Crucial, Micron's global consumer brand of computer memory and storage, today announced its limited edition Crucial Ballistix MAX 5100 gaming DRAM. Expanding on the award-winning legacy of the Crucial Ballistix product portfolio, this latest offering provides consumers with an optimal gaming memory option, boasting the highest speeds available to date for purchase.

Crucial Ballistix is the only brand of gaming DRAM that incorporates custom tuning at the die level, resulting in world record-setting performance. In fact, these same gaming DRAM modules were recently used by a competitive overclocker to hit a blistering 6,666MT/s, the fastest ever for DDR4 modules. The record-breaking frequency and valid CPU-Z screenshot are posted on HWBOT. Like Micron's leading products and solutions for enterprise and personal computing, Crucial gaming memory is purpose-built, making it the only gaming memory that's vertically integrated - designed, engineered and manufactured from start to finish in-house. This unique approach is unmatched by competitors, allowing the new 5100MT/s modules to deliver blazing fast speeds to hardcore gamers and maximized results to overclocking enthusiasts.

NVIDIA's upcoming GeForce RTX 3070 performance segment graphics card uses 14 Gbps GDDR6 memory speed, according to the product page of the ZOTAC RTX 3070 Twin Edge (model: ZT-A30700E-10P), and the RTX 3070 DUAL by ASUS. This settles speculation around NVIDIA using the fastest available 16 Gbps GDDR6 memory for the RTX 3070. The company is using the even faster 19.5 Gbps and 19 Gbps GDDR6X memory for the RTX 3090 and RTX 3080, which it co-developed with Micron Technology. The use of 14 Gbps GDDR6 across a 256-bit wide memory bus gives the RTX 3070 the same 448 GB/s memory bandwidth as the RTX 2070. NVIDIA plans to launch the GeForce RTX 3070 some time in October, with prices starting at USD $499.

OWC ; a leading zero emissions Mac and PC technology company and one of the world's most respected providers of Memory, External Drives, SSDs, Mac & PC docking solutions, and performance upgrade kits introduces the new OWC Mercury Elite Pro Dual with 3-Port Hub. Designed to handle diverse workflows, the Mercury Elite Pro Dual offers up to 32 TB of storage capacity plus a built-in high-powered USB hub for accessory connectivity and device charging, easily making it the centerpiece of your digital desktop. The compact Mercury Elite Pro Dual is equipped and ready to go to give you its best performance with any USB equipped Mac, PC, or tablet from nearly the last decade. You don't need to worry about what system you have, the Mercury Elite Pro Dual with 3-Port Hub is there to provide the performance, data capacity, and hub capability your digital needs.

The Mercury Elite Pro Dual with 3-Port Hub gives you nearly infinite options for your workspace. This modern designed solution is universally USB compatible and can handle diverse workflows. Available plug and play ready, the Mercury Elite Pro Dual is not only superfast, convenient, and versatile, it will quickly become the centerpiece of your digital lifestyle.

Introducing the Z490 DARK K|NGP|N Edition, now the premier motherboard in EVGA's Z490 lineup. The Z490 DARK K|NGP|N is a limited-edition motherboard that features validated support for memory speeds at 5000 MHz+ (OC), and a collectable retail box hand-signed by K|NGP|N himself.

The EVGA Z490 DARK K|NGP|N is also packaged with an 18-phase power design, right-angled connectors, and an Intel 2.5 GbE NIC to ensure that the only limitation of your Z490 DARK K|NGP|N is your imagination. The Z490 DARK K|NGP|N is a masterwork of design and engineering, bringing the best performance and stability available on the Z490 chipset.

Micron Technology, Inc., today announced the world's fastest discrete graphics memory solution, GDDR6X, the first to power system bandwidth up to 1 terabyte per second (TB/s). Working with visual computing technology leader NVIDIA, Micron debuted GDDR6X in the new NVIDIA GeForce RTX 3090 and GeForce RTX 3080 graphics processing units (GPUs), which are tailored to support the fast speeds that immersive, high-performance gaming applications demand.

