On March 3, Longsys, a branded semiconductor memory enterprise, made its first-ever appearance at MWC 2025 in Barcelona. Under the theme "New Mode of Storage Empowering Global Mobility", it showcased a series of innovative storage products, attracting widespread attention.

PTM Business Model: Full-Stack Customization Service
The Product Technology Manufacturing (PTM) model was a major highlight, showcasing Longsys' full-stack customization capabilities—from in-house controller development and product design to rigorous testing and intelligent manufacturing.

TCL CSOT, a global leader in display technology for over 15 years, demonstrated its next-generation immersive virtual reality display technologies at MWC 2025. Among the highlights, the company presented the ultra-low power consumption VR display and the world's first mass-produced VR display with the highest PPI. These innovations are already helping to power the future of immersive visual experiences around the world.

Virtual reality is playing an increasingly vital role in both entertainment and professional applications. Around 53 million American adults already own a VR system. By 2029, the number of users in the AR and VR market worldwide is projected to reach 3.7 billion users. Amid surging demand, TCL CSOT is committed to delivering visual technologies that break the limits in more realistic, comfortable, and high-performance VR experiences.

Jio Platforms Limited (JPL), together with AMD, Cisco, and Nokia, announced at Mobile World Congress 2025 plans to form an innovative, new Open Telecom AI Platform. Designed to support today's operators and service providers with real-world, AI-driven solutions, the Telecom AI Platform is set to drive unprecedented efficiency, security, capabilities, and new revenue opportunities for the service provider industry.

End-to-end Network Intelligence
Fueled by the collective expertise of world leaders from across domains including RAN, Routing, AI Data Center, Security and Telecom, the Telecom AI Platform will create a new central intelligence layer for telecom and digital services. This multi-domain intelligence framework will integrate AI and automation into every layer of network operations.

The telecommunications industry is undergoing a major transformation as AI and 5G technologies reshape networks and connectivity. While operators are eager to modernize infrastructure, challenges remain, such as high capital expenditures, security concerns and integration with legacy systems. At MWC 2025, Intel - alongside more than 50 partners and customers - will showcase groundbreaking solutions that deliver high capacity and high efficiency performance with built-in AI integration, eliminating the need for costly additional hardware and delivering optimized total cost of ownership (TCO).

"By leveraging cloud technologies and fostering close collaborations with partners, we are helping operators virtualize both 5G core and radio access networks - proving that the most demanding, mission-critical workloads can run efficiently on general-purpose silicon," said Sachin Katti, senior vice president and general manager of the Network and Edge Group at Intel Corporation. "Through our Xeon 6 processors, we are enabling the future of AI-powered network modernization."

Belkin, a leading consumer electronics brand for over 40 years, today introduced a collection of innovative new products across its Mobile Power, Audio and Connectivity portfolios. Showcased at ShowStoppers at Mobile World Congress - the world's most influential technology showcase for media with a focus on mobile technology - these new additions highlight Belkin's commitment to design excellence, sustainability, and quality.

Belkin Sustainability
Belkin remains committed to its goal of 100% carbon neutrality in its offices and operations (scope 1 & 2) by 2025 with the goal of carbon neutrality across its entire business, including product-level (scope 3) emissions, by 2030. Two years after beginning its transition to using 72-75% post-consumer recycled (PCR) materials in its products, Belkin has transitioned over 359 products and has replaced 432 metric tons of virgin plastics with PCR materials.

RayNeo, a leading innovator in consumer Augmented Reality (AR) technology, has unveiled its latest XR glasses, the RayNeo Air 3s, at MWC 2025. Alongside this groundbreaking release, the company showcased its other two innovations: the AI-powered, Full-Color AR Glasses RayNeo X3 Pro and the Camera AI Glasses RayNeo V3. Together, these cutting-edge devices underscore RayNeo's unwavering commitment to redefining immersive experiences and enhancing everyday usability through advanced AR solutions.

