Thermal Grizzly's Duronaut thermal paste stands out due to its combination of exceptional long-term stability and excellent thermal conductivity. Its outstanding performance in heat transfer is further enhanced by the ability to apply Duronaut in an extremely thin layer. This is made possible by its unique composition of aluminium microparticles and zinc oxide nanoparticles, optimized for particle shapes and sizes. These features ensure excellent adhesion of the paste to the surface. The powders are mixed into a specially developed silicone oil, resulting in extraordinary long-term stability.

For optimal application, the high-end thermal paste comes with the new TG Spatula Pro. The redesigned spatula allows for more pressure to be applied to the surface during application, enabling the paste to be spread more efficiently in a thinner layer. Duronaut is available in 2-gram and 6-gram packaging options.

ASUS today announced its latest all-in-one (AIO) liquid CPU cooler, the ROG Ryuo IV SLC 360 ARGB, at CES 2025. This new addition expands the comprehensive ASUS AIO cooler lineup, catering to the diverse needs of gamers, creators, and PC enthusiasts. These advanced solutions offer exceptional thermal performance, streamlined installation, and customizable aesthetics, ensuring optimal cooling for all types of builds. Fully compatible with the latest AMD and Intel 800 series motherboards, ASUS AIO coolers deliver unmatched performance and style.

From the premium ROG Ryuo IV SLC 360 ARGB for pristine BTF setups to the professional-grade ProArt LC 420 for demanding workstations, ASUS offers unparalleled versatility. The ASUS AIO cooler, when paired with a compatible ASUS motherboard, unlocks the full potential of the system, enabling seamless synchronization of RGB lighting, precise fan speed adjustments, and real-time monitoring of CPU statistics through the Armory Crate software.

At this point, it's basically taken for granted that Lenovo will be launching its cut-down Legion Go S gaming handheld at CES 2025, and a fresh leak from Evan Blass via The Verge points to another Legion Go handheld—a direct replacement for the current-generation Go—launching alongside the Go S. While the Go S will supposedly be powered by the less powerful AMD Ryzen Z2G and its Radeon 680M iGPU, the full-fat Legion Go 2 will likely use a more powerful processor and iGPU, suggesting that a Ryzen Z2 Extreme SoC is on the way.

Perhaps the most compelling thing about the new Legion Go handheld, though is that it will reportedly feature an OLED display. Despite the new display tech, though, the Legion Go 2 will supposedly have the same display size, detachable controllers, and FPS mode, although the images shared by Blass show significantly rounder controller edges, which should make the chunky handheld less cumbersome to hold. The leaks make no mention of SteamOS or a Steam button for the Legion Go 2, suggesting that it will still be a Windows-first gaming handheld, and the Legion Space button is still present on the face of the Legion Go 2 featured in the leaks.

Taiko Audio, a Dutch high-end audio manufacturer, has unveiled what might be the most over-engineered music server ever created—the Extreme Server. With a starting price of €28,000 (US$29,600), this meticulously crafted device embodies either the pinnacle of audio engineering or the epitome of audiophile excess. The Extreme's most distinctive feature is its unique dual-processor architecture, using two Intel Xeon Scalable 10-core CPUs. This unusual configuration isn't just for show—Taiko claims it solves a specific audiophile dilemma: the impact of Roon's music management interface on sound quality. By dedicating two processors to Roon and Windows 10 Enterprise LTSC 2019 interface, they've made Roon's processing "virtually inaudible", addressing a concern most music listeners probably never knew existed.

