Acer America today announced that its new 20-inch class Veriton Z2640G all-in-one (AIO) commercial desktop is now available for users in business, education and government. The new all-in-one desktops feature a screw-less chassis design and modular components for easy maintenance and upgrades. Removable feet and VESA wall-mount support enable these systems to be hung on the wall to save space, while a flexible frame that tilts from 6 to 60 degrees can be adjusted for maximum viewing comfort. These systems also come with an integrated 2.0 MP Full HD webcam that can be adjusted up to 180 degrees, which is particularly useful when collaborating via web chats with others in the same room.

The Veriton Z2640G series includes two models offering a choice of either Windows 8 Pro or Windows 7 Professional. The Acer Veriton Z2640G-UC1007X comes with an Intel Celeron processor 1007U (2M cache, 1.50 GHz, Dual Core) and 2GB SDRAM DDR3 (expandable to 16GB) and is available for an estimated selling price (ESP) of $539. The Veriton Z2640G-UP2117X with an Intel Pentium Processor 2117U (2M cache, 1.80 GHz, Dual Core) and 4GB DDR3 SDRAM (expandable to 16GB) is available for an ESP for $599.

Rambus Inc., the innovative technology solutions company, and SK Hynix, the world's top tier memory semiconductor supplier, today announced they have signed a five-year patent license agreement for the use of Rambus memory-related patented innovations in SK Hynix semiconductor products and have also settled all outstanding claims. The agreement includes a license to certain DRAM products for payments of $12 million per quarter for the next five years. Other terms of the agreement are confidential.

"This is a milestone agreement for both companies that puts years of legal disputes behind us and gives us the opportunity for collaboration," said Dr. Ron Black, president and chief executive officer at Rambus. "With this agreement, we can focus more on engaging with the industry as we work on future challenges where we can bring invention and value to the market with superior solutions and products."

Crucial, a leading global brand of memory and storage upgrades, today announced the immediate availability of the Crucial Ballistix Sport XT memory, which offers a new aggressively-styled, taller heat spreader design that improves thermal performance. Designed for gamers and enthusiasts looking for fast and responsive performance, Ballistix Sport XT modules offer XMP profiles for advanced speeds and timings as well as easy BIOS configuration in supported systems.

"The Crucial Ballistix Sport series is designed to provide mainstream users and performance enthusiasts with a reliable, no-hassle gaming experience," said Jeremy Mortenson, senior product manager, Crucial. "The new Sport XT memory offers an attractive new heat spreader styling for gamers who are looking for enhanced thermal performance, and a new colour that complements popular motherboards."

Corsair, a worldwide designer of high-performance components to the PC hardware market, today announced the Corsair Vengeance Pro Series of high-performance DDR3 computer memory for PC overclockers, enthusiasts, and system builders. Available initially in capacities up to 64 GB and speeds up to 2933 MHz, the Vengeance Pro Series memory modules are designed to set new levels of value and overclocking performance with the 4th generation Intel Core processor family (codenamed Haswell) and previous generation Intel and AMD platforms.

Vengeance Pro Series memory modules are built with eight-layer PCBs and RAM ICs specially selected for speed and overclocking headroom, and like all Vengeance memory, incorporate XMP 1.3 profiles allow for automatic, reliable overclocking. The memory kits are designed with new aggressively styled, aluminum heat spreaders for superior cooling. The memory kits are available in black with silver, red, blue, or gold accents to enable enthusiasts, gamers, and modders to customize the look of their PCs.

AMD today unveiled a new family of low power server processors: the AMD Opteron X-Series optimized for scale-out server architectures. The first AMD Opteron X-Series processors, formerly known as "Kyoto," are the highest density, most power-efficient small core x86 processors ever built. The new X1150 and X2150 processors beat the top performing Intel Atom processor on key performance benchmarks, including single thread and throughput performance with superior power-efficiency, twice the cores and L2 cache with a more advanced pipeline architecture, higher integration and support for up to 32 gigabytes of DRAM -- 4x more than the Intel Atom processor.

The AMD Opteron X-Series processors come in two variants. The AMD Opteron X2150, which consumes as little as 11 watts, is the first server APU system-on-a-chip integrating CPU and GPU engines with a high-speed bus on a single die. This enables customers to take advantage of leading-edge AMD Radeon HD 8000 graphics technology for multimedia-oriented server workloads. The AMD Opteron X1150, which consumes as little as 9 watts, is a CPU-only version optimized for general scale-out workloads.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, has launched a new DashDrive UV150 USB Flash drive, a value-priced USB 3.0 solution with an attractive pearlescent exterior.