RayNeo Air 3s: Lightweight XR for Seamless Daily Use
The RayNeo Air 3s redefines the landscape of lightweight XR glasses, seamlessly merging portability with state-of-the-art display technology. Equipped with 3840 Hz high-frequency dimming, a staggering 200,000:1 contrast ratio, and a 154% sRGB color gamut, the Air 3s delivers breathtaking image quality, setting a new benchmark for birdbath display solutions. Its expansive 201-inch virtual screen and TÜV Rheinland-certified eye comfort technology ensure an immersive yet comfortable experience, making it ideal for all-day wear.

This afternoon at Mobile World Congress 2025 (MWC), Newnal Inc. will unveil another global breakthrough in personal blockchain and AI innovation, the Newnal personal AI operating system (OS). Built on a web3 foundation, Newnal's blockchain-based OS can be embedded and accessed via any device. Newnal gives people the power to design, drive and protect the experiences and opportunities they care about the most.

"With Newnal ai, each of us can now create another 'I'," said founder and Chief Creative Officer YT Kim, "The last generation of technology underserved humanity. Web3 ai Newnal gives the power of creativity and experience back to people, allowing each of us to enhance our lives in ways that we could only have imagined in the past. It's AI focused on our hearts."

At MWC 2025, Lenovo unveils its latest portfolio of AI-powered business devices, featuring next-generation ThinkPad and ThinkBook laptops, expanded software and recent ThinkShield security solutions, and showcases visionary proof-of-concept innovations. Designed to enhance productivity, personalization, and business protection, these new devices integrate AI-driven computing, flexible form factors, and enterprise security solutions to meet the evolving demands of professionals and hybrid workers.

"AI is fundamentally transforming how businesses operate, and at Lenovo, we are committed to delivering smarter, more secure, and more adaptable solutions that empower professionals in today's fast-evolving workplace. Our latest ThinkPad and ThinkBook innovations leverage AI to enhance productivity, streamline IT management, and provide more secure and seamless hybrid work experiences," said Eric Yu, SVP of SMB and Commercial Product Center, Lenovo Intelligent Devices Group. "The ThinkBook codename Flip AI PC Concept exemplifies our vision for the future—where AI-powered devices drive efficiency, personalization, and collaboration like never before. With our expanding portfolio of AI-integrated business devices and intelligent IT solutions, Lenovo is helping organizations to harness the power of AI in an ever-changing world."

Today, at MWC 2025, Lenovo unveiled groundbreaking advancements in hybrid AI with integrated devices and solutions to empower creators, professionals, and enterprises. The new offerings exemplify Lenovo's vision of Smarter AI for all and showcase how end-to-end AI can offer seamless creation, connection, and collaboration. The range of technology launched at MWC—from new device form factors to affordable edge inference—show the maturity and versatility of Lenovo's AI portfolio while linking bold innovation with real-world impact.

"We believe in the power of convergence: bringing together AI models, data, and computing power—running on devices, on the edge, and in the cloud—to build AI solutions for customers," said Lenovo CEO and chairman Yuanqing Yang, who delivered a keynote address at MWC. "This convergence drives stronger ecosystem connectivity, unleashing the power of AI to augment human creativity to turn ideas into reality."

Today at MWC 2025, Lenovo announced new Yoga and IdeaPad AI laptops, alongside software and innovative new proofs of concept visuals and accessories that leverage the power of AI to supercharge creativity and productivity for consumers. With a greater selection of Copilot+1 AI PCs offering AI-enabled experiences like Windows Studio Effects, new NVIDIA GPU options for heavy-duty processing tasks, and new Lenovo Aura Edition laptops imagined with Intel that streamline the PC experience, Lenovo's new Yoga and IdeaPad laptops make creating, completing tasks, and enjoying content seamless, simple, and fun. Lenovo's new AI laptops, software, and concepts unveiling at MWC continue to expand on the company's wide AI portfolio, embodying its promise to deliver Smarter Technology for All - combining cutting-edge innovation, user-centric versatility, and exceptional value to meet the needs of more consumers.

"As we push the limits of AI innovation higher than ever, it is important to remember that delivering access to AI for all is equally a core tenet of Lenovo's philosophy. Likewise, as we endeavor to redefine the boundaries of power in technology, we must ensure that it continues to be a positive force," said Jun Ouyang, Lenovo's Senior Vice President and General Manager of the Consumer Segment, Intelligent Devices Group. "With the announcement of innovations like the Yoga Pro 9i Aura Edition, the IdeaPad Slim 3x, and the Lenovo Yoga Solar PC Concept, Lenovo has delivered a suite of new devices and proofs of concept that empower end users to let their creativity shine, their 'process' unbounded by the processing of their PC thanks to AI-powered innovation."