Perhaps the most striking technical achievement is the server's cooling system, or rather, its complete absence of conventional cooling. Taiko designed a custom 240 W passive cooling solution with absolutely no fans or moving parts. The company machined the CPU interface to a mind-boggling precision of 5 microns (0.005 mm) and opted for solid copper heat sinks instead of aluminium, claiming this will extend component life by 4 to 12 years. The attention to detail extends to the memory configuration, where Taiko takes an unconventional approach. The server uses twelve 4 GB custom-made industrial memory modules, each factory pre-selected with components matched to within 1% tolerance. According to Taiko, this reduces the refresh rate burst current by almost 50% and allows for lower operating temperatures. The PSU that powers the PC is a custom 400 W linear power supply, an in-house development designed specifically for the Extreme's unique needs. It combines premium Mundorf and Duelund capacitors for sonic neutrality, Lundahl chokes selected by ear, and extensive vibrational damping using Panzerholz (a compressed wood composite) for durability, low temperature operation, longevity, and exceptional sound quality.

Today we're excited to launch the 3DMark DirectStorage feature test. This feature test is a free update for the 3DMark Storage Benchmark DLC. The 3DMark DirectStorage feature test helps gamers understand the potential performance benefits that Microsoft's DirectStorage technology could have for their PC's gaming performance.

DirectStorage is a Microsoft technology for Windows PCs with PCIe SSDs that reduces the overhead when loading game data. DirectStorage can be used to reduce game loading times when paired with other technologies such as GDeflate, where the GPU can be used to decompress certain game assets instead of the CPU. On systems running Windows 11, DirectStorage can bring further benefits with BypassIO, lowering a game's CPU overhead by reducing the CPU workload when transferring data.

Legendary overclocker Vince Lucido, aka KINGPIN, has reportedly partnered with PNY to develop next-generation GPUs for extreme overclocking. KINGPIN, known for his unparalleled expertise in pushing hardware to its limits, revealed the partnership during a recent interview with Gamers Nexus at Computex 2024. The move comes as welcome news to enthusiasts who have been eagerly awaiting KINGPIN's next venture since EVGA's departure left a noticeable gap in the high-end GPU segment. Previously, he was the leading engineer of EVGA's high-end KINGPIN designs aimed at pushing the GPU to its limits. However, since EVGA decided to leave the GPU business, KINGPIN was looking for a new company to work on the next-generation GPU designs.

This time, the company of choice for KINGPIN is now PNY. While he has been in contact with many companies like GALAX and ASUS, he claims that it would be very crowded to work there as there are "too many cooks in the kitchen" with these companies already having in-house overclockers. He has also been talking with MSI, but the company wasn't interested in making GPUs for extreme overclocking. However, PNY has been very interested in shaking up the high-end GPU market. KINGPIN claims that there is a massive hole in the high-end GPU market, and he hopes to fill it with a collaboration with PNY. Next-generation GPU designs assisted by KINGPIN will reportedly arrive for the upcoming NVIDIA GeForce RTX 50 series of GPUs when we hope to see the legacy EVGA left to continue at PNY.

ASML, the world's sole provider of extreme ultraviolet (EUV) lithography systems essential for manufacturing the most advanced chips, has revealed its roadmap for pushing semiconductor scaling even further. In a recent presentation, former ASML president Martin van den Brink announced the company's plans for a new "Hyper-NA" EUV technology that would succeed the High-NA EUV systems, which are just beginning to deploy. The Hyper-NA tools, still in early research stages, would increase the numerical aperture to 0.75 from High-NA's 0.55, enabling chips with transistor densities beyond the projected limits of High-NA in the early 2030s. This higher numerical aperture should reduce reliance on multi-patterning techniques that add complexity and cost.