The sleek contour of the UV150 makes the drive as easy in the hand as it is on the eyes, and the USB connector cap snaps in cleanly in the rear of the drive to prevent cap loss. A broad lanyard slot at the base of the drive allows for use with a wider range of carrying straps than is often seen in USB Flash drives. These factors, combined with a weight of only 9g (0.3oz), make the UV150 an essential accessory in today's world of value-driven digital mobility Read transfer speed reaches 90 MB per seconds, provided the needed performance for the most common data storage needs.

Innodisk, a designer and manufacturer of SSDs for commercial and industrial applications, announces a release of the industrial-embedded industry's first SATA device in accordance to SATA µSSD standards - nanoSSD.

Through the integration of a control chip, flash memory and peripheral power components into a single ball grid array (BGA) package, Innodisk has managed to reduce the size of the nanoSSD to approximately 1% the size of a 2.5" SSD. With dimensions of only 16 x 20 x 2 mm (WxLxH), a weight of only 1.5g, SATA III support, capacities ranging from 4 to 64 GB and both x86 and ARM compatibility, nanoSSD can be incorporated into a wide variety of applications where a small form-factor and high transfer rates are important, including industrial mobile devices, embedded systems, tablets, high-end smart phones and Ultrabooks.

Innodisk is proud to be among the first to supply (DDR4) registered DIMM product samples to key server companies for their next-generation systems. With this announcement, Innodisk, an industry leader in DRAM modules for industrial applications and embedded systems, will continue to offer the most advanced technology to its customers. The result of almost eight years of development, DDR4 (Double Data Rate 4) technology improves on the previous generation, DDR3, in every way. These new memory products provide users with greater performance, but can still cut costs by saving power and space, and reducing waste heat.

DDR4 offers a giant leap in peak performance over DDR3 technology, with a 3.2 Gbps data transfer rate. In fact, DDR4 could eventually even surpass this already high rate, according to standards organization JEDEC, in the same way that DDR3 surpassed its initial ceiling of 1.6 Gbps. DDR4 memory bus speeds start at 2133MHz, which already offers a huge jump in potential performance from the average bus speed of 1333MHz and 1666MHz offered by DDR3.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today announced a small but stylish addition to its DashDrive family of USB Flash drives. The new DashDrive Choice UC510 packs durability and charm into a super small and handy profile.

With this new drive, ADATA has once again made the most of Chip on Board (COB) technology, and the result is a highly water-resistant, durable device that is ultra-small and easy to carry. The drive body shines with a metallic gleam, and the capless design eliminates the need for a drive cap and the related chance of cap loss. The UC510 has a USB 2.0 interface, providing the required performance for most common data storage and transfer needs.

SMART Modular Technologies, Inc., a leading independent designer, manufacturer and supplier of value added subsystems including memory modules, flash memory cards and other solid state storage products, today announced the addition of a 24GB CoolFlex RDIMM to its product lineup. The 24GB DDR3-1333 1.35V RDIMM helps solve unique memory capacity constraints in servers. SMART's CoolFlex module product family uses state-of-the-art flexible substrate technology to increase system memory capacity.

Servers configured with two processors and sixteen registered DIMMs are generally limited to a maximum memory capacity of 256GB. When using 16GB DDR3-1333 RDIMMs these systems can be fully populated. However, when switching to 32GB four-rank RDIMMs, the maximum number of DIMMs per Channel (DPC) drops down to one. A system configured with two channels per processor and four DIMMs per channel can only be populated with one 32GB RDIMM per channel for a total memory capacity of 128GB. SMART's new 24GB Coolflex RDIMM solves this constraint by allowing these systems to be fully populated with sixteen 24GB RDIMMs totaling 384GB and representing a 50% increase in memory capacity.

With its 4th generation Core "Haswell" processors, Intel is putting in a serious effort to improve integrated graphics (IGP) performance to catch up with AMD's Radeon HD 8600 series on its latest APUs. There are three classes of Intel IGPs for Haswell, the GT1, which features 10 execution units (EUs), and will feature on entry-thru-mainstream Pentium, Core i3, and Core i5 chips; GT2, which features 20 EUs, featuring on mainstream-thru-performance Core i5 and Core i7 chips; and GT3, a large 40-EU IGP, which uses an L4 eDRAM cache. Chips with GT3 graphics are multi-chip modules (MCMs) of the CPU die and this eDRAM due, as detailed earlier. It was earlier believed that Haswell chips with GT3 graphics cores will be confined to notebook and Ultrabook-specific CPU models, but it turns out that it will make an appearance on the desktop platform as well.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the industry's first production of ultra-high-speed four gigabit (Gb) low power double data rate 3 (LPDDR3) mobile DRAM, which is being produced at a 20 nanometer (nm) class* process node. The new 4Gb LPDDR3 mobile DRAM enables performance levels comparable to the standard DRAM utilized in personal computers, making it an attractive solution for demanding multimedia-intensive features on next-generation mobile devices such as high-performance smartphones and tablets.