"Our multilevel signaling innovation in GDDR6X has shattered conventional bandwidth limits, clocking record-breaking speeds," said Tom Eby, senior vice president and general manager of the Compute & Networking Business Unit at Micron. "Unlike traditional memory, GDDR6X has unparalleled data rates that can keep pace with gaming innovation and data-hungry applications - setting a new standard for graphics memory."

According to the latest DigiTimes Research report, it is said that Korean memory makers have experienced a surge in chip output value. Korean memory manufacturers are Samsung Electronics and SK Hynix, which both have seen a massive growth of 22.1% on a yearly basis and 13.9% sequentially in the second quarter of 2020. This is no small feat as the demand for memory in the smartphone industry has been slowed in that period due to the COVID pandemic, however, it was offset by strong demand from servers and notebooks. When the output of Korean memory giants is fused, Samsung and SK Hynix had combined revenue of KRW22.9 trillion or about 20.8 billion USD. The demand for memory is expected to continue its growth due to the 5G headset market.

According to the latest insights from DigiTimes, industry memory prices are expected to fall by as much as 10% in Q4 of this year. DigiTimes is citing industry sources of its own for this prediction, meaning that the industry is slowly preparing to take a price hit. The reason for this price drop is that there has gathered an oversupply of memory that is resulting in price fall. That fall is expected to continue as we are headed in 2021, so the memory might become even cheaper. It is, of course, worth noting that memory manufacturers will adjust their capacities and production lines so the price fall should be adjusted in not too distant future.

SiFive, Inc., the leading provider of commercial RISC-V processor IP and silicon solutions, today announced it raised $61 million in a Series E round led by SK hynix, joined by new investor Prosperity7 Ventures, with additional funding from existing investors, Sutter Hill Ventures, Western Digital Capital, Qualcomm Ventures, Intel Capital, Osage University Partners, and Spark Capital.

"Global demand for storage and memory in the data center is increasing as AI-powered business intelligence and data processing growth continues", said Youjong Kang, VP of Growth Strategy, SK hynix. "SiFive is well-positioned to grow with opportunities created from data center, enterprise, storage and networking requirements for workload-focused processor IP."

NVIDIA's GeForce RTX 20-series "Turing" graphics card series did not increase video memory sizes in comparison to GeForce GTX 10-series "Pascal," although the memory itself is faster on account of GDDR6. This could change with the GeForce RTX 30-series "Ampere," as the company looks to increase memory sizes across the board in a bid to shore up ray-tracing performance. WCCFTech has learned that in addition to a variety of strange new memory bus widths, such as 320-bit, NVIDIA could introduce certain higher variants of its RTX 30-series cards with video memory sizes as high as 20 GB and 24 GB.

Memory sizes of 20 GB or 24 GB aren't new for NVIDIA's professional-segment Quadro products, but it's certainly new for GeForce, with only the company's TITAN-series products breaking the 20 GB-mark at prices due north of $2,000. Much of NVIDIA's high-end appears to be resting on segmentation of the PG132 common board design, coupled with the GA102 silicon, from which the company could carve out several SKUs spaced far apart in the company's product stack. NVIDIA's next-generation GeForce "Ampere" family is expected to debut in September 2020, with product launches in the higher-end running through late-Q3 and Q4 of 2020.

OWC; a leading zero emissions Mac and PC technology company and one of the world's most respected providers of Memory, External Drives, SSDs, Mac & PC docking solutions and performance upgrade kits reveals the new OWC Rover Pro - a toolless, patent-pending made in the USA design that allows users to add wheels to the 2019 Mac Pro in under two minutes. Factory-finish, matching stainless-steel housings feature 360-degree articulating wheels with non-marring soft rubber tread install and include stops to keep your Mac Pro in place and offer the freedom of mobility when needed.

The OWC Rover Pro is the innovative mobility solution for the 2019 Mac Pro. The patent-pending design enables your Mac Pro to go "wheels on/wheels off" in under two minutes while saving time and money vs the factory wheel kit. No tools, no hassle, no worry: simply place your Mac Pro's factory feet into the Rover Pro's polished stainless-steel housings and secure with a few hand twists. When you're done moving your Mac Pro around, the Rover Pro allows quick and easy conversion back to the factory feet for stationary use.

