GEEKOM, a Taiwanese tech company famous for making high quality mini PCs, is heading to CES for the second consecutive year in 2025 with an exciting lineup of new products. Known as the Green Mini PC Global Leader, GEEKOM always focuses on improving the quality and reliability of its products, and it also spares no effort in cutting down carbon emissions and making the world a greener place.

Among the many mini PCs that GEEKOM plans to put on show at CES 2025, there are many industry firsts. The GEEKOM QS1, for instance, is the world's first mini PC powered by a Qualcomm chipset. The tiny computer sports an Arm-based Qualcomm Snapdragon X1E-80-100 processor with twelve 4.0 GHz Oryon CPU cores, a 3.8 TFLOPS Adreno X1-85 GPU and a 45 TOPS Hexagon NPU. It is smart and fast enough to breeze through all of your daily home and office computing chores, yet energy-efficient enough to significantly cut down your electric bill.

GEEKOM, a Taiwanese tech company also known as the Green Mini PC Global Leader, recently released a strong lineup of flagship mini PCs with Intel Core Ultra processors and dual Ethernet ports, making it possible for users to enjoy impeccable performance and superb networking functionalities at the same time.

One of these mini PCs is the GEEKOM GT1 Mega, which employs a beautiful aluminum chassis with plenty of I/O, including two full-function 40 Gbps USB4 Type-C, six USB Type-A, 2 HDMI2.0, a 3.5 mm audio jack, an SD card reader and dual Ethernet ports. The two Ethernet jacks are both of 2.5 Gbps standard, which not only delivers high-speed and reliable internet connection for people's daily computing chores, but also enables the mini PC to serve more sophisticated networking functionalities as a soft router, a virtual machines, a hardware firewall, or even a home server. Besides, dual Ethernet ports can separate internal and external network connections, providing logical and physical separation of trusted and untrusted network traffic and keeping data safe from potential cyber-attacks.

With the XMG FUSION 15 and CORE 15, XMG unveils its first 15.3-inch laptops in 16:10 format. The two compact devices, which are very similar except for a few details, differ primarily regarding their CPUs: the FUSION 15 is powered by Intel's Core i9-14900HX or i7-14650HX and either an NVIDIA GeForce RTX 4060 or 4070, while the CORE 15 combines an AMD Ryzen 7 8845HS with an RTX 4060. Apart from that, the gaming laptops, which weigh around 2 kg and are 21.9 mm high, offer a WQXGA display with a brightness of 500 nits and an almost entirely aluminium chassis with a clean and elegant design.

The design language of the XMG FUSION 15 (E24) and the XMG CORE 15 (M24) focuses on understated elegance. The laptops share an identical, black anodised and torsion-resistant aluminium chassis. At 342.5 x 245 x 21.9 mm, these two 15.3-inch devices are very compact, while a reduced weight of just 2.0 kg (XMG CORE 15) or 2.1 kg (XMG FUSION 15) offers good portability.

Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, delivers an expanded portfolio of purpose-built infrastructure solutions to accelerate performance and increase efficiency in 5G and telecom workloads. With one of the industry's most diverse offerings, Supermicro enables customers to expand public and private 5G infrastructures with improved performance per watt and support for new and innovative AI applications. As a long-term advocate of open networking platforms and a member of the O-RAN Alliance, Supermicro's portfolio incorporates systems featuring 5th Gen Intel Xeon processors, AMD EPYC 8004 Series processors, and the NVIDIA Grace Hopper Superchip.

"Supermicro is expanding our broad portfolio of sustainable and state-of-the-art servers to address the demanding requirements of 5G and telco markets and Edge AI," said Charles Liang, president and CEO of Supermicro. "Our products are not just about technology, they are about delivering tangible customer benefits. We quickly bring data center AI capabilities to the network's edge using our Building Block architecture. Our products enable operators to offer new capabilities to their customers with improved performance and lower energy consumption. Our edge servers contain up to 2 TB of high-speed DDR5 memory, 6 PCIe slots, and a range of networking options. These systems are designed for increased power efficiency and performance-per-watt, enabling operators to create high-performance, customized solutions for their unique requirements. This reassures our customers that they are investing in reliable and efficient solutions."