"By providing the most efficient next-generation mobile memory with a very large data capacity, we are now enabling OEMs to introduce even more innovative designs in the marketplace," said Young-Hyun Jun, executive vice president, memory sales & marketing, Samsung Electronics. "Our 20nm-class four gigabit mobile DRAM provides another example of our ability to deliver well-differentiated, high-performance, high-density memory to customers in a timely manner."

ADATA Technology Co., Ltd. a world leader in DRAM modules and NAND Flash storage application products, today announced the start of shipments of its latest advanced in gaming technology, the XPG Gaming v2.0 Series DDR3-2600 MHz DRAM 8GB modules. These dual channel kits are designed and engineered to bring optimum performance to third generation Intel Core processors and the Z77 platform.

XPG DRAM modules signify Xtreme Performance Gear, providing the extreme speed and performance required by advanced users. The XPG Gaming series v2.0 is targeted specifically at the distinct performance and cooling needs of the worldwide gaming community. These latest DDR3 2600G 8GB modules offer new levels of data transfer speed, along with the many features that are hallmarks of the XPG series.

To tackle upcoming generations of Ultrabooks and NUC that lack space for discrete graphics, yet having to keep up with the demands of higher display resolutions (i.e. proliferation of 3840 x 2160), Intel is designing special variants of its Core "Haswell" processors that feature large integrated graphics cores bolstered by fourth-level eDRAM caches on-package. Pictured below, is one such contraption.

The graphics-enhanced Core "Haswell" processor is an MCM (multi-chip module) of two dies, the larger one is the actual "Haswell" processor complex with cores, uncore, and the larger GT3 integrated graphics core. While the standard Haswell silicon with GT1 and GT2 integrated GPU options, physically features up to 20 execution units (EUs), the large GT3 silicon features double that, at 40 EUs.

During her keynote at the Intel Developer Forum today in Beijing, Diane Bryant, senior vice president and general manager of Intel's Datacenter and Connected Systems Group, discussed how her company is helping users harness powerful new capabilities that will improve the lives of people by building smarter cities, healthier communities and thriving businesses.

Bryant unveiled details of upcoming technologies and products that show how Intel aims to transform the server, networking and storage capabilities of the datacenter. By addressing the full spectrum of workload demands and providing new levels of application optimized solutions for enterprise IT, technical computing and cloud service providers, unprecedented experiences can be delivered.

More than 100 developer and adopter members of the Hybrid Memory Cube Consortium (HMCC) today announced they've reached consensus for the global standard that will deliver a much-anticipated, disruptive memory computing solution. Developed in only 17 months, the final specification marks the turning point for designers in a wide range of segments-from networking and high-performance computing, to industrial and beyond-to begin designing Hybrid Memory Cube (HMC) technology into future products.

A major breakthrough with HMC is the long-awaited utilization of advanced technologies to combine highperformance logic with state-of-the-art DRAM. With this first HMC milestone reached so quickly, consortium members have elected to extend their collaborative effort to achieve agreement on the next generation of HMC interface standards.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash storage application products, today announced the launch of the enterprise grade SX1000L solid state drive (SSD). While the company is well-established in the consumer SSD market, this is ADATA's first offering specifically tailored towards server applications.

Taking advantage of its expertise in NAND flash memory technology, ADATA is emphasizing the reliability and performance of the SX1000L. It employs static wear-leveling technology to maximize device mean time between failures (MTBF) to 1,500,000 hours, providing the long-term dependability required by high density computing and heavy load server operations. Available in 2.5" standard SATA form factor, the SX1000L implements advanced controller technology to enhance read/write performance. Sequential read speeds reach 560 MB/sec, and sequential write is as high as 340 MB/sec, with IOPS of 73,000 and 45,000 (Maximum 4K random read and write, respectively).

Known more for its graphics cards, Galaxy has an SSD lineup, with which it targets the Greater China region. It rolled out the Thunder GT 128 Pro, a 128 gigabyte SSD in the 2.5-inch form-factor, with SATA 6 Gb/s interface. The drive utilizes Toshiba-made Toggle-NAND flash, JMicron JMF667H processor, and an unknown amount of DRAM cache. The drive offers sequential transfer rates as high as 480 MB/s reads, 300 MB/s writes, 70,000 IOPS QD64 reads, and 58,000 IOPS QD64 writes. Available in China from later this month, the Galaxy Thunder GT 128 Pro is priced at 799¥ (US $128).

