Super Talent Technology, a leading manufacturer of flash storage solutions and DRAM memory modules, today announced the USB 3.0 Express ST2, a new dual channel USB 3.0 flash that hits price points comparable to USB 2.0. As USB 3.0 begins to proliferate through the market, customers are anxious to utilize the new capabilities of these machines and get a taste of what USB 3.0 has to offer. Many are simply looking to hit speed here to fore impossible on the USB 2.0 bus, without breaking the bank. For those customers, the ST2 is perfect. Fully backward compatible to USB 2.0, the ST2 is future proof, offering excellent performance on bus the USB 2.0 or 3.0 bus.

Offering similar performance as our USB 3.0 Express DUO (67MB/s read, 24MB/s write), the ST2 now gives our customers a choice in case design. Based on our popular design recently debuted with the Express RC8, the ST2 is enclosed in a sleek aluminum housing and accented by a translucent blue plastic trim. The design characteristics offer both feature parity and a strong family resemblance. Just like the RC8, the translucent plastic features on the ST2 serve as both a means to retain the cap and it acts as a light pipe for the enclosed blue LED; even straight through the cap. Available in 8GB, 16GB and 32GB capacities, the new USB 3.0 Express ST2 is NOW IN STOCK and ready for immediate shipment. MSRP for the 8GB ST2 is $20 USD.

Mach Xtreme Technology Inc., a worldwide leader in top performance, high reliability and user-friendly designed PC components, today unveiled Urban Series Dual-Channel DDR3 high-density memory kits based on the latest DRAM chips.

Urban high-density DDR3 modules offer desktop users groundbreaking computing experience at an attractive price point. Featuring enhanced capacity of 4GB per module, these new high-density 8GB kits provide customers with cutting-edge memory solution that significantly increases memory space. Users working with the latest operating system can keep multiple applications open or run smoothly memory intensive graphic programs. The uniquely designed lightweight heatsink is made of specially imported top grade Japanese aluminum.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM[1]), today announced that as of the end of July it had started sample shipments of the smallest chip now available in the DRAM semiconductor memory industry. The new chip uses ultra fine-width process migration technology to achieve a circuit line width of 25 nanometers (nm). Elpida completed development of this advanced manufacturing process in May and has begun to apply the process to commercial production.

The new 25nm process-generation product now being shipped is a DDR3 SDRAM with a memory capacity of 2-gigabits (see product specifications below). A 25nm 4-gigabit DDR3 SDRAM is expected to become commercially available by the end of 2011.

OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) for computing devices and systems, today unveiled the Indilinx Everest SATA 3.0 SSD platform. The Everest platform features support of 6Gbps interface speeds, high transactional performance that is optimized for compressed files, and maximum capacities up to 1TB.

"The new Indilinx Everest platform is a complete customizable solution that delivers superior storage performance, features, and capabilities designed to exceed the needs of the most demanding SSD applications," said Bumsoo Kim, President of Indilinx. "Combining a 6Gbps SATA Revision 3.0 host interface, a dual-core CPU, and support for the latest, most advanced NAND Flash memory technology available, Everest offers SSD manufacturers unparallel flexibility in optimizing their designs for both performance and cost."

GeIL (Golden Emperor Industries Ltd.) rolled out two new lines of DDR3 desktop memory targering the gamer-enthusiast segment, the Enhance Corsa and Evo Corsa. Interestingly, these lines don't include triple-channel kits, but quad-channel ones consisting of four modules, aside from the usual dual-channel kits. Gearing up for the Sandy Bridge-E market early, I see. Among the two lines, the Enhance Corsa consists of bang-for-buck kits with DDR3-1333 MHz and DDR3-1600 MHz.

The USP here is that the 1333 MHz kits will pack an Intel XMP profile that runs the modules at 1500 MHz with CL9 timings, and DRAM voltage of 1.5V; while the DDR3-1600 MHz ones will pack a XMP profile that runs them at 1700 MHz with CL9 timings and 1.5V. Evo Corsa comes in dual and quad-channel kits, consisting of 2 GB or 4 GB modules, making up 4 GB or 8 GB dual-channel; and 8 GB or 16 GB quad-channel kits on offer.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today announced the launch of the NH13 portable hard drive. Geared towards business and professional users, the NH13 sports a USB 3.0 interface and a classic metallic finish.