GALAX on Thursday introduced the Hall of Fame (HOF) OC Lab Diamond and HOF OC Lab Phantom lines of enthusiast-segment memory. These kits are led by a DDR4-5000 memory kit with 19-26-26-46 timings. The company didn't put out voltages, but the DDR4-4800 + 19-22-22-46T variant in the same series pulls 1.5 V, so the DDR4-5000 kit is only expected to be equal or higher. Other high-voltage hits include DDR4-4600 18-26-26-42 @1.5 V; DDR4-4400 18-22-22-42 @1.50 V; and DDR4-4266 17-22-22-38 @1.50 V. The HOF OC Lab Diamond memory kits feature chunky aluminium heatspreaders with pearl-white finish and a gold-plated ornament.

The HOF OC Lab Phantom line is positioned a notch below the HOF OC Lab Diamond. It comes in enthusiast-segment memory frequencies of DDR4-4000 17-19-19-38 @1.45 V (19-25-25-25 @1.40 V); DDR4-3866 16-18-18-36 @1.40 V, and DDR4-3600 16-16-16-36 @1.35 V. These modules feature aluminium heatspreaders with an acrylic crown RGB diffuser. The aluminium heatspreader features diamond-cut edges. The company didn't reveal pricing of either kits. At this time only the Greater China regional division of GALAX released the two memory lines.

Samsung Electronics reported today KRW 52.97 trillion in consolidated revenue and KRW 8.15 trillion in operating profit for the second quarter ended June 30, 2020. Even as the spread of COVID-19 caused closures and slowdowns at stores and production sites around the world, the Company responded to challenges through its extensive global supply chain, while minimizing the impact of the pandemic by strengthening online sales channels and optimizing costs.

Quarterly operating profit rose 26 percent from the previous quarter and 23 percent from a year earlier, thanks to firm demand for memory chips and appliances, as well as a one-off gain at its Display Panel Business. A partial recovery in global demand since May also helped offset some COVID-19 effects, resulting in higher earnings than initially expected. Revenue in the quarter fell 4 percent from the previous quarter and 6 percent from a year earlier due to reduced sales of smartphones and other devices.

HyperX, the gaming division of Kingston Technology, Inc., today announced the release of new and updated speeds and capacities for HyperX Predator DDR4 RGB and HyperX FURY DDR4 RGB memory modules and kits. Featuring memory kits up 256 GB and speeds up to 4600MHz1, the Predator DDR4 RGB and FURY DDR4 RGB memory modules are designed to pass rigorous certification test procedures and are Intel XMP certified and AMD certified Ready for Ryzen.

HyperX Predator DDR4 delivers fast frequencies and low latencies with speeds up to 4800MHz1 and latencies from CL12 to CL19. Predator DDR4 utilizes a black aluminium heat spreader and matching black PCB to complement the look of the latest PC builds. Predator memory is available in 8 GB, 16 GB and 32 GB single modules and in kits of two, four, and eight.

PNY Technologies Asia Pacific Limited Technologies, the world's leading brand of extreme performance memory,NAND Flash products and professional/gaming graphic cards is pleased to announce the latest addition of its PC Memory assortment by adding the XLR8 Gaming RGB DDR4 Desktop Memory line-up.

The XLR8 Gaming RGB line provides a dynamic experience for gamers, modders and enthusiasts alike combining RGB customization with overclocking capability, XRL8 RGB DRAM uses selected aluminium alloy heat spreader with state of the art surface finish technique and design, create the extraordinary look and feel.

TEAMGROUP is proud to announce that T-FORCE broke the world record again. T-FORCE laboratory worked with the overclocker, LeeGH, using T-FORCE XTREEM ARGB DDR4 3200 MHz CL14 memory modules to win the world record on well-known overclocking platform, HWBOT. T-FORCE XTREEM ARGB DDR4 3200 MHz CL14 memory modules achieved the highest read/write speed of 136,678 /104,643 MB/s of quad channel kit as the world record currently.

