Micron Technology, Inc. (Nasdaq: MU), a leader in innovative memory and storage solutions, today announced a market segment-based reorganization of its business units to capitalize on the transformative growth driven by AI, from data centers to edge devices.

Micron has maintained multiple generations of industry leadership in DRAM and NAND technology and has the strongest competitive positioning in its history. Micron's industry-leading product portfolio, combined with world-class manufacturing execution enables the development of differentiated solutions for its customers across end markets. As high-performance memory and storage become increasingly vital to drive the growth of AI, this Business Unit reorganization will allow Micron to stay at the forefront of innovation in each market segment through deeper customer engagement to address the dynamic needs of the industry.

Last year, leakers posited that Xiaomi engineers were working on proprietary new-generation mobile chipset. The giant Chinese technology company has produced proprietary SoC designs in the past—most notably 2017's Pengpai/Surge S1 (blink, and you missed it)—but has largely relied on a wide swatch of Qualcomm solutions for deployment in smartphones. According to a fairly fresh ITHome news report (via a source at Sina Technology), Xiaomi has established a "chip platform department" under the umbrella of its mobile phone product development division. The exact nature of this newly-formed team remains semi-mysterious, and how it intermeshes with current (rumored) proprietary chip design efforts. The megacorporation's speculated "dedicated chip platform department" is said to be working on a "Xuanjie" SoC series.

Qin Muyun—a former senior director of product marketing at Qualcomm—is purported to be the new department's leader. Insiders believe that Muyun will answer directly to Xiaomi's CEO: Lei Jun. Over the past half decade, company engineers have accumulated chip designing experience in multiple lesser technology fields—ITHome lists: "imaging, fast charging, power management, communication, and display" aspects. Xiaomi leadership could be "shaking up" its first-party SoC development projects. Two weeks ago, rumors turned up online regarding a node process downgrade—from 3 nm to 4 nm. Smartphone industry watchdogs reckon that Xiaomi's forthcoming flagship chipset design will perform on the level of Qualcomm's first generation Snapdragon 8 mobile processor (from 2021).

Samsung Electronics today announced the new Galaxy XCover7 Pro and Galaxy Tab Active5 Pro, enterprise-ready devices designed to meet the demands of today's fast-paced, high-intensity work environments. Continuing the legacy of Samsung's ruggedized devices, these latest Pro models are versatile, optimized and secure—delivering enhanced durability, steady performance and optimized workflow to empower frontline workers, from the office to the field and beyond.

With 5G connectivity, an upgraded processor and increased memory, the XCover7 Pro and Tab Active5 Pro offer enhanced mobility and reliability. The XCover7 Pro features a powerful new stereo speaker system with anti-feedback technology, which minimizes unwanted audio loops for clearer communication. Both devices offer enhanced battery capacity, with the XCover7 Pro equipped with a 4,350mAh battery for longer usage, while the Tab Active5 Pro comes with a 10,100mAh battery set designed to support demanding workflows. The Tab Active5 Pro also supports Dual Hot-Swap battery functionality, allowing workers to replace batteries without powering down their devices and ensuring seamless operation even when battery levels are low.

MediaTek today announced the Dimensity 9400+ SoC, the latest addition to MediaTek's Dimensity flagship chipset family. Providing exceptional Generative and agentic AI capabilities as well as other performance enhancements, the Dimensity 9400+ supports the latest Large Language Models (LLM) while sustaining a super power-efficient design. The Dimensity 9400+ features an All Big Core design, integrating one Arm Cortex-X925 core operating up to 3.73 GHz, combined with 3x Cortex-X4 and 4x Cortex-A720 cores. This powerful configuration accelerates single and multithreaded performance for top-tier Android UX experiences.

"The MediaTek Dimensity 9400+ will make it easier to deliver innovative, personalized AI experiences on-device, combined with enhanced overall performance to ensure your device can handle all tasks with ease," said JC Hsu, Corporate Senior Vice President at MediaTek. "We are working closely with developers and manufacturers to continue building a robust ecosystem of AI applications and other features that will bring a number of speed and privacy benefits to consumers."

MediaTek has introduced the Kompanio Ultra, the latest milestone in AI-powered, high-performance Chromebooks. Leveraging MediaTek's proven expertise in flagship innovation, this powerful new platform brings fantastic on-device AI capabilities, superior computing performance, and industry-leading power efficiency to the newest Chromebook Plus devices. "The Kompanio Ultra underscores our commitment to delivering groundbreaking computing performance and efficiency that MediaTek has shown as a leader in the mobile compute space for many years," said Adam King, Vice President & General Manager of Computing and Multimedia Business at MediaTek. "We worked closely with Google to ensure the newest Chromebook Plus devices enjoy next-generation on-device AI capabilities, superior performance per watt, and immersive multimedia."

