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AMD Radeon RX 9060 XT Reportedly Capable of Boosting Up To 3.3 GHz, New Leak Suggests "Navi 44 XT" GPU

AMD has not publicly announced its Radeon RX 9060 XT 16 GB and 8 GB graphics cards, but board partners have inadvertently "revealed" the existence of forthcoming custom designs. Team Red's RDNA 4 kick-off events did tease a second quarter launch of a Radeon RX 9060 Series cards, but have remained coy since the conclusion of late February celebrations. Over a month ago, VideoCardz cited AIB insider knowledge—regarding early specification details. In this morning's follow-up report, unnamed board partner moles have theorized a possible public unveiling of Radeon RX 9060 XT models: at next month's Computex 2025 trade show. Industry watchdogs believe that Team Red's lower end RDNA 4 are specced to compete closely with Team Green's GeForce RTX 5060 Ti lineup. NVIDIA and involved AIBs are reportedly gearing up for a retail launch this week.

The latest leak suggests AMD's Radeon RX 9060 XT design being readied—as standard—with (reference) game clock frequencies set at 2620 MHz, and boost clocks going up to 3230 MHz. In addition, VideoCardz has heard mutterings about "overclocked variants" boosting up to the 3.3 GHz mark. The much-rumored Navi 44 GPU die could sport 2048 stream processors—half of Navi 48's full SP count. Prior to this week, TechPowerUp's GPU database entry indicated the utilization of a speculative "Navi 48 LE" unit. Now amended, the Radeon RX 9060 XT listing mentions a tentative "Navi 44 XT" variant. Leaked guideline info allegedly specifies 500 W power supplies, as minimum requirements for incoming cards. A 550 W base level could be advised for overclocked/overengineered models. VideoCardz did not see any 16-pin power connected SKUs within leaked material; "most specs" feature 8-pin power connectors.

AMD Instinct GPUs are Ready to Take on Today's Most Demanding AI Models

Customers evaluating AI infrastructure today rely on a combination of industry-standard benchmarks and real-world model performance metrics—such as those from Llama 3.1 405B, DeepSeek-R1, and other leading open-source models—to guide their GPU purchase decisions. At AMD, we believe that delivering value across both dimensions is essential to driving broader AI adoption and real-world deployment at scale. That's why we take a holistic approach—optimizing performance for rigorous industry benchmarks like MLperf while also enabling Day 0 support and rapid tuning for the models most widely used in production by our customers.

This strategy helps ensure AMD Instinct GPUs deliver not only strong, standardized performance, but also high-throughput, scalable AI inferencing across the latest generative and language models used by customers. We will explore how AMD's continued investment in benchmarking, open model enablement, software and ecosystem tools helps unlock greater value for customers—from MLPerf Inference 5.0 results to Llama 3.1 405B and DeepSeek-R1 performance, ROCm software advances, and beyond.

NVIDIA Mandates TDP Transparency for GeForce RTX 50 Series "Blackwell" Laptop GPUs

According to ComputerBase, NVIDIA now requires laptop makers to clearly share full graphics power details for its upcoming GeForce RTX 50 Series "Blackwell" GPUs. This aims to fix long-standing issues with hidden performance limits that have led to unexpected differences between laptops with the same GPU model. In the past, many laptop makers did not provide complete information about total graphics power (TGP). This often meant that some lower-powered models performed better than higher-end ones because the power limits were unclear. Under the new guidelines, manufacturers must list important details such as base TGP, Dynamic Boost limits, and clock speeds on their product pages. NVIDIA said, "We work with laptop manufacturers to ensure they list graphics power on their product websites."

Companies like ASUS, MSI, and XMG have already started to show full specifications for models such as the ROG Scar 18 and Titan 18 HX. While most companies are following the rules, some remain unchanged. For example, Razer's Blade 16 (2025) initially left out the base TGP from its main specifications, hiding it in the product description. This can confuse buyers, as thinner laptop designs might use lower-powered GPUs even in high-end models. The fix for this issue is simple, and listing TGP and TDP values will ensure that gamers who plan on getting a laptop with a new RTX 50 series Blackwell GPU will choose their desired TDP for performance and power on the go aspects.

ASUS Introduces New "AI Cache Boost" BIOS Feature - R&D Team Claims Performance Uplift

Large language models (LLMs) love large quantities of memory—so much so, in fact, that AI enthusiasts are turning to multi-GPU setups to make even more VRAM available for their AI apps. But since many current LLMs are extremely large, even this approach has its limits. At times, the GPU will decide to make use of CPU processing power for this data, and when it does, the performance of your CPU cache and DRAM comes into play. All this means that when it comes to the performance of AI applications, it's not just the GPU that matters, but the entire pathway that connects the GPU to the CPU to the I/O die to the DRAM modules. It stands to reason, then, that there are opportunities to boost AI performance by optimizing these elements.