T-FORCE laboratory and the overclocker LeeGH worked together on AIDA64, one of the significant overclocking competitions, reaching read/write speed of 136,678/104,643 MB/s as the world record currently with ASUS ROG Rampage VI Extreme Encore motherboard and X299 chipset. Meanwhile, the achievement was listed on HWBOT, an ultimate overclocking challenge site. The extremely high-speed performance of T-FORCE XTREEM ARGB has been witnessed by overckockers from all over the world.

Samsung Electronics today introduced its second-generation quad-level cell (QLC) flash drive, the 870 QVO SATA SSD, that is setting a new standard for high-capacity consumer storage. Featuring an industry-leading capacity of up to eight terabytes (TB), the new SSD delivers an uncompromising mix of speed, storage capacity and reliability for mainstream and professional PC users.

In the past, consumers have had to choose between SSDs - which provide superior performance - and HDDs, which traditionally offer greater capacity. Samsung's 870 QVO SSD, however, is able to reliably offer the best of both worlds, making it an optimal choice for mainstream PC users who prioritize performance and value, as well as for professional users who require high levels of capacity.

AMD's 7 nm "Renoir" APU silicon, which features eight "Zen 2" CPU cores, has only a quarter of the L3 cache of the 8-core "Zen 2" CCD used in "Matisse," "Rome," and "Castle Peak" processors, with each of its two quad-core compute complexes (CCXs) featuring just 4 MB of it (compared to 16 MB per CCX on the 8-core "Zen 2" CCD). Chinese-language tech publication TecLab pubished a quick review of an alleged Ryzen 7 4700GE socket AM4 processor based on the "Renoir" silicon, and discovered that the chip offers significantly lower memory latencies than "Matisse," posting just 47.6 ns latency when paired with DDR4-4233 dual-channel memory.

In comparison, a Ryzen 9 3900X with these kinds of memory clocks typically posts 60-70 ns latencies, owing to the MCM design of "Matisse," where the CPU cores and memory controllers sit on separate dies, which is one of the key reasons AMD is believed to have doubled the L3 cache amount per CCX compared to previous-generation "Zeppelin" dies. TecLab tested the alleged 4700GE engineering sample on a ROG Crosshair VIII Impact X570 motherboard that has 1 DIMM per channel (the best possible memory topology).

Intel today introduced its 3rd Gen Intel Xeon Scalable processors and additions to its hardware and software AI portfolio, enabling customers to accelerate the development and use of AI and analytics workloads running in data center, network and intelligent-edge environments. As the industry's first mainstream server processor with built-in bfloat16 support, Intel's new 3rd Gen Xeon Scalable processors makes artificial intelligence (AI) inference and training more widely deployable on general-purpose CPUs for applications that include image classification, recommendation engines, speech recognition and language modeling.

"The ability to rapidly deploy AI and data analytics is essential for today's businesses. We remain committed to enhancing built-in AI acceleration and software optimizations within the processor that powers the world's data center and edge solutions, as well as delivering an unmatched silicon foundation to unleash insight from data," said Lisa Spelman, Intel corporate vice president and general manager, Xeon and Memory Group.

XPG, a provider of high-performance products for gamers, e-sports pros, and tech enthusiasts, is pleased to announce that it has become the Official Gaming Notebook sponsor of the official Valve RMR CS:GO Online tournament series CS_SUMMIT 6.Organized by Beyond the Summit (BTS), the tournament will take place from June 22 to July 5. As a part of the sponsorship, the XPG XENIA will be the Official Gaming Notebook of the tournament.

CS_SUMMIT 6 will be broadcast internationally and is organized regionally with qualifying games in Europe and North America. XPG will be the major sponsor of the event in the Gaming Notebook category.This is the second time XPG has participated in a BTS-organized tournament as a sponsor. During CS_SUMMIT 5, XPG was the Official Keyboard sponsor.

XPG, a provider of high-performance products for gamers, esports pros, and tech enthusiasts, is pleased to announce that it has expanded its DDR4 overclocking testing program with a new working relationship with leading motherboard maker, GIGABYTE. Following the heels of the launch of the Intel Z490 chipset, XPG began testing and overclocking its new DDR4 modules with the latest Z490 platforms, as well as AMD B550 platforms, to ensure they meet the highest standards of overclocking performance and stability. This latest cooperation with GIGABYTE is a furtherance of this endeavor.