For users of netbooks and USB compatible mobile devices, the NH13's stylish color options: glossy black and lustrous silver, make it an ideal digital accessory that adds class to any ensemble. The sleekly designed aluminum case provides scratch resistance and a sophisticated touch to data mobility.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, announced its latest product offering aimed at satisfying the needs of extreme gamers. In an industry first, the company has launched the single 8GB XPG Gaming Series DDR3L 1333G Desktop overclocking memory. With a high density of 8GB and low voltage of only 1.35V, it is anticipated to provide excellent system performance and overclocking capabilities to meet the requirements of power users and overclockers.

ADATA DRAM product planning department project manager Alex Wu explained, "With the popularity of 64-bit operating systems, high-density memory is a prerequisite in many gamers' minds. We are the first to launch DDR3L 1333G high-density 8GB memory modules, achieved in the XPG Gaming Series". He further stated: "This product adopts a 1.35 volt design, to offer gamers excellent stability and efficiency and also reduce waste heat and power consumption costs". The XPG Gaming Series DDR3L 1333G desktop overclocking memory features high density and low voltage, helping gamers achieve the ultimate in system effectiveness. At the same time, the reduced power consumption leads to lower carbon emissions, resulting in greater environmental sustainability.

Super Talent Technology, a leading manufacturer of flash storage solutions and DRAM memory modules, today announced their next generation SSD, the TeraDrive PT3.
Featuring the SandForce 2200 processor, SATA 6 Gb/s interface, and Double Data Rate, ONFiTM flash, the new TeraDrive PT3 offers a significant leap in performance over drives offered just a few months ago. The union of these 3 new technologies has forever changed the storage landscape. Right out of the gate, this new generation SSD stretches well within the new found bandwidth promised by the SATA 3.0 bus and breaks the 500MB/s barrier in both Read and Write scores. The comparisons between SSDs and HDDs just became a little harder to justify.

The only SSD processor to compress data before writing, SandForce's unique set of technologies enables the new TeraDrive PT3 to offer enhanced performance, flash durability and data integrity. Add to that the introduction of ONFi, double data rate flash, and the SATA 6 Gb/s interface, and we have one of the largest incremental leaps in performance that the storage market has ever seen.

ASUS today announced the launch of their new AMD A75 chipset-based F1A75 Series motherboards. Designed specially to optimize performance for the AMD Llano APUs, the F1A75 Series motherboards have exceptional overclocking capability for the versatile APU with a variety of integrated graphics built directly on the same die. This new series is also equipped with the latest ASUS-exclusive technologies and features, including the Dual Intelligent Processors 2 (DIP2) with DIGI+ VRM for precise power control, a graphical and mouse-controlled UEFI BIOS and the easy-to-use auto tuning for better performance.

Apacer, one of the world's leading brands of memory modules, today announced an expansion of its ARES overclocking memory series with high capacity and clock rate: DDR3-2133 8GB (4GBx2) dual channel memory kit,which is engineered for the latest Intel P67 and Z68 Sandy Bridge platforms. With a combination of high clock rate, huge capacity and low latency of CL9, ARES series is a perfect solution for extreme PC enthusiasts and gamers who want to optimize performance on the new platforms.

The newly-unveiled ARES DDR3-2133 8GB dual channel memory kit provides the highspeed and capacityon the Intel P67 and Z68 Sandy Bridge platforms and is backwards compatible with existing the P55 platform. It runs at CL9-11-9-27 with 1.65 voltage, using advancedprocess 256Mb x 8chips, which are screened and tested withthe advanced test fixture and programs under diversified parameters of voltage and time sequences.

