to function as intended. This marks one of the first major changes to standard motherboard design since the ATX format became common in the 1990s.

ASRock announces a full line-up of Intel B860/H810 motherboards. New product comes in Phantom Gaming Series, the ever popular Steel Legend that comes in white PCB design and the feature filled but budget friendly Pro RS and Pro-A series. ASRock will also debut its first BMD (back mount design) motherboard, the B860M Pro BMD, elegant and stylish cable management is no longer a privilege for the high end.

Designed for Fast and Efficient Computing!
The new ASRock B860 motherboards are designed with 14 power phase for vCore, 2oz PCB and exclusive low-ripple 1000μf 20K black capacitors that guarantee stable and superior performance for the CPU. And on top of that, the B860/B860M Lightning Wi-Fi even comes with the patented Memory OC Shield to give excellent memory overclocking. The boards also geared with ample amount of next gen expansion possibility such as the latest PCI-Express Gen-5 for Graphics card and M.2 SSD, Thunderbolt 4 ports on the rear IO to enable lightning-fast data transfer up to 40 Gbps.

MSI introduces its newest lineup of motherboards built for the Intel B860 and H810 chipsets. Combining performance and innovation, these motherboards deliver exceptional reliability and user-friendly features. They are designed to empower mainstream users, gamers, and creators with advanced computing capabilities. The B860 chipset brings several advantages over the H810, making it a standout choice for high-performance computing. It supports PCIe 5.0 slot and M.2 storage, enabling faster speeds and enhanced efficiency for demanding workloads. Unlike the H810, the B860 chipset also allows for memory overclocking, giving users more flexibility and control over their system's performance. With the B860 chipset having 24 PCIe lanes compared to the H810's 16, the B860 delivers a significant boost in performance with its superior bandwidth and connectivity for peripherals and components.

Further enhancing its capabilities, both chipsets include Thunderbolt 4, ensuring high-speed connectivity for a seamless user experience. However, the B860 chipset supports up to 8 Direct Media Interface (DMI) Gen 4 lanes, doubling the data transfer capacity between the CPU and chipset compared to the H810's 4 lanes. MSI's motherboards built on the B860 chipset deliver exceptional performance, reliability, and versatility, instilling confidence in gamers, creators, and everyday users seeking cutting-edge technology.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, PC peripherals, and IPC solutions, is excited to announce the launch of its Intel B860M-SILVER and B860MT-E PRO motherboards, designed with cutting-edge Intel B860 architecture.

Built to support Intel's advanced Core Ultra 9, 7, and 5 processors, the B860M-SILVER and B860MT-E PRO motherboards offer exceptional performance tailored for creators, gamers, and modern office setups. They are masterfully designed to harness the superior bandwidth and energy efficiency of DDR5 technology, and support up to 192 GB of memory with blazing overclocking speeds of up to 8000 MHz.

Intel today launched "locked" 65 W variants of its Core Ultra "Arrow Lake-S" desktop processors in the Socket LGA1851 package. The company also announced more affordable motherboard chipset models, namely the Intel B860 mid-range chipset, and the Intel H810 value-ended chipset. The processor lineup is led by the Intel Core Ultra 9 285 (8P+16E, up to 5.60 GHz P-core boost), followed by the Core Ultra 7 265 (8P+12E, up to 5.30 GHz P-core boost); and the Core Ultra 5 245 (6P+8E, up to 5.10 GHz P-core boost). All three come with suitable boxed cooling solutions in the retail channel.

The Intel B860 chipset comes with a 4-lane DMI 4.0 chipset bus (half the bandwidth of the 8-lane chipset bus of the Intel Z890). The PCH puts out 14 PCI-Express 4.0 general purpose lanes, exactly half the number put out by the Z890. Storage connectivity, besides the configurability of the PCIe GPP lanes, include four SATA 6 Gbps ports. Networking includes a 1 GbE MAC, and Wi-Fi 6E integrated MAC, with Bluetooth 5.3. You can have up to 16 USB 3.2 lanes (each worth 5 Gbps), which can be configured as 5 Gbps, 10 Gbps, or 20 Gbps ports. The B860 lacks CPU overclocking support, but retains memory overclocking, including the ability to apply XMP 3.0 profiles.