As one of the leading brands in the mini PC industry, GEEKOM has released lots of premium products in the last couple of years. The latest addition to their incredibly diverse lineup is the GEEKOM A7, a 4x4 PC system that features a powerful AMD Phoenix Ryzen 7040 chip, a PCIe Gen 4 SSD, DDR5-5600 MHz RAM, and many other cutting-edge technologies.

The GEEKOM A7's unibody aluminium housing measures only 112.4*112.4*37 mm (0.47 liters). The rounded corners and matte silver coating give the mini PC a soft but gorgeous look, making it particularly attractive to female users. With a footprint smaller than a book, the A7 easily fits into all kinds of desktop arrangement and can be conveniently transported from one place to another.

During CES, PCWorld had a chat with Donny Woligroski, Technical Marketing Manager at AMD. The new Ryzen 8000G APUs were a large part of what covered in the almost 17 minute long video and PCWorld got some details that weren't covered in the official press materials that AMD released at the launch. The officially supported memory speed listed by AMD is DDR5-5600, which is a step up from the official speed of DDR5-5200 for the Ryzen 7000-series CPUs.

However, we know that the Ryzen 7000-series is more than happy to use faster memory and as before, AMD has an unofficial memory sweet spot and just as with the Ryzen 7000-series, the Ryzen 8000G-series of APUs has a memory sweet spot of DDR5-6000. That said, it's unknown if the Ryzen 8000G-series will support faster memory or will start flaking out above DDR5-6000, like many Ryzen 7000-series CPUs do unless you switch to a 1:2 ratio. Woligroski is also pointing out that dual-channel is a must to get the best performance out of the new APUs, although this shouldn't really surprise anyone. Full video after the break.

ASUS IoT, the global AIoT solution provider, today announced the launch of industry-leading ultra-compact edge computers and embedded boards with the all-new Intel Core Ultra processors. This lineup comprises the C7146ES-IM-AA, C5143ES-IM-AA single-board computer (SBC), EBS-S500W edge computer and PE2200U ultra-compact fanless embedded computer - offering AI-ready CPU, GPU and NPU enhancements, coupled with remarkable power efficiency. These solutions cater to a wide range of applications such as smart retail, traffic analysis, medical imaging, utility management and edge AI, exemplifying ASUS IoT's commitment to enabling next-generation AI capabilities at the edge.

"ASUS IoT is proud to present our leading solutions to the market, enabling easy deployment of next-generation AI capabilities at the edge," said KuoWei Chao, General Manager of ASUS IoT Business Group. "By collaborating with Intel, ASUS IoT solutions can provide faster AI results, support more media streams per device and ensure long-term value through product longevity."

ASRock Industrial releases the NUC Ultra 100 Motherboard Series with breakthrough powered by Intel Core Ultra processors (Meteor Lake-H). Presenting a 3D performance hybrid architecture that supports up to 14 cores and 20 threads, complemented by the latest integrated Intel ARC Graphics and the pioneering Intel NPU AI engine. The NUC Ultra 100 Motherboard Series are designed in NUC form factor, providing two DDR5-5600 MHz memory up to 96 GB, triple storages, 4K quad displays, 2.5G dual LAN, one USB4/Thunderbolt, and four USB 3.2 Gen 2. This advancement expands into enhanced creativity, efficiency, and collaboration using AI across diverse areas such as entertainment, corporate functions, smart retail, kiosks, digital signage, smart cities, embedded industries, Edge AIoT applications, and more.

The NUC Ultra 100 Motherboard Series encompass NUC-155H and NUC-125H models, powered by Intel Core Ultra 7/5 processors 155H/125H (Meteor Lake-H). The Series feature the upgraded dual-channel SO-DIMM DDR5 5600 MHz up to 96 GB memory, plus support for up to 4K quad displays with one DP 2.1 (from USB4), one DP 1.4a (from Type-C), and two HDMI 2.0b with Intel ARC Graphics, providing immersive experience. Notable upgrades extend to the triple storages of one M.2 Key M (2242/2280), one M.2 Key M (2242) with PCIe Gen4x4 for SSD, and one SATA 3.0. Moreover, rich I/O connectivity and expansion include one USB4/Thunderbolt 4, four USB 3.2 Gen 2 (Type-C/Type-A), 2.5G dual LAN, and one M.2 Key E (2230) with PCIe x1, USB 2.0 and CNVi for wireless. The Series also provide 12-24 V DC-in jack for flexible power input, -20°C ~ 70°C wide operating temperature, plus TPM support with Intel Platform Trust Technology (PTT) for enhanced security.