Crucial, a leading global brand of memory and storage upgrades, today announced two product line additions to its highly successful Ballistix high-performance memory: Crucial Ballistix Tactical and Crucial Ballistix Elite lines. Building on the recent successful launch of the Crucial Ballistix Sport memory, these new product lines create a comprehensive high-performance memory portfolio addressing the needs of a broad range of users across performance memory segments.

Whether casual enthusiast or hardcore gamer, the expanded Ballistix portfolio now provides a distinct choice of performance memory solutions and is available in a variety of speeds and densities, along with differentiated product features. The complete line of Ballistix memory features a new logo treatment and updated heat spreader designs, as well as a full range of products from low latency DDR2-800MHz up to high-speed DDR3-2133MHz. Additionally, 4GB densities will be available in DDR3-1600MHz, -1866MHz, and -2000MHz modules.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced the DRAM industry's first-ever use of high-k metal gate (HKMG) technology to develop a 2-gigabit DDR2 Mobile RAM (LPDDR2) at the 40nm-class DRAM node.

HKMG is technology that uses insulator film with a high dielectric constant (abbreviated to "high-k," a semiconductor industry measure of how much charge a material can hold) in the transistor gate to reduce current leakage and improve transistor performance. Metal gate electrodes that are required for the high-k dielectrics process are also used. Some makers of logic semiconductors have started to use HKMG, but higher heat treatment temperatures after HKMG formation and complicated DRAM structural characteristics have prevented consistent application in the DRAM fabrication process. Elpida, however, has managed to lower the heat treatment load and overcome certain memory device structural complications.

First making their existance known in April, Intel's new enterprise-grade 710 Series and 720 Series solid-state drives (SSDs) are inching closer to launch, with more specifications being known. The two series are very distinct from each other, the 710 series codenamed "Lyndonville" comes in the 2.5-inch SATA form-factor, with SATA 3 Gb/s interface; while the 720 series codenamed "Ramsdale" comes in the PCI-Express add-on card form-factor, probably using the PCI-Express x8 interface.

Intel 710 series SSDs make use of new 25 nm MLC NAND flash, cached by 64 MB of DRAM. It comes in capacities of 100, 200, and 300 GB; offer transfer-rates of 270 MB/s read, 210 MB/s write; with 36,000 IOPS and 2,400 4K IOPS performance; and offers endurance of 500 TB for the 100 GB model, and 1 PB (petabyte, equals 1024 TB) for the 200 GB model on full capacity. The Intel 720 series SSDs use PCI-Express interface, 34 nm SLC NAND flash, comes in capaities of 200 GB and 400 GB; transfer rates of 2,200 MB/s read, 1,800 MB/s write; 180,000 IOPS with 56,000 IOPS 4K random write performance; and massive endurance figures of 36 PB for 200 GB (8K random writes).

IBM today announced that it will provide the microprocessors that will serve as the heart of the new Wii U system from Nintendo. Unveiled today at the E3 trade show, Nintendo plans for its new console to hit store shelves in 2012.

The all-new, Power-based microprocessor will pack some of IBM's most advanced technology into an energy-saving silicon package that will power Nintendo's brand new entertainment experience for consumers worldwide. IBM's unique embedded DRAM, for example, is capable of feeding the multi-core processor large chunks of data to make for a smooth entertainment experience.

TEAM Group, of the TEAM Xtreem fame, showed us its latest generation of ultra-high end DDR3 memory modules for overclocking. The theme for this year is LV (low-voltage) modules, which can do their rated DRAM speeds at 1.35V voltage. We begin with TEAM Xtreem DDR3-2400 MHz and TEAM Xtreem DDR3-2000 MHz, which come in 2 GB and 4 GB module capacities, and in triple-channel and dual-channel kits. These kits are the top of the line that TEAM has, to offer.