The Kompanio Ultra is MediaTek's most powerful Chromebook processor to date, integrating 50 TOPS of AI processing power to enable on-device generative AI experiences. With MediaTek's 8th-generation NPU, users can expect real-time task automation, personalized computing, and seamless AI-enhanced workflows—with local processing for enhanced speed, security, efficiency, and support for AI workloads without an internet connection. Built on the cutting-edge (TSMC) 3 nm process, the Kompanio Ultra features an all-big-core CPU architecture with an Arm Cortex-X925 processor clocked at up to 3.62 GHz, delivering industry-leading single and multithreaded performance. Whether handling intensive applications like video editing, content creation, or high-resolution gaming, this processor ensures smooth, lag-free performance with unmatched multitasking capabilities.

NVIDIA and its laptop manufacturing partners managed to squeeze out higher end models at the start of the week (March 31); qualifying just in time as a Q1 2025 launch. As predicted by PC gaming hardware watchdogs, conditions on day one—for the general public—were far from perfect. Media and influencer outlets received pre-launch evaluation units—Monday's embargo lift did not open up floodgates to a massive number of published/uploaded reviews. Independent benchmarking of Team Green's flagship—GeForce RTX 5090 Mobile—produced somewhat underwhelming results. To summarize, several outlets—including Notebookcheck—observed NVIDIA's topmost laptop-oriented GPU trailing way behind its desktop equivalent in lab tests. Notebookcheck commented on these findings: "laptop gamers will want to keep their expectations in check as the mobile GeForce RTX 5090 can be 50 percent slower than the desktop counterpart as shown by our benchmarks. The enormous gap between the mobile RTX 5090 and desktop RTX 5090 and the somewhat disappointing leap over the outgoing mobile RTX 4080 can be mostly attributed to TGP."

The German online publication was more impressed with NVIDIA's sub-flagship model—two Ryzen 9 9955HX-powered Schenker XMG Neo 16 test units—sporting almost identical specifications—were pitched against each other, a resultant mini-review of benched figures was made available earlier today. Notebookcheck's Allen Ngo provided some context: "3DMark benchmarks...show that the (Schenker Neo's) GeForce RTX 5080 Mobile unit is roughly 10 to 15 percent slower than its pricier sibling. This deficit translates fairly well when running actual games like Baldur's Gate 3, Final Fantasy XV, Alan Wake 2, or Assassin's Creed Shadows. As usual, the deficit is widest when running at 4K resolutions on demanding games and smallest when running at lower resolutions where graphics become less GPU bound. A notable observation is that the performance gap between the mobile RTX 5080 and mobile RTX 5090 would remain the same, whether or not DLSS is enabled. When running Assassin's Creed Shadows with DLSS on, for example, the mobile RTX 5090 would maintain its 15 percent lead over the mobile RTX 5080. The relatively small performance drop between the two enthusiast GPUs means it may be worth configuring laptops with the RTX 5080 instead of the RTX 5090 to save on hundreds of dollars or for better performance-per-dollar." As demonstrated by Bestware.com's system configurator, the XMG NEO 16 (A25) SKU with a GeForce RTX 5090 Mobile GPU demands a €855 (~$928 USD) upcharge over an RTX 5080-based build.

Digital Chat Station (DCS)—a tenured leaker of Qualcomm pre-release information—has shared new "Snapdragon 8 Elite Gen 2" chipset details. Earlier today, their Weibo feed was updated with a couple of technological predictions. The announced smartphone chip's "SM8850" identifier was disclosed once again, along with the repeated claim that Qualcomm has selected a 3 nm "N3P" node process. Industry watchdogs expect to see the San Diego-headquartered fabless semiconductor designer introduce its next-generation flagship smartphone SoC in October. The current-gen Snapdragon 8 Elite platform was unveiled last Fall; sporting cutting-edge "Oryon" (aka Phoenix) processor cores and an integrated Adreno 830 graphics solution. DCS reckons that the natural successor will reuse a familiar "2 + 6" core configuration; comprised of two prime "big performance" units, and six "normal" performance-tuned units. An Adreno 840 iGPU was listed as DCS's final point of conjecture.