In addition to its 2.5-inch SATA 6 Gb/s TLC NAND flash SSD, Plextor showed off its upcoming SSD in the NGFF form-factor, designed for next-generation Ultrabooks. Based on the same Marvell 88SS9189 processor and triple-level cell (TLC) NAND flash memory as its 2.5-inch cousin, the drive differs in being a 42 x 22 mm (LxW) NGFF module, with PCI-Express 2.0 x2 interface. The drives will be sold in 128 GB and 256 GB capacities, featuring 256 MB and 512 MB DDR3 DRAM caches, respectively. On offer are read speeds of up to 700 MB/s, writes of up to 550 MB/s, and maximum 4K random write performance of 100,000 IOPS. The NGFF drives should arrive around the same time as Ultrabooks based on 4th generation Core "Haswell" processors.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash storage application products, today announced the launch of the DashDrive Elite UE700 USB flash drive. Building on the company's past successes and increasing brand strength, the UE700 is a striking blend of technological development and design aesthetics.

The improved transfer speed of the UE700 arrives at an opportune time, with USB flash drives being called on to store and deliver personal media content of higher quality and file size than ever before. Making extensive use of the enhanced bandwidth available to the USB 3.0 interface, it delivers transfer speeds up to an unbelievable 200 MB/sec read and 100 MB/sec write, outperforming the vast majority of USB flash drives available on the market today.

Transcend Information, Inc., a worldwide leader in storage and multimedia products, today announced the arrival of its 32GB DDR3 Load-Reduced DIMM (LRDIMM) memory module. An important component of today's powerful servers, LRDIMMs use a specially designed buffer to minimize the load on the server memory bus, allowing administrators to maximize memory capacity, increase performance, and reduce the power consumption of their systems.

In standard RDIMM technology, the data bus connects directly to the multiple ranks of DRAM chips on the module, which increases electrical load and limits system speed as more modules are added. In contrast, Transcend's DDR3 Low Voltage LRDIMMs feature a full memory buffer chip on the module, which acts as a go-between for all signals sent from the host to the DRAM chips, reducing the electrical load on all interfaces. Compared to standard RDIMMs or UDIMMs, a system using Transcend LRDIMMs can support more modules per channel and higher maximum memory capacity without sacrificing speed.

At CeBIT, Plextor showed off a yet unnamed line of consumer SSDs featuring 19 nm triple-level cell (TLC) NAND flash memory. The series consists of 128 GB, 256 GB, and 512 GB variants, with 256 MB, 512 MB, and 768 MB of DDR3 DRAM cache, respectively. The three are driven by Marvell 88SS9189 processor, and are built in the 2.5-inch form-factor, with SATA 6 Gb/s interface.

The 128 GB variant offers sequential read speeds as high as 530 MB/s, with up to 380 MB/s writes, and 72,000 IOPS 4K random write performance. The 256 GB variant ups that with 540 MB/s reads, and 450 MB/s writes. Leading the pack is the 512 GB variant, with 540 MB/s reads, and 465 MB/s writes. The lineup is expected to be launched this August.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash storage application products, today introduced its Premier series SDHC, SDXC and microSDHC ,microSDXC memory cards, all of which implement the UHS-I U1 (compatible with SDA 2.0 speed Class 10) specification. The new cards are designed especially to economically meet the performance needs of the most commonly used portable electronics.

With the increasing expectations for smart phones and tablet computers to handle high definition media recording and playback, the memory cards used with these devices require higher read and write speeds than ever before. The Premier series targets those who are looking for a cost-effective entry solution to extend their device's capacity and speed.

Super Talent Technology, a leading manufacturer of flash storage solutions and DRAM memory modules, announces its USB 3.0 Express RC4 has been certified for usage with Windows To Go, a new feature of Microsoft's Windows 8 Enterprise edition. The RC4 is SuperTalent's second drive to be certified to date. Windows To Go enables enterprises to provision a full corporate image on an external USB drive which users can boot and operate from almost any PC. SuperTalent plans to continue to work with firms to unveil its "hardware secure" version in the near future.

Certified through the Windows 8 Hardware certification kit, Super Talent's RC4 is one of the world's top USB 3.0 drives with SSD technology; it provides high random read/write speed capabilities and reports itself as fixed media. Super Talent's RC4 meets and surpasses many of the performance requirements of Windows To Go certified drives.

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions and DRAM memory modules, showcases its PCIe and mini PCIe Flash Disk Modules.

Bypassing the SATA speed bottleneck, Super Talent's PCIe and mini PCIe FDMs offer huge performance gains with the ability to deliver read speeds up to 350 MB/sec and write speeds up to 220 MB/sec. The ultra-compact form factor is just right for solutions where space is limited, such as embedded applications, industrial PCs, all-in-one PCs, notebooks and netbooks.