Moving on, there's a second line of memory kits for the performance segment, also LV (low-voltage, 1.35V), called TEAM Xtreem Dark series, which offer speeds of DDR3-1600 MHz, and use slightly smaller heatsinks. These modules come in 2, 4 GB capacities, and in dual and triple channel kits. Next up is the TEAM Green series, that are bare modules without heatsinks, that do JEDEC standard DDR3-1333 MHz and DDR3-1600 MHz at 1.35V, with loose timings. Lastly, there's a performance line of SODIMM modules for Apple Macs, the TEAM Mac SODIMM, which runs at DDR3-1333 and DDR3-1066 MHz speeds, offering 2 GB and 4 GB module capacities.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today announced the release the S511 Solid State Drive (SSD), which employs the latest SATA 6Gb/s specification. With this cutting edge implementation of the latest data transfer standard, the performance of this SSD has been dramatically raised over conventional SATA II products.

The S511 utilizes the new generation SandForce SF-2200 series chip, with native support for the SATA 6Gb/s platform. Its read and write speeds are twice that of SSDs using the older SATA II specification, and in real world test simulations reached 550/520MB read and write speeds respectively, with 4K random write speeds as high as 60,000 IOPS. For consumers, this means transferring 5GB media archives can be completed in as few as 15 seconds. In actual testing of Windows 7 boot speed, the S511 cruised to an impressive 25 second system boot time.

Here is the complete socket AM3+ motherboard first-wave of ASUS, the M5A series, short and sweet. Based entirely on AMD 9-series chipset, including 9-series southbridge chips, the first-wave caters to gamer, performance, and enthusiast market segments, and only includes those chipset models that rely on discrete graphics (leaving out AMD 980G, 990GX). The lineup even includes models from ASUS' gamer/enthusiast-oriented Republic of Gamers (ROG) family, and The Ultimate Force (TUF) family.

The lineup starts with three models based on AMD 970 + SB950 chipset, which is a single discrete graphics card platform. The M5A97 is the entry-point, it bases itself entirely on what the chipset offers, plus two USB 3.0 ports. Moving up is M5A97 Pro, which has everything its little sibling has, plus a stronger 6+2 phase Digi+ VRM, and two eSATA ports. The M5A97 EVO, which was pictured a little while ago. This has everything the Pro variant has, plus two front-panel USB 3.0 ports, and FireWire.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today announced the launch of its latest series of power supply for personal computers. The BN Series is targeted towards consumer and professional users who are looking for economical solutions in energy efficient power.

With 80 Plus Bronze certification, the BN series offer up to 85% efficiency, while the 95% Active Power Factor Correction (PFC) minimizes power loss. The series comes in four wattage models to meet a wide range of individual user needs, and all models meet both the European Energy Using Products Directive (EuP) and The American Energy Star 5.0 standard. The units run quietly and emit extremely low levels of interference.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced it had developed a 2-gigabit DDR3 SDRAM using an industry-leading 25nm process for memory manufacturing. Using the most advanced process technology available Elpida has achieved the industry's smallest chip size for a 2-gigabit SDRAM.

The newly developed 25nm DRAM process technology requires 30% less cell area per bit compared with Elpida's 30nm process. The chip output for a 2-gigabit DDR3 SDRAM wafer using the new process is about 30% higher versus 30nm.

Viking Modular Solutions, a leading global provider and manufacturer of innovative DRAM technology and Solid State Drive solutions, today announced the release of its next generation SATADIMM. Viking Modular's SATADIMM provides the highest-capacity, highest-performance Solid State Drive (SSD) in the smallest form factor on the market today. Leveraging the form factor of DDR3 DIMMs and the non-volatile capabilities of SSDs, SATADIMM enables enterprise servers to take advantage of its innovative small footprint to drive significantly increased performance per server or "per U". Viking Modular will demonstrate the product's unique capabilities at Storage Networking World in Santa Clara, California, April 4-7, 2011, at Booth # 517.

Available in both 25mm and 18.75mm (VLP) heights in the industry standard 240-PIN DDR3 form factor, Viking Modular's SATADIMM has the same Bill of Materials (BOM) as a 2.5 inch SSD but with 75% less footprint, greatly enhancing the quantity of SSDs that can be supported within a 1U server. Utilizing the enterprise-class SATADIMM, 1U servers can produce 1.4M Input/Output Operations Per Second (IOPS) and up to 3x the capacity and overall performance levels compared to current industry standard servers deployed with traditional SSDs.