Chinese chipmaker Montage Technology has unveiled new data center processors under its Jintide brand based on Intel's latest Emerald Rapids Xeon architecture. The 5th generation Jintide lineup offers anywhere from 16-core to 48-core options for enterprise customers needing advanced security specific to China's government and enterprise requirements. Leveraging a long-running joint venture with Intel, Jintide combines standard high-performance Xeon microarchitectures with added on-die monitoring and encryption blocks, PrC (Pre-check) and DSC (Dynamic Security Check), which are security-hardened for sensitive Chinese use cases. The processors retain all core performance attributes of Intel's vanilla offerings thanks to IP access, only with extra protections mandated by national security interests. While missing the very highest core counts, the new Jintide chips otherwise deliver similar Emerald Rapids features like 8-channel DDR5-5600 memory, 80 lanes of speedy PCIe 5.0, and elevated clock speeds over 4.0 GHz at peak. The Jintide processors have 2S scaling, which allows for dual-socket systems with up to 96 cores and 192 threads.

Pricing remains unpublished but likely carries a premium over Intel list prices thanks to the localized security customization required. However, with Jintide uniquely meeting strict Chinese government and data regulations, cost becomes secondary for target customers needing compliant data center hardware. After matching lockstep with Intel's last several leading Xeon generations, Jintide's continued iteration highlights its strategic value in enabling high-performance domestic infrastructure as China eyes IT supply chain autonomy. Intel gets expanded access to the growing Chinese server market, while Chinese partners utilize Intel IP to strengthen localized offerings without foreign dependency. It manifests the delicate balance of advanced chip joint ventures between global tech giants and rising challengers. More details about the SKUs are listed in the table below.

TYAN, a leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced upgraded server platforms and motherboards based on the brand-new 5th Gen Intel Xeon Scalable Processors, formerly codenamed Emerald Rapids.

5th Gen Intel Xeon processor has increased to 64 cores, featuring a larger shared cache, higher UPI and DDR5 memory speed, as well as PCIe 5.0 with 80 lanes. Growing and excelling with workload-optimized performance, 5th Gen Intel Xeon delivers more compute power and faster memory within the same power envelope as the previous generation. "5th Gen Intel Xeon is the second processor offering inside the 2023 Intel Xeon Scalable platform, offering improved performance and power efficiency to accelerate TCO and operational efficiency", said Eric Kuo, Vice President of Server Infrastructure Business Unit, MiTAC Computing Technology Corporation. "By harnessing the capabilities of Intel's new Xeon CPUs, TYAN's 5th-Gen Intel Xeon-supported solutions are designed to handle the intense demands of HPC, data centers, and AI workloads.

Thermaltake announced the ToughRAM RC DDR5 memory kit in its first non-binary (24 GB of 48 GB) capacity. Model number RA50D524GX2-5600C46A comes with a capacity of 48 GB (2x 24 GB), and supports both Intel XMP and AMD EXPO profiles for a frequency of DDR5-5600 with timings of 46-46-46-90 at 1.1 V. The modules lack any RGB lighting but come with preparation for the company's Floe RC liquid cooling for memory; or an RGB lighting kit. Thermaltake is backing these with lifetime warranty. We expect a street price of $150.

Marvell Technology, a leader in data infrastructure semiconductor solutions, is enabling networking equipment and firewall manufacturers achieve breakthrough levels of performance and efficiency with two new OCTEON 10 data processing units (DPUs), the OCTEON 10 CN102 and OCTEON 10 CN103. The 5 nm OCTEON CN102 and CN103, broadly available to OEMs for product design and pilot production, are optimized for data and control plane applications in routers, firewalls, 5G small cells, SD-WAN appliances, and control plane applications in top-of-rack switches and line card controllers. Several of the world's largest networking equipment manufacturers have already incorporated the OCTEON 10 CN102 into a number of product designs.

