Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a new series of 5G RedCap module integrated with MediaTek's T300 5G modem, which is the world's first 6 nm radio frequency system-on-chip (RFSOC) single die solution for 5G RedCap. By integrating a single-core Arm Cortex-A3 processor in a significantly compact PCB area, the FM330 series are optimal solutions that offer extended coverage, increased network efficiency and device battery life for industry customers.
Compliant with 3GPP R17 standards, the FM330 series supports mainstream 5G frequency bands worldwide and is capable of reaching a maximum bandwidth of 20 MHz, thus ensuring the peak data rate of up to 227 Mbps downlink and 122 Mbps uplink, sufficient to meet the demand for 5G applications with less data throughput while balancing the power efficiency. In hardware design, it adopts the M.2form factor measured at 30x42mm benefiting from the unique RFSOC solution integrated with T300, in addition to the optimized antenna design in 1T2R, which significantly saves the PCB area. Moreover, FM330 series is pin-compatible with Fibocom LTE Cat 6 module FM101, easing the concerns for customers' migration from 4G to 5G. Furthermore, the module provides 64QAM/256QAM (optional) modulation scheme to greatly optimize the cost and size.