That's exactly what we've found as we've spent time in our R&D labs with the latest AMD Ryzen CPUs. AMD just launched two new Ryzen CPUs with AMD 3D V-Cache Technology, the AMD Ryzen 9 9950X3D and Ryzen 9 9900X3D, pushing the series into new performance territory. After testing a wide range of optimizations in a variety of workloads, we uncovered a range of settings that offer tangible benefits for AI enthusiasts. Now, we're ready to share these optimizations with you through a new BIOS feature: AI Cache Boost. Available through an ASUS AMD 800 Series motherboard and our most recent firmware update, AI Cache Boost can accelerate performance up to 12.75% when you're working with massive LLMs.

Japan Plans to Invest $65 Billion to Boost Its Chip Industry

Japan has proposed a $65 billion (or more) plan to strengthen the semiconductor and AI industries in the country through grants and financial support by fiscal year 2030. The government plans to present this proposal at the next parliamentary session. The draft includes support for mass production of next-generation chips, focusing on AI chipmakers such as Rapidus, the government estimates an economic impact of about 160 trillion yen from this investment. Rapidus plans to start mass production of advanced chips in Hokkaido from 2027 and will work with IBM and Belgian research organization Imec.

According to the report from Reuters, Prime Minister Shigeru Ishiba said the government would not issue deficit-financing bonds to fund the support plan, although specific financial details are not yet known. The new initiative builds on last year's 2 trillion yen investment in the chip industry, and it is part of a broader economic package. Expected to be approved by the Cabinet on November 22, the plan calls for combined public and private investment in the semiconductor industry of more than 50 trillion yen over the next decade.

AMD Ryzen 7 9800X3D To Feature Significant Clock Speed Boost

We've known about the upcoming AMD Ryzen 7 9800X3D for a good long while now, and previous leaks and rumors indicated that it would offer a rather significant boost in gaming performance thanks to changes to the 3D V-cache amounts and layouts. Now, a new leak, which purports to show off the official retail packaging for the new CPU, suggests that clock speeds will get a boost over the existing AMD Ryzen 7 78000X3D.

The leak, shared by Moore's Law Is Dead on YouTube, shows off a supposed retail box for the AMD Ryzen 7 9800X3D that was sent to AMD's partners for marketing, and along with that, he claims to have had access to the entire marketing slide deck, which is where the frequency boost information comes from. According to the leaker, the 9800X3D's marketing material specifically calls out the processor as being "designed for increased frequencies."

AMD Ryzen 9000 Zen 5 CPUs Set for Power Boost, AGESA Update Increasing TDP up to 105W

Recent reports suggest that AMD's Zen 5 desktop processors may soon receive a significant power upgrade. The upcoming AGESA 1.2.0.1A Patch A is rumored to increase the default power limits (TDP) from 65 W to 105 W for certain models, specifically the 8-core Ryzen 7 9700X and the 6-core Ryzen 5 9600X. This development comes as a surprise given that the first reviews of the Ryzen 9000 series were published just last week, with lower power consumption praised as a major advantage over previous generations. The potential TDP increase, while not as high as the 120 W initially rumored for the 9700X, still represents a substantial boost in power allocation.

The rationale behind this significant TDP increase appears to be addressing the lower than expected performance of the Ryzen 7 9700X and Ryzen 5 9600X compared to their predecessors. Initial testing showed that both CPUs performed similarly to earlier models, especially in gaming scenarios, with notable improvements only visible when using Precision Boost Overdrive (PBO). Even at 65 W, the Ryzen 7 9700X struggled to outpace the 7800X3D in gaming performance, highlighting the need for improved power delivery.

China Launches Massive $47.5 Billion "Big Fund" to Boost Domestic Chip Industry

Beijing has doubled down on its push for semiconductor self-sufficiency with the establishment of a new $47.5 billion investment fund to accelerate growth in the domestic chip sector. The fund, officially registered on May 24th under the name "China Integrated Circuit Industry Investment Fund Phase III", represents the largest of three state-backed vehicles aimed at cultivating China's semiconductor capabilities. The announcement comes as tensions over advanced chip technology continue to escalate between the U.S. and China. Over the past couple years, Washington has steadily ratcheted up export controls on semiconductors to Beijing over national security concerns about potential military applications. These measures have lent new urgency to China's quest for self-sufficiency in chip design and manufacturing.

With a war chest of 344 billion yuan ($47.5 billion), the "Big Fund" dwarfs the combined capital of the first two semiconductor investment vehicles launched in 2014 and 2019. Officials have outlined a multipronged strategy targeting key bottlenecks, focusing on equipment for chip fabrication plants. The fund has bankrolled major projects such as flash memory maker Yangtze Memory Technologies and leading foundries like SMIC and Huahong. China's homegrown chip industry still needs to catch up to global leaders like Intel, Samsung, and TSMC. However, the immense scale of state-directed capital illustrates Beijing's unwavering commitment to developing a self-reliant supply chain for semiconductors—a technology viewed as indispensable for economic and military competitiveness. News of the "Big Fund" sent Chinese chip stocks surging over 3% on hopes of fresh financing tailwinds.