The incoming "Snapdragon 8 Elite Gen 2" chipset was mentioned in the same sentence as rumored "Pegasus" cores (Phoenix's sequel)—slightly far-fetched rumors from 2024 suggested Qualcomm's upgraded processor architecture being tested at maximum frequencies of 5.0 GHz (on performance cores). As pointed out by Wccftech, Gen 1's performance cores run at 4.47 GHz (by default). In today's follow-up post, DCS claimed that Qualcomm's: "self-developed CPU architecture is now in the second generation, with a performance setting of over 380 W+." Industry watchdogs reckon that the "Snapdragon 8 Elite 2" chip will be capable of recording 3.8+ million point tallies in AnTuTu V10 gauntlets, thanks to the alleged utilization of ArmV9 architecture. DCS theorized that the speculated "SM8850" SoC will support ARM's Scalable Matrix Extension 1 (SME 1) and Scalable Vector Extension 2 (SVE2) instruction sets.

CD Projekt Red, the studio behind wildly popular The Witcher and Cyberpunk 2077 game franchises, is once again entering the mobile gaming scene, this time in partnership with Scopely, the massive publisher that recently made news for buying Niantic, developer behind Pokémon Go. CD Projekt Red announced the partnership in its 2024 financial earnings report, although the announcement is rather vague.

According to the earnings report, CDPR and Scopely will develop "a game set within one of CD PROJEKT's IPs," and nothing more than that. Currently, a Witcher or Cyberpunk spin-off seem equally likely, although with The Witcher 4 expected to launch within the next few years, CDPR may be looking to build up hype around the Witcher universe leading up to that launch. That said, there is also reportedly a Cyberpunk 2077 sequel in the works as well, so a Cyberpunk spin-off is also a possibility. CDPR has already released a number of iOS and Android games set in The Witcher IP, including Gwent: The Witcher Card Game, Gwent: Rogue Mage, The Witcher, Monster Slayer, The Witcher Battle Arena, The Witcher Adventure Game, and Thronebreaker: The Witcher Tales. Meanwhile, there has been but one mobile game based on the Cyberpunk universe—Roach Race—so it would not be surprising to see a Cyberpunk 2077 spin-off come out of the partnership.

TrendForce's latest findings reveal that U.S. tariff hikes prompted most downstream brands to frontload shipments to 1Q25, accelerating inventory reduction across the memory supply chain. Looking ahead to the second quarter, conventional DRAM prices are expected to decline by just 0-5% QoQ, while average DRAM pricing including HBM is forecast to rise by 3-8%, driven by increasing shipments of HBM3e 12hi.

PC and server DRAM prices to hold steady
In response to potential U.S. tariff hikes, major PC OEMs are requesting ODMs to increase production, accelerating DRAM depletion in their inventories. OEMs with lower inventory levels may raise procurement from suppliers in Q2 to ensure stable DRAM supply for the second half of 2025.

Last week, South Korean semiconductor industry moles let slip about the development of an "Exynos 2600" mobile chipset at Samsung Electronics. This speculative flagship processor was linked to the manufacturer's (inevitable) launch of Galaxy S26 smartphone models in early 2026. Despite rumors of the firm's Foundry service making decent progress with their preparation of a cutting-edge 2 nm Gate-All-Around (GAA) node, certain critics reckon that Samsung will be forced into signing another (less than ideal) chip supply deal with Qualcomm. According to The Bell SK's latest news report, Samsung's LSI Division is working with plenty of determination—an alleged main goal being the next wave of top-end Galaxy smartphones deployed next year with in-house tech onboard.

Inside sources propose that Samsung's Exynos 2600 SoC needs to be "finished by the middle of the third quarter of this year," thus ensuring the release of in-house chip-powered Galaxy S26 devices. It is not clear whether this forecast refers to a finalized design or the start of mass production. The latest whispers regarding another proprietary next-gen mobile processor—Exynos 2500—paint a murky picture. Past leaks indicated possible avenues heading towards forthcoming Galaxy Z Flip 7 and Fold 7 smartphone models. The latest reports have linked this design to a mature 4 nm process and eventual fitting inside affordable "Galaxy Z Flip FE" Enterprise Edition SKUs. The Bell contacted one of its trusted sources—the unnamed informant observed that everything is in flux: "Exynos 2500 production plan is constantly changing...I thought it was certain, but I heard that the possibility has recently decreased slightly." Reportedly, Samsung employees have their plates full with plenty of simultaneous projects in 2025.