At MWC 2025 in Barcelona, Lenovo debuted its latest prototype laptop that integrates solar charging capabilities directly into the lid. The "Yoga Solar PC Concept" utilizes photovoltaic cells with a 24% conversion efficiency rate and implements "Back Contact Cell" technology that positions mounting hardware behind the cells to maximize absorption surface. The device measures 15 mm thick and weighs 1.22 kg. The system employs a Dynamic Solar Tracking mechanism that monitors real-time power generation and automatically adjusts charging parameters to optimize energy capture regardless of lighting conditions. According to Lenovo's testing, 20 minutes of direct sunlight exposure generates sufficient power for approximately one hour of video playback.

Lenovo chose an unspecified Intel Core Ultra processor generation for the platform base, up to 32 GB RAM, 1 TB storage, and a 14-inch OLED display. Three USB-C ports allow for conventional charging when solar power is unavailable. Lenovo is also developing a separate Solar Power Kit accessory for Yoga devices. This peripheral includes a detachable solar panel with USB-C connectivity that charges external battery packs, which can later power laptops or other devices. No release timeline or pricing information has been announced for either product. However, this is a welcome development in the laptop space, which has maintained the tried-and-true formula of laptop design and functionality.

GSMA MWC Barcelona, runs from March 3 to 6, 2025 at the Fira Barcelona Gran Via in Barcelona, Spain. AMD is proud to participate in forward-thinking discussions and demos around AI, edge and cloud computing, the long-term revolutionary potential of moonshot technologies like quantum processing, and more. Check out the AMD hospitality suite in Hall 2 (Stand 2M61) and explore our demos and system design wins. Attendees are welcome to stop by informally or schedule a time slot with us.

As modern networks evolve, high-performance computing, energy efficiency, and AI acceleration are becoming just as critical as connectivity itself. AMD is at the forefront of this transformation, delivering solutions that power next-generation cloud, AI, and networking infrastructure. Our demos this year showcase AMD EPYC, AMD Instinct, and AMD Ryzen AI processors, as well as AMD Versal adaptive SoC and Zynq UltraScale+ RFSoC devices.

Intel today showcased how Intel Xeon 6 processors with Efficient-cores (E-cores) have dramatically accelerated time-to-market adoption for the company's solutions in collaboration with the ecosystem. Since product introduction in June 2024, 5G core solution partners have independently validated a 3.2x performance improvement, a 3.8x performance per watt increase and, in collaboration with the Intel Infrastructure Power Manager launched at MWC 2024, a 60% reduction in run-time power consumption.

"As 5G core networks continue to build out using Intel Xeon processors, which are deployed in the vast majority of 5G networks worldwide, infrastructure efficiency, power savings and uncompromised performance are essential criteria for communication service providers (CoSPs). Intel is pleased to announce that our 5G core solution partners have accelerated the adoption of Intel Xeon 6 with E-cores and are immediately passing along these benefits to their customers. In addition, with Intel Infrastructure Power Manager, our partners have a run-time software solution that is showing tremendous progress in reducing server power in CoSP environments on existing and new infrastructure." -Alex Quach, Intel vice president and general manager of Wireline and Core Network Division

GIGABYTE, a global leader in computing innovation and technology, will showcase its full-spectrum AI computing solutions that bridge development to deployment at MWC 2025, taking place from March 3-6.

"AI+" and "Enterprise-Reinvented" are two of the themes for MWC. As enterprises accelerate their digital transformation and intelligent upgrades, the transition of AI applications from experimental development to democratized commercial deployment has become a critical turning point in the industry. Continuing its "ACCEVOLUTION" initiative, GIGABYTE provides the comprehensive infrastructure products and solutions spanning cloud-based supercomputing centers to edge computing terminals, aiming to accelerate the next evolution and empower industries to scale AI applications efficiently.
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