GIGABYTE Launches AORUS 16X AI Gaming Laptop

The highly anticipated AORUS 16X, a brand-new 16-inch AI gaming laptop unveiled by the world's leading computer brand, GIGABYTE, is now available. Powered by the latest Intel Core 14th gen HX processor and NVIDIA GeForce RTX 40 series laptop GPU, AORUS 16X sets a new standard for performance. Equipped with GIGABYTE AI Nexus technology, it optimizes power management and gaming performance while enhancing generative AI applications. Boasting patented innovations like the 4-sided Super-slim Bezel design and supporting Dolby Atmos and Dolby Vision, it creates a cinematic audiovisual experience unparalleled in its class. It holds the TÜV Rheinland Eye Comfort Certification and Pantone Validated color accuracy certification, which provide high comfort and confidence for extended use.

The AORUS 16X is powered by the latest Intel Core i9 processor 14900HX and NVIDIA GeForce RTX 4070 dedicated graphics card. With a maximum graphic power of up to 140 W, it provides unmatched performance for gaming and creative tasks. The inclusion of NVIDIA Advanced Optimus technology (DDS) ensures seamless switching between integrated and dedicated graphics for optimal performance. Additionally, the WINDFORCE Infinity Cooling technology features the Icy Touch design and 0dB Cooling, enabling efficient heat dissipat ion during heavy loads, or maintaining a noise-free environment during low loads.

Report: Global Semiconductor Capacity Projected to Reach Record High 30 Million Wafers Per Month in 2024

Global semiconductor capacity is expected to increase 6.4% in 2024 to top the 30 million *wafers per month (wpm) mark for the first time after rising 5.5% to 29.6 wpm in 2023, SEMI announced today in its latest quarterly World Fab Forecast report.

The 2024 growth will be driven by capacity increases in leading-edge logic and foundry, applications including generative AI and high-performance computing (HPC), and the recovery in end-demand for chips. The capacity expansion slowed in 2023 due to softening semiconductor market demand and the resulting inventory correction.

Contract Prices Bottom Out in Q3, Reigniting Buyer Momentum and Boosting DRAM Revenue by Nearly 20%, Notes Report

TrendForce investigations reveal a significant leap in the DRAM industry for 3Q23, with total revenues soaring to US$13.48 billion—marking 18% QoQ growth. This surge is attributed to a gradual resurgence in demand, prompting buyers to re-energize their procurement activities. Looking ahead to Q4, while suppliers are firmly set on price hikes, with DRAM contract prices expected to rise by approximately 13-18%, demand recovery will not be as robust as in previous peak seasons. Overall, while there is demand for stockpiling, procurement for the server sector remains tentative due to high inventory levels, suggesting limited growth in DRAM industry shipments for Q4.

Three major manufacturers witnessed Q3 revenue growth. Samsung's revenue increased by about 15.9% to US$5.25 billion thanks to stable demand for high-capacity products fueled by AI advancements and the rollout of its 1alpha nm DDR5. SK hynix showcased the most notable growth among manufacturers with a 34.4% increase, reaching about US$4.626 billion and significantly narrowing its market share gap with Samsung to less than 5%. Micron's revenue rose by approximately 4.2% to US$3.075 billion—despite a slight drop in ASP—supported by an upswing in demand and shipment volumes.

AMD Software Adrenalin 23.9.1 WHQL Released with Anti-Lag+, Boost, and HYPR-RX

AMD has released the latest version of the Adrenalin software, the version 23.9.1 WHQL. The new AMD Software Adrenalin Edition 23.9.1 WHQL adds support for Radeon RX 7700 and RX 7800 series graphics cards which will be available as of today, as well as adds support for AMD Radeon Anti-Lag, Radeon Boost, and AMD HYPR-RX features.

The AMD Radeon Anti-Lag+ initially supports 12 games, including Apex Legends, Overwatch 2, Dying Light 2, Shadow of the Tomb Raider, Rise of the Tomb Raider, Resident Evil 4, Ghostwire: Tokyo, Fortnite, Last of Us: Part 1, Star Wars Jedi: Survivor, Resident Evil 3, and Borderlands 3, with more promised in the coming months. It also adds support for AMD HYPER-X, a one click solution which combines AMD Radeon Anti-Lag+, Boost, and Radeon Super Resolution to achieve improved performance and latency reduction.

DOWNLOAD: AMD Software Adrenalin 23.9.1 WHQL for AMD Radeon RX 7700 XT and RX 7800 XT
DOWNLOAD: AMD Software Adrenalin 23.9.1
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