Containing up to eight Arm Neoverse N2 cores, OCTEON 10 CN102 and CN103 deliver 3x the performance of Marvell current DPU solutions for devices while reducing power consumption by 50% to 25 W. Achieving SPEC CPU (2017) integer rate (SPECint) scores of 36.5, OCTEON 10 CN102 and CN103 are able to deliver nearly 1.5 SPECint points per Watt. The chips can serve as an offload DPU for host processors or as the primary processor in devices; advanced performance per watt also enables OEMs to design fanless systems to simplify systems and further reduce cost, maintenance and power consumption.

Thanks to the leaked slides obtained by @InstLatX64, we have more details and some performance estimates about Intel's upcoming 5th Generation Xeon "Emerald Rapids" CPUs, boasting a significant performance leap over its predecessors. Leading the Emerald Rapids family is the top-end SKU, the Xeon 8592+, which features 64 cores and 128 threads, backed by a massive 480 MB L3 cache pool. The upcoming lineup shifts from a 4-tile to a 2-tile design to minimize latency and improve performance. The design utilizes the P-Core architecture under the Raptor Cove ISA and promises up to 40% faster performance than the current 4th Generation "Sapphire Rapids" CPUs in AI applications utilizing Intel AMX engine. Each chiplet has 35 cores, three of which are disabled, and each tile has two DDR5-5600 MT/s memory controllers, which operate two memory channels each and translating that into eight-channel design. There are three PCIe controllers per die, making it six in total.

Newer protocols and AI accelerators also back the upcoming lineup. Now, the Emerald Rapids family supports the Compute Express Link (CXL) Types 1/2/3 in addition to up to 80 PCIe Gen 5 lanes and enhanced Intel Ultra Path Interconnect (UPI). There are four UPI controllers spread over two dies. Moreover, features like the four on-die Intel Accelerator Engines, optimized power mode, and up to 17% improvement in general-purpose workloads make it seem like a big step up from the current generation. Much of this technology is found on the existing Sapphire Rapids SKUs, with the new generation enhancing the AI processing capability further. You can see the die configuration below. The 5th Generation Emerald Rapids designs are supposed to be official on December 14th, just a few days away.

Uptake on AMD's latest generation mobile offerings has been slow and steady to put it mildly, but today TUXEDO Computers, a specialist in Linux notebooks at a range of performance and pricing tiers, has announced pre-orders for their new Sirius 16 gaming laptop. This machine combines AMD's latest generation Ryzen 7 7840HS "Phoenix" APU with a Radeon RX 7600M XT RDNA3 GPU inside a sleek all aluminium chassis design that strives to remain understated while still providing a "sleek gamer look" via programmable RGB keys. The Sirius 16 is TUXEDO's first go at an all-AMD configuration and they've held very little back, choosing to allow the full TDP rating of the Phoenix APU at 54 W sustained (or 80 W CPU-only turbo) as well as keeping the RDNA3 GPU at its rated 120 W TGP under full CPU+GPU loads. The Sirius 16 features venting out of both sides as well as the rear of the chassis, and roughly half of the bottom panel is open intake for the dual-fan cooling system.

Powering everything is a 230 W power brick and an 80 Wh replaceable battery bolted inside the chassis. TUXEDO claims up to 10 hours of battery life at minimum display brightness with wireless disabled and without any programmable lighting enabled, or a more realistic 6 hours at medium brightness with wireless enabled and under minimal "office work" load.

"Strix Point" is the codename for AMD's next-generation mobile processor succeeding the current Ryzen 7040 series "Phoenix." More details of the processor emerged thanks to "All The Watts!!" on Twitter. The CPU of "Strix Point" will be heterogenous, in that it will feature two different kinds of CPU cores, but with essentially the same ISA and IPC. It is rumored that the processor will feature 4 "Zen 5" CPU cores, and 8 "Zen 5c" cores.