Hyper-NA is bringing challenges of its own to commercialization. Key obstacles include light polarization effects that degrade imaging contrast, requiring polarization filters that reduce light throughput. Resist materials may also need to become thinner to maintain resolution. While leading EUV chipmakers like TSMC can likely extend scaling for several more nodes using multi-patterning with existing 0.33 NA EUV tools, Intel has adopted 0.55 High-NA to avoid these complexities. But Hyper-NA will likely become essential across the industry later this decade as High-NA's physical limits are reached. Beyond Hyper-NA, few alternative patterning solutions exist besides expensive multi-beam electron lithography, which lacks the throughput of EUV photolithography. To continue classical scaling, the industry may need to eventually transition to new channel materials with superior electron mobility properties compared to silicon, requiring novel deposition and etch capabilities.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is showcasing multiple high-speed overclocked DDR5 memory kits on live-demo systems featuring the latest Intel and AMD platforms at Computex 2024. Aiming to demonstrate the maximum overclocking potential of the latest G.SKILL DDR5 memory on the latest platforms, these live-demo builds feature DDR5 memory speeds of up to DDR5-10600 and a variety of high-performance motherboards from ASRock, ASUS, Gigabyte, and MSI.

DDR5-10600 32 GB (16 GB x2) - Extreme Memory Speed on Air
Aiming for the highest DDR5 memory speed possible, G.SKILL shows off a 32 GB (16 GB x2) capacity memory kit running at a whopping speed of DDR5-10600 with an AMD Ryzen 5 8500G processor and ASUS ROG Crosshair X670E GENE motherboard.

According to Bloomberg's latest investigation, Huawei and Semiconductor Manufacturing International Corporation (SMIC) have submitted patents on the self-aligned quadruple patterning (SAQP) pattern etching technique to enable SMIC to achieve 5 nm semiconductor production. The two Chinese giants have been working with the Deep Ultra Violet (DUV) machinery to develop a pattern etching technique allowing SMIC to produce a node compliant with the US exporting rules while maintaining the density improvements from the previously announced 7 nm node. In the 7 nm process, SMIC most likely used self-aligned dual patterning (SADP) with DUV tools, but for the increased density of the 5 nm node, a doubling to SAQP is required. In semiconductor manufacturing, lithography tools take multiple turns to etch the design of the silicon wafer.

Especially with smaller nodes getting ever-increasing density requirements, it is becoming challenging to etch sub-10 nm designs using DUV tools. That is where Extreme Ultra Violet (EUV) tools from ASML come into play. With EUV, the wavelengths of the lithography printers are 14 times smaller than DUV, at only 13.5 nm, compared to 193 nm of ArF immersion DUV systems. This means that without EUV, SMIC has to look into alternatives like SAQP to increase the density of its nodes and, as a result, include more complications and possibly lower yields. As an example, Intel tried to use SAQP in its first 10 nm nodes to reduce reliance on EUV, which resulted in a series of delays and complications, eventually pushing Intel into EUV. While Huawei and SMIC may develop a more efficient solution for SAQP, the use of EUV is imminent as the regular DUV can not keep up with the increasing density of semiconductor nodes. Given that ASML can't ship its EUV machinery to China, Huawei is supposedly developing its own EUV machines, but will likely take a few more years to show.

ASUS finalized its adoption of the Intel Next Unit of Computing (NUC) product lines at a special autumn 2023 handover event. A post-ceremony statement outlined the company's vision going forward: "ASUS kicked-off its NUC business and started to take orders for NUC 10th to 13th generation systems on September 1. The new business is generating a wide variety of exciting opportunities for the company and the transition has progressed smoothly for NUC customers. The vision of the newly established ASUS NUC BU is to provide the most impactive edge computing with comprehensive commercial and AIoT solutions that can sustain the industry and businesses." Just over a week ago, TechPowerUp was granted access to next generation NUC devices at CES 2024—including ROG NUC, as well as NUC 14 Pro and NUC 14 Pro+ models. Many folks in attendance noticed a complete absence of NUC Extreme products at the ASUS Las Vegas showroom.