ASUS today announced the B860 series of motherboards for Intel Core Ultra processors (Series 2), which includes models from the ROG Strix, TUF Gaming and Prime families. The value proposition of the ASUS B860 motherboard lineup is off the charts, thanks to its thoroughly modern platform. Users will find features that used to be exclusive to enthusiast-class ASUS motherboards. Every model supports the latest high-bandwidth CUDIMM DDR5 memory kits, ensuring that users can easily get a system up to speed with AEMP III profiles. And PCIe 5.0 connectivity abounds, giving users access to the fastest graphics cards of today and tomorrow.

Those looking to take advantage of the next generation of wireless networking can opt for an ROG Strix or TUF Gaming motherboard equipped with WiFi 7. Faster, smarter and ready for a low-interference connection to a compatible router over the wide-open 6 GHz band, WiFi 7 gives users a whole-home network upgrade. M.2 device support has also been bolstered. Previously released B760 motherboards typically offered two to three M.2 slots, and the fastest maxed out with PCIe 4.0 connectivity. The new ASUS B860 motherboard lineup now includes several options with four M.2 slots, and every model in the series features a PCIe 5.0 M.2 slot ready for a blazing-fast storage drive. Whether users are building a large gaming library, accelerating their creative efforts with dedicated drives for project storage or simply taking advantage of their stack of M.2 drives from previous builds, they will appreciate the comprehensive storage options available with ASUS B860 motherboards.

In the first week of the 2025 International CES, Intel and AMD are expected to expand their desktop processor product stacks, with the introduction of 65 W models; and with them, more affordable motherboard chipset models. AMD is expected to launch the AMD B850 and AMD B840; while Intel debuts the Intel B860 and H810. Board Channels, a site that tracks hardware launches at the retail channel level, says that AMD is expected to set January 15 as the market availability date for motherboards based on the AMD B850 and B840. The chipset will be announced at AMD's January 7th event.

Meanwhile, Intel is expected to announce its mid-range Intel B860 and entry-level Intel H810 on its own event slated for January 7, but with product availability on January 13. The AMD B850 is essentially a rebadged B650, but motherboard vendors can optionally enable Gen 5 PEG instead of Gen 4, at which point the platform would essentially be an AMD X870, but without the mandatory discrete USB4 host controller. The AMD B850 supports CPU overclocking. The AMD B840 lacks this, and is functionally similar to the AMD B550 chipset from the Socket AM4 platform, except that it lacks CPU overclocking support. Meanwhile, the Intel B860 is expected to feature a similar I/O as the Intel B760 from the Socket LGA1700 platform. The H810 is expected to be a lean entry-level option. Both the Intel B860 and H810 are expected to lack CPU overclocking support, but the B860 probably retains memory overclocking capability.

Here are some of the first pictures of ASRock's upcoming Live Mixer series motherboards based on mid-range chipsets from AMD and Intel. The Live Mixer brand of motherboards has a similar positioning in ASRock's product stack as Steel Legend, but with a variation in product design, and a mid-range onboard audio solution that uses audio codecs such as the ALC1200 or ALC4080. There's nothing that particularly stands out in this audio solution (no fancy amp circuits or exotic I/O). The B850 Live Mixer Wi-Fi is an ATX board based on the AMD B850 chipset. This is essentially a re-brand of the popular B650, but with out-of-the-box support for the latest Ryzen 9000 series processors, including the 9000X3D series. The board offers three M.2 NVMe slots, one of which is Gen 5, and the others Gen 4. The WLAN solution is very likely Wi-Fi 6E.

Next up, is the ASRock B860 Live Mixer Wi-Fi. This Socket LGA1851 motherboard is based on Intel's mid-range chipset for its "Arrow Lake" processors, the Intel B860. Much like the previous generation B760, it is expected to lack CPU overclocking support. This board visually looks a lot similar to its AMD B850-based sibling, you could almost confuse the two if you're not looking at the CPU socket. You get three M.2 NVMe slots here, too; one of which is Gen 5, and doesn't eat into the x16 PEG slot. We expect this board to offer Wi-Fi 6E, just like the B850 Live Mixer Wi-Fi. Lastly, there's the B860M Live Mixer Wi-Fi, a Micro-ATX variant of this board, with mostly the same feature-set, it's just that the third M.2 slot is without a heatsink; and the second PCIe slot is physically x8 instead of x16, which shouldn't matter since the slot is likely electrical x4 on both motherboard models. Intel and AMD are expected to debut the B850 and B860 in January.