Both core types feature an identical IPC, but the "Zen 5" cores can hold onto higher boost frequencies, and have a wider frequency band, than the "Zen 5c" cores. From what we can deduce from the current "Zen 4c" cores, "Zen 5c" cores aren't strictly "efficiency" cores, as they still offer the full breadth of core ISA as "Zen 5," including SMT. In its maximum configuration, "Strix Point" will hence be a 12-core/24-thread processor. The two CPU core types sit in two different CCX (CPU core complexes), the "Zen 5" CCX has 4 cores sharing a 16 MB L3 cache, while the "Zen 5c" CCX shares a 16 MB L3 cache among 8 cores. AMD will probably use a software-based solution to ensure the right kind of workload from the OS is processed by the right kind of CPU core.

Intel Innovation 2023 -- Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing future support for the upcoming 5th Gen Intel Xeon processors. In addition, Supermicro will soon offer early shipping and free remote early access testing of the new Systems via its JumpStart Program for qualified customers. To learn more, go to www.supermicro.com/x13 for details. The Supermicro 8x GPU optimized servers, the SuperBlade servers, and the Hyper Series will soon be ready for customers to test their workloads on the new CPU.

"Supermicro's range of Generative High-Performance AI systems, including recently launched GPUs, continues to lead the industry in AI offerings with its broad range of X13 family of servers designed for various workloads, from the edge to the cloud," said Charles Liang, president, and CEO, Supermicro. "Our support for the upcoming 5th Gen Intel Xeon processors, with more cores, an increased performance per watt, and the latest DDR5-5600 MHz memory, will allow our customers to realize even greater application performance and power efficiency for AI, Cloud, 5G Edge, and Enterprise workloads. These new features will help customers accelerate their business and maximize their competitive advantage."

AMD's upcoming Ryzen Threadripper PRO 7985WX "Storm Peak" workstation processor surfaced on Puget Systems PugetBench online database. The 7985WX is a 64-core/128-thread processor based on the "Zen 4" microarchitecture, that's configured with an 8-channel DDR5 memory interface (16 sub-channels), and a 128-lane PCI-Express Gen 5 root-complex. The processor was spotted running on an AMD internal development board codenamed "Boulder Gulch" (AMD uses weird internal codenames to back-trace leaks). The machine had a cool 256 GB of 8-channel DDR5-5600 memory, and an NVIDIA RTX A5000 GPU. AMD is planning to release the Ryzen 7000WX workstation processor series some time in October 2023.

We're excited to announce that we're once again partnering with Computer Upgrade King to provide our attendees with the ability to rent either a monitor and or a full PC set up. As an added bonus to our Elite ticket holders, Computer Upgrade King is offering a special rental package with a 34" Ultrawide Monitor! For more information, and to secure yours today, visit beth.games/43obykp.

Need a rig? Reserve your computer at QuakeCon 2023. It's official! After three years of digital-only events, QuakeCon 2023 will mark the return of the beloved BYOC, in-person at the Gaylord Texan Resort & Convention Center in Grapevine, Texas from Thursday, August 10 through Sunday, August 13.

In keeping with Framework's philosophy, the Framework Laptop 16 has socketed memory and storage, making it easy for you to choose what you need on day one and upgrade to more any time later. Our pre-built configurations have set combinations of memory and storage, while on DIY Edition, you can choose any of the modules we offer in the Marketplace or bring your own if you prefer. We've taken both memory and storage to the next level on Framework Laptop 16. For memory, we've created new semi-custom Framework-branded DDR5-5600 modules. For storage, we have two M.2 slots, as well as the ability to add two more in the Expansion Bay for colossal storage capacity.

One core challenge we aimed to solve for memory on the Framework Laptop 16 was being able to offer the same modules for pre-built systems, DIY Edition, and the Framework Marketplace. Historically, we needed to source separate "OEM" modules from Samsung, SK Hynix, and Micron for use in our factory, and "Retail" modules from Crucial to offer in DIY Edition and the Marketplace. Instead, we worked with memory maker ADATA to create custom-label modules that we can use across all areas. Currently, we're leveraging SK Hynix DDR5-5600 memory chips for these modules, but may use other chips that meet the performance bar in the future as well.