Online publication, Fudzilla, has investigated this matter—Fuad Abazovic (Editor-in-Chief) managed to chase down an ASUS spokesperson. It seems that the Taiwanese manufacturer is integrating some if its best known branding into the NUC ecosystem, and Team Blue nomenclature is on the chopping block: "the company won't have an update to the NUC Extreme 7.5 liter device. The Raptor Canyon remains the last NUC of its kind, as ASUS has ROG Strix systems in the same ballpark. Fudzilla already covered the announcement of the NUC and NUC pro, and the ROG NUC. We were assured that the 2.5L ROG NUC will remain the fastest gaming-oriented device and that, at this plan, the company doesn't plan to develop the successor of NUC Extreme 7.5 liter. ASUS has announced ROG Strix G16CHR, its 7.5-liter desktop that comes with an air and water cooler and hosts up to Intel Core i7-14700KF Processor 3.4 GHz (33M Cache, up to 5.5 GHz, 20 cores), NVIDIA GeForce RTX 4080 16 GB GDDR6X 3x DP, 2x HDMI, and up to 64 GB RAM in 4x DDR5 U-DIMM slots."

Over the past few months there have been reports of issues with SanDisk portable SSDs and Western Digital released a firmware update in May that was meant to prevent the drives from "unexpectedly disconnect from a computer". However, it appears that this firmware update didn't solve the problem and Western Digital is now being taken to court over drives not just having disconnect issues, but also randomly failing. The court case is expected to become a class action suit, as the plaintiff claims that the issue of failing drives affect tens, if not hundreds of thousands of people in the USA.

The models included in the complaint includes the SanDisk Extreme Pro, Extreme Portable, Extreme Pro Portable and WD My Passport SSD. A further firmware update was released in July, which is said to have made the issues even worse, with data being lost on drives or being inaccessible to drive owners. In some cases the drives go into read only mode, but sometimes this means that the drives become inaccessible to the OS, which in turn also means dataloss to the user. Time will tell how this plays out, but it's not looking great for Western Digital, but it wouldn't be the first time a storage device maker has been taken to court over failing products.

Galax has today announced a new flagship SSD for the Chinese market—ITHome noticed the Hall of Fame (HOF) Extreme 50S PCIe 5.0 SSD's reveal on Weibo. A very similar looking and named model was released a few months ago, but the new contender has added an "S" to its designation, so we expect it to offer a performance upgrade over its non-S sibling (a top performer for its time). Galax's own lab tests propose that the successor is capable of delivering read and write speeds up to 12.4 GB/s and 11.8 GB/s (respectively), a nice bump up from the previous gen model's 10.0 & 9.5 GB/s. ITHome's report suggests that these new storage drives are capable of reaching 1500K IOPS.

The HOF Extreme 50S and HOF Extreme 50 (non-S) series share the same Phison controller - PS5026-E26 - according to news sources. There are no differences in terms of NAND and cache configurations, but the newer models are likely faster thanks to refined ECC algorithm technology and fifth-generation LDPC error correction capabilities. No pricing and launch date(s) were available at the time of writing—ITHome understands that Galax will release a 2 TB model first, and a 4 TB will follow it.

Extreme Networks, Inc., today introduced a number of new solutions designed to challenge the status quo of networking. The AP3000 is the industry's smallest, most power-efficient Wi-Fi 6E access point (AP) and is designed to meet the needs of budget-conscious customers who want enterprise-grade performance in a small package. Extreme also extended its Universal Switch series with the introduction of the 7520 and 7720 switches, custom-built for enterprise core and aggregation use cases, and 8820 switches, high-density, deep buffer, switch routers designed for large enterprise networks. Extreme's Universal Platforms enable users to select their OS and change it as necessary, extending the life of the hardware and eliminating network upgrade costs.

"With more IoT and student devices connecting to the network each day and an ever-increasing need to invest in innovative software applications to boost curriculums and learning, Wi-Fi 6E will be a game-changer for the way we leverage our network to drive better experiences across campus. What makes the AP3000 so appealing is its small form factor, low power consumption and ability to perform in challenging conditions like auditoriums with high ceilings and small offices or classrooms in tight corners. Students and faculty connected to our new Wi-Fi 6E network will see a major difference in how quickly they can access online resources like videos, without any buffer time or interruptions to their school day," said Matthew Dumond, IT Director, Prospect Mountain School District.

