In Win Development Inc. (InWin), a leading innovator in PC hardware has announced the F3 mini tower, which combines aesthetics and practicality for mini ITX and micro ATX builds. This compact enclosure supports the latest trend of motherboards featuring backside connections (ASUS BTF or MSI Project Zero), ensuring the cleanest-looking PC. The front panel consists of mesh windows to enhance cooling directly to the internal components. The F3 utilizes a minimalist approach with its stunning SECC steel and tempered glass materials but also simplifies assembly with a screw-free, unobtrusive design. Choose between black or white variants with wooden accents on the white edition.

Build Big. Stay Compact.
Motherboards with different backside connector placements will not be an issue within the InWin F3 since multi-orientation brackets are available on the motherboard tray. Four PCI-Express slots are available for graphics cards with extra-large heatsinks, supporting up to 340 mm long. The F3 is compatible with NVIDIA's new SFF-ready sizing guidelines to make component compatibility easier for DIY PC builders. The compact enclosure allows CPU heatsinks up to 160 mm tall or radiator support up to 240/280 mm on top for liquid cooling setups. ATX power supplies up to 160 mm long are installed behind the front panel as a space-saving design. The front I/O includes USB 3.2 Gen 2x2 Type-C, two additional USB 3.2 Gen 1 Type-A ports, and a 3.5 mm HD audio combo jack (CTIA).