Earlier in the week, Apple specialist press outlets picked up on a noted industry analyst's technological forecast for a future iPhone processor design. Jeff Pu—of GF Industries, Hong Kong—predicted that the next-generation A20 SoC would be produced via a TSMC 3 nm (N3P) nodes process. Despite rumors of Apple gaining front row seats at the "2 nm ballgame," the partnership between fabless chip designer and foundry could potentially revisit already covered ground. The A19 chipset was previously linked to N3P (by insiders), with Pu expressing the belief that A20 would utilize the same fundamental lithographic underpinnings; albeit enhanced with TSMC's Chip on Wafer on Substrate (CoWoS) packaging technology (for AI improvements).

This morning, MacRumors followed up on their initial news article—they reported that "wires were crossed" at GF Industries, regarding projections for the (2026) iPhone 18 generation. The publication received direct feedback from the man of the hour: "Jeff Pu (lead Apple analyst) has since clarified that he believes the A20 chip will be manufactured with the N2 process, so the information about the chip using the N3P process should be disregarded. Earlier reports had said the A20 chip would be 2 nm, so rumors align again. This is ultimately good news, as it means the A20 chip should have more substantial performance and power efficiency improvements over the A19 chip." Cutting-edge smartphone processor enthusiasts expressed much disappointment when A20 was (regressively) linked to N3P; the latest revisement should instill some joy. According to industry moles, TSMC is making good progress with its cutting-edge 2 nm node process—mass production is expected to start at some point within the second half of 2025.

We're stepping up our multiplatform gaming offering with exciting news dropping at this year's Game Developers Conference (GDC). We're bringing users more games, more ways to play your games across devices, and improved gameplay. You can read all about the updates for users from The Keyword. At GDC, we'll be diving into all of the latest games coming to Play, plus new developer tools that'll help improve gameplay across the Android ecosystem.

We're sharing a closer look at what's new from Android. We're making Vulkan the official graphics API on Android, enabling you to build immersive visuals, and we're enhancing the Android Dynamic Performance Framework (ADPF) to help you deliver longer, more stable gameplays. Check out our video, or keep reading below.

According to an attendee of a recent Intel AI presentation, company representatives revealed a release timeline for next-gen Core Ultra "Panther Lake" mobile processor family. Team Blue's China office appears to be courting users of DeepSeek R1, as evidenced by meng59739449's sharing of a processor product roadmap (machine translated by VideoCardz). A volume launch of Core Ultra 300 "Panther Lake-H" series seems to be on the cards for Q1 2026. Earlier this month, an Intel executive insisted that Panther Lake was on track for a second half of 2025 roll out. Lately, industry moles have alleged that a "problematic 18A node" process has caused delays across new generation product lines.

Team Blue watchdogs reckon that high volume manufacturing (HVM) of Panther Lake chips will kick off in September. By October, an Early Enablement Program (EEP) is expected to start—with samples sent off to OEMs for full approval. Industry experts believe that Intel will following a familiar pattern of "announcing the processor in the second half of the prior year, but ramping up mass production in the following year." Previous generation mobile CPU platforms—Meteor Lake and Lunar Lake—received similar treatment in the recent past. Last week, a Panther Lake-H (PTL-H) sample was on general display at Embedded World 2025—the German office is similarly engaged in hyping up the AI-crunching capabilities of roadmapped products.

Late last month, industry insiders posited that pleasing progress was being made with Samsung's cutting-edge 2 nm Gate-All-Around (GAA) node process. The rumored abandonment of an older 3 nm GAA-based project—in late 2024—has likely sent the South Korean foundry team into overdrive. A speculated Exynos 2500 flagship mobile processor was previously linked to said 3 nm node, but industry watchdogs believe that company engineers are experimenting with a 2 nm GAA manufacturing process. According to the latest insider report—from FN News SK—Samsung Foundry (SF) has assembled a special "task force (TF)." Allegedly, this elite team will be dedicated to getting a newer "Exynos 2600 chip" over the finish line—suggesting an abandonment of the older "2500" design, or a simple renaming.

Samsung's recent launch of Galaxy S25 series smartphones was reportedly viewed as a disappointing compromise—with all models being powered by Qualcomm's "first-of-its-kind customized Snapdragon 8 Elite Mobile Platform," instead of in-house devised chipsets. According to industry moles, one of the SF task force's main goals is a boosting of 2 nm GAA production yields up to "economically viable" levels (roughly 60-70%)—apparently last month's best result was ~30%. Mass production of prototype chipsets is tipped to start by May. Samsung's reported target of "stabilizing their Exynos 2600" SoC design will ensure that "Galaxy S26 series" devices will not become reliant on Qualcomm internals. Additionally, FN News proposes a bigger picture scenario: "the stabilization of 2 nm (SF2/GAA) products, is expected to speed up the acquisition of customers for Samsung Electronics' foundry division, which is thirsty for leading-edge process customers." A forthcoming rival next-gen mobile chip—Snapdragon 8 Elite Gen 2—is supposedly in the pipeline. The smartphone industry inside track reckons that Qualcomm has signed up with TSMC; with a 2 nm manufacturing process in mind.