The ASUS ROG Ally handheld games console emerged last month and it was revealed to pack some impressive "custom" AMD hardware - the two companies have boasted that the collaboration has resulted in two special SoCs - the Ryzen Z1 and Ryzen Z1 Extreme. Silicon enthusiasts were quick to point out that the Z1 series sported similar specifications to mobile/ultra-portable chipsets in AMD's 7040U family - in particular the Ryzen 7 7840U looks almost identical to its gaming equivalent (Ryzen Z1 Extreme). Andrew E. Freedman at Tom's Hardware was curious and motivated enough to request clarification (about this situation) from AMD. Team Red were happy to respond and acknowledged the apparent similarities between the gaming and laptop chipset ranges, but also stated that Z1 APUs have been tweaked by company engineers to a certain degree.

Matthew Hurwitz, a client PR manager at AMD, provided a response to the Tom's Hardware-issued query: "The Ryzen Z1 series are purpose-built with handheld gaming in mind. To accomplish this, AMD engineers had to validate entirely new power ranges and optimize the voltage curves specifically for this use case - this optimization and validation work should not be trivialized. So while the technology building blocks (like 'Zen 4' and RDNA 3) are similar between the 7040 and Z1 series, the resulting models have very distinct characteristics customized for their use cases. In addition, the AMD Ryzen AI engine is not available on AMD Ryzen Z1 series processors." Hurwitz also confirmed that AMD's XDNA AI engine is merely disabled (so not removed at hardware level) on the two Z1 APUs - this feature is only enabled on the range-topping Ryzen 7 7840U model and mid-range Ryzen 5 7640U. So yes, there are small differences but AMD and ASUS have probably saved some money on development costs by creating and adopting the "slightly adjusted" Z1 SoC series.

Update May 6th: Tom's Hardware has amended their article (as of May 5, 5:03 p.m. ET) - another source within AMD has informed them about the Z1 and Z1 Extreme APUs having configurable TDPs of 9 W to 30 W. The original story - and AMD's website - claimed a range of 15-30 W.

An intriguing entry has appeared on the Geekbench Browser site, the information was uploaded with a timestamp from this morning (11:07 am on April 20 to be specific) pointing to a mobile ASUS device that was tested in GeekBench 5. The archived info dump reveals that the subject matter of the benchmark was the ASUS ROG Ally handheld gaming console, which has received a lot of attention in recent weeks - with it being touted as a very serious alternative to Valve's Steam Deck, a handheld gaming PC that is quite popular with enthusiasts. The ROG Ally will need to offer a potent hardware package if it stands to compete directly with the Steam Deck, and the latest information confirms that this new contender is very promising in that department. Geekbench 5 awarded an impressive OpenCL score of 35498 to the RC71L variant of the ROG Ally, an RC71X-assigned model is known to exist but details of its exact nature have not been revealed. This particular ROG Alloy unit was running Windows 11 Home (64-bit) under the operating system's performance power plan.

The new entry on Geekbench Browser shows that the Ally is packing an AMD Ryzen Z1 Extreme APU, which appears to be a customized version of the Ryzen 7 7840U APU mobile platform chipset - previous rumors have indicated that the latter would be in the driving seat. Both Phoenix range SoCs share the basic 8 cores and 16 thread makeup, but the Z1 Extreme is capable of boosting up to 5.062 GHz from a base frequency of 3.30 GHz. AMD's Radeon 780M iGPU (RDNA 3) is expected to deal with the Ally's graphical aspect, but the benchmark info dump only provides scant details about the GPU (codenamed "gfx1103") - most notably the presence of six computer units, an 800 MHz max frequency, and access to 8.20 GB of video memory. Number crunching boffins have calculated that the Ally could field 768 FP32 cores, courtesy of the dual issue SIMD design inherent to RDNA 3.