In cooperation with GIGABYTE, the XPG Overclocking Lab (XOCL) was able to overclock the XPG SPECTRIX D50 DDR4 module to 4800 MHz on the GIGABYTE Z490 AORUS XTREME WATERFORCE motherboard. Following this impressive result, the XOCL proceeded to test other XPG DDR4 modules on an array of other GIGABYTE motherboards to similar results.

The Taichung District Court in Taiwan ruled in favor of Micron Technology in a case dating back to 2017, against semiconductor foundry UMC and two of its former employees. Micron had alleged that UMC and three of Micron former employees stole Micron's trade secrets and conveyed them to Mainland Chinese DRAM maker Fujian Jinhua IC. One of the accused include Stephen Chen, former president for Micron Memory in Taiwan.

The Court ruled that the three former Micron employees serve 4.5-6.5 years in prison, in addition to paying NTD 4-6 million fines, each. As for UMC, it has been ordered to pay NTD 100 million (USD $3.4 million) in damages to Micron Technology, a parking ticket value compared to the commercial damage FJIC will inflict to Micron in the years to come.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is releasing new extreme-speed DDR4 memory kits that push 16 GB and 8 GB modules up to DDR4-4400 with a low latency of CL17-18-18-38 across the board, under the Trident Z Royal family. Upgrading specifications across all three fronts of memory frequency speed, module capacity, and low memory latency, these specifications are engineered with Samsung B-die ICs and designed for the latest Intel Z490 platform to achieve higher performance for gaming and content creation.

As 32 GB memory total capacity becomes the standard for gaming PC and performance PC builds, G.SKILL recognizes the importance of extreme performance 16 GB x2 memory kit configurations. Rising to the challenge, G.SKILL has created the DDR4-4400 CL17-18-18-38 memory kit with 32 GB (16 GB x2) capacity under the Trident Z Royal family. See the memory kit stress testing on the MSI MPG Z490 GAMING PLUS motherboard with an Intel Core i5-10600K processor in the screenshot below.

2021 is poised to mark a banner year for global fab equipment spending with 24 percent growth to a record US$67.7 billion, 10 percent higher than the previously forecast US$65.7 billion, and all product segments promising solid growth rates, according to the second-quarter 2020 update of the SEMI World Fab Forecast report. Memory fabs will lead worldwide semiconductor segments with US$30 billion in equipment spending, while leading-edge logic and foundry is expected to rank second with US$29 billion in investments.

The 3D NAND memory subsegment will help power the spending spree with a 30 percent jump in investments this year before tacking on 17 percent growth in 2021. DRAM fab investments will surge 50 percent next year after declining 11 percent in 2020, and fab spending on logic and foundry, mainly leading edge, will trace a similar but more muted trajectory, rising 16 percent 2021 after an 11 percent drop this year.

GeIL, Golden Emperor International Ltd. - one of the world's leading PC components & peripheral manufacturers announced ORION series memory for gamers and content creators providing high speed as well as massive memory capacity scalable up to 4000 MHz CL18 64 GB (2 x 32 GB) kit.

High speed and low latencies used to be gamers' favorite while massive memory capacity which greatly helps the multimedia creation is preferred for content creators. Scaling up to 2x 32 GB 4000 MHz CL18, GeIL ORION series memory is an exceptionally balanced choice designed to satisfy multiple needs, especially for users require both extraordinary performance for gaming and massive memory capacity for multimedia creation.

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today extended its record of leading the industry's innovation in specialty Flash memory with the introduction of a more flexible, high-speed read capability in its latest QspiNAND Flash products. Automotive and IoT device manufacturers are increasingly adopting high-performance Single-Level Cell (SLC) NAND Flash as a low-cost alternative at densities of 512 Mbits and higher to the NOR Flash traditionally used for code storage. Previous Winbond innovations in high-performance NAND Flash include the Quad SPI-NAND interface, which shares the same 6-pin signals and QSPI command set as Quad SPI-NOR, and the Continuous Read function, which achieves up to a 52 MB/s continuous data transfer rate at a 104 MHz clock frequency.