Hynix Semiconductor Inc. ('Hynix') today announced that it has developed 2Gb(Gigabit) DDR4 DRAM and DDR4 DRAM based 2GB(Gigabyte) ECC-SODIMM(Error Check & Correction Small Outline Dual In-line Memory Module) applying its leading 30nm class process technology. The DDR4 DRAM product meets the JEDEC standard and the module product is designed for the micro server.

DDR4 DRAM is a next generation memory product which consumes less electronic power while it transfers data as twice as faster than the existing DDR3 DRAM. The device works at the industry's fastest speed of 2400Mbps(Megabits per second), which is also 80% faster than DDR3 1333Mbps product. The Module product operates at such a low voltage of 1.2V and processes up to 19.2 GB (Gigabytes) of data per second with a 64-bit I/O.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced that its JC-45 Committee for DRAM Modules intends to form a new Subcommittee focused on the standardisation of hybrid memory modules. To be chaired by PNY Technologies, Inc. and Cypress Semiconductor, the JC-45.6 Hybrid Modules Subcommittee will hold its first meeting in Munich, Germany on February 28, 2011.

Hybrid memory modules are comprised of different types of memory technologies and leverage some of the beneficial characteristics of each, operating as a system instead of as individual components. "I am optimistic about the potential benefits of hybrid modules," said Chris Socci, Chairman of the new JC-45.6 Subcommittee. "For example, modules with a DRAM interface that also incorporate the non-volatile characteristics of NAND flash could provide new options for data security in a variety of storage and backup systems in the event of power loss. This new family of modules has the potential to help entire segments of the market 'go green' by reducing the need for batteries, and may one day extend to all applications that demand memory."

OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) and memory modules for computing devices and systems, reports its third quarter 2011 results (Q3'11), which ended on November 30, 2010.

Net revenues in Q3'11 were a record $53.2 million, and increased 40% both on a year-over-year and sequential basis, from $38.0 million reported in Q3'10 and in Q2'11.

SSD revenues reached a record $41.5 million in Q3'11, an increase of 325% over Q3'10 SSD revenues of $9.8 million, and a 105% increase sequentially over Q2'11 SSD Revenues of $20.2 million.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced a refresh to their Ultra Drive SSD series, the new UltraDrive MT. SuperTalent's new SATA II SSD is equipped with the new Barefoot controller-plus Indilinx Martini firmware, offers a host of attractive new features and performance, without breaking the bank. This new 2.5" SATA drive includes the latest reliability features including: Garbage collection, Trim support, Wear leveling and ECC, designed to keep this SSD running at optimum performance for the life of the drive.

"The UltraDrive MT offers an important balance between price and performance. Now is a great time to upgrade to an SSD"., said Super Talent COO, CH Lee. The Ultra Drive MT posts an impressive 255MB/s Read and 250MB/s Write speed. The new Barefoot controller, and Indilinx Martini firmware, offers a substantial increase random write performance over its predecessor. Performance of these smaller random blocks is important for OS and application performance and thus has a noticeable impact on the drive's overall performance. Available in capacities of up to 240GB, Ultra Drive MT is the optimal performance upgrade option at an attractive price.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced that it is previewing its new Corsair Link technology at the 2011 Consumer Electronics Show in the Las Vegas Convention Center, Booth 35864. Corsair Link allows multiple Corsair products to be connected to the Corsair Link Controller, providing measurement and control capabilities that are unsurpassed by other solutions.

Corsair products that includes a Corsair Link connector can be linked to the Controller and report key parametric data, such as temperature, fan speed, pump speed, voltage, power consumption, etc. which can then be used to provide visual data tracking as well as refined control (where appropriate) of these same parameters. As more Corsair components are connected, more data and more control are available to the user. A system consisting of all Corsair components connected via Corsair Link will provide an unprecedented level of feedback and control to the user.