Intel is preparing a complete refresh of its desktop platform this year, with the introduction of the Core Ultra 200 series processors based on the "Arrow Lake" microarchitecture. The company skipped a desktop processor based on "Meteor Lake," probably because it didn't meet the desired multithreaded performance targets for Intel as it maxed out at 6P+8E+2LP, forcing Intel to come up with the 14th Gen Core "Raptor Lake Refresh" generation to see it through 2H-2023 and at least three quarters of 2024. The company, in all likelihood, will launch the new "Arrow Lake-S" Core Ultra 200 series toward late-Q3 or early-Q4 2024 (September-October). The first wave will include the overclocker-friendly K- and KF SKUs, alongside motherboards based on the top Intel Z890 chipset. 2025 will see the series ramp to more affordable processor models, and mainstream chipsets, such as the B860. These processors require a new motherboard, as Intel is introducing the new Socket LGA1851 with them.

Core configurations of the "Arrow Lake-S" chip surfaced on the web thanks to Jaykihn, a reliable source with Intel leaks. In its maximum configuration, the chip is confirmed to feature 8 P-cores, and 16 E-cores. There are no low-power island E-cores. Each of the 8 P-cores is a "Lion Cove" featuring 3 MB of dedicated L2 cache; while each the E-cores are "Skymont," arranged in 4-core modules that share 4 MB L2 caches among them. Intel claims that the "Lion Cove" P-core offers a 14% IPC increase over the "Redwood Cove" P-core powering "Meteor Lake," which in turn had either equal or a 1% IPC regression compared to "Raptor Cove." This would put "Lion Cove" at a 13-14% IPC advantage over the "Raptor Cove" cores. It's important to note here, that the "Lion Cove" P-cores lack HyperThreading, so Intel will be banking heavily on the "Skymont" E-cores to shore up generational multithreaded performance increase. "Skymont" was a show-stopper at Intel's Computex event, with a nearly 50% IPC gain over previous generations of Intel E-cores, which puts it at par with the "Raptor Cove" cores in single-thread performance.

Intel's upcoming Core Ultra "Arrow Lake-S" desktop processor introduces a new socket, the LGA1851, alongside the new Intel 800-series desktop chipset. We now have some idea what the 151 additional pins on the new socket are used for, thanks to a leaked platform map on the ChipHell forums, discovered by HXL. Intel is expanding the number of PCIe lanes from the processor. It now puts out a total of 32 PCIe lanes.

From the 32 PCIe lanes put out by the "Arrow Lake-S" processor's system agent, 16 are meant for the PCI-Express 5.0 x16 PEG slot to be used for discrete graphics. Eight are used as chipset bus, technically DMI 4.0 x8 (these are eight lanes that operate at Gen 4 speed for 128 Gbps per direction of bandwidth). There are now not one, but two CPU-attached M.2 NVMe slots possible, just like on the AMD "Raphael" and "Granite Ridge" processors. What's interesting, though, is that not both are Gen 5. One of these is Gen 5 x4, while the other is Gen 4 x4.

We've known for a while that the Z890 will be Intel's next-generation high-end desktop motherboard chipset for the Core Ultra "Arrow Lake-S" desktop processors in the LGA1851 package, and that Intel's first wave of processors and motherboards will target PC enthusiasts like they usually do—with just the unlocked K/KF processor SKUs and motherboards based on the Z890. We are now learning that the B860 will indeed be the company's mid-tier chipset for the processor. MSI has registered at least four motherboard models based on the B860, which showed up on Device Report.

These four motherboard models are the MPG B860M Edge Ti WiFi, the MPG B860I Edge WiFi, the MAG B860 Tomahawk WiFi, and the MAG B860M Mortar WiFi, with MSI internal product numbers 7E38, 7E39, 7E40, and 7E43, respectively. There's no word on whether B860 will even be available when the processors debut. Going by past trends, the mid-tier chipset and 65 W-class processor SKUs usually come out in the Q1 following a new processor generation launch, which means we could see these sometime early-2025. The B860 will lack CPU overclocking capabilities, and probably feature a narrower chipset bus, and fewer PCIe general purpose lanes than the Z890. As for MSI's Z890 motherboard lineup, there are at least eight models recorded—the MEG Z890 GODLIKE, the MEG Z890 Ace, MEG Z890 Unify-X, MPG Z890 Carbon WiFi, MPG Z890 Edge Ti WiFi, MPG Z890I Edge Ti WiFi, MAG Z890 Tomahawk WiFi, and the PRO Z890-P WiFi.