The oft-rumored status of Intel's refreshed generation of Arrow Lake processors (ARL-R) was the topic of much debate in 2023. By September 2024, certain industry watchdogs believed that the endeavor had ended. Early last month, Golden Pig Upgrade proposed that Team Blue leadership had resurrected the troubled project—at least with "ARL-S Refresh" desktop CPUs. Earlier today, the noted leaker of inside information returned to the topic of Arrow Lake Refresh. According to industry moles, the launch of refreshed desktop processors (on LGA 1851) is confirmed.

An extended timeline was disclosed in Golden Pig Upgrade's latest musing: "Arrow Lake HX Refresh is confirmed to return. Don't criticize the interface for only one generation. AI PCs are getting bigger and stronger." Given that ARL-HX-equipped high-end notebooks and mini PCs—with Core Ultra 7 200 series APUs—are relatively new arrivals, a mild update later on in the year could be considered pointless. Intel has committed themselves to a launch of Panther Lake mobile processors (PTL-H) in the second half of 2025. As disclosed by past leaks, the "beefing up" of onboard NPUs—to Lunar Lake-esque standards—is a reported goal; at least with Arrow Lake-S.

According to Digital Chat Station—a repeat leaker of unannounced Qualcomm hardware—unnamed Android smartphone manufacturers are considering an eSIM-only operating model for future flagship devices. Starting with the iPhone 14 generation (2022), Apple has continued to deliver gadgets that are not reliant on "slotted-in" physical SIM cards. According to industry insiders, competitors could copy the market leader's homework—Digital Chat Station's latest Weibo blog post discusses the space-saving benefits of eSIM operation; being "conducive to lightweight and integrated design." Forthcoming top-tier slimline Android mobile devices are tipped to utilize Qualcomm's rumored second-generation "Snapdragon 8 Elite Gen 2" (SM8850) chipset.

Digital Chat Station reckons that: "SM8850 series phones at the end of the year are testing eSIM. Whether they can be implemented in China is still a question mark. Let's wait and see the iPhone 17 Air. In order to have an ultra-thin body, this phone directly cancels the physical SIM card slot. Either it will be a special phone for the domestic market, or it will get eSIM." The phasing out of physical SIM cards within the Chinese mobile market could be a tricky prospect for local OEMs, but reports suggest that "traditionally-dimensioned" flagship offerings will continue to support the familiar subscriber identity module standard. Physical SIM card purists often point out that the format still provides superior network support range.

On Monday (March 3), Qualcomm introduced its Dragonwing FWA Gen 4 Elite model—advertised as the world's first 5G Advanced-capable FWA platform. Inevitably, the company's brand-new Snapdragon X85 5G modem will be compared to a rival design—Apple's proprietary C1 chip launched last month; as featured in the A18 SoC-powered iPhone 16e series. The two companies were closely intertwined for a number of years; with a longer than anticipated co-development of 5G solutions for multiple iPhone product generations. Cristiano Amon—the CEO of Qualcomm—believes that his team's X85 5G design will end up as the victor, when pitched against Apple's C1. In a CNBC-conducted interview, he boasted: "it's the first modem that has so much AI, it actually increases the range of performance of the modem—so the modem can deal with weaker signals. What that will do will set a huge delta between the performance of premium Android devices, and iOS devices, when you compare what Qualcomm can do versus what Apple is doing."

Smartphone industry watchdogs reckon that Apple's C1 model will leverage superior power efficiency; courtesy of the contained modem and receiver being based on TSMC 4 nm and 7 nm processes (respectively). Qualcomm has not revealed the fundamental aspects of its new Snapdragon X85, so it is difficult to project its power consumption habits. Official press material concentrates on two big selling points: downlink speeds up to 12.5 Gbps, and 40 TOPS of NPU processing power. Insiders have posited that the in-house designed C1 modem will make its way into next-gen iPads and Apple wearables—additionally, the development of a successor is rumored. Despite doing less business with Apple, Amon thinks that the future is peachy: "if modem is relevant there's always a place for Qualcomm technology. In the age of AI, modems are going to be more important than they have ever been. And I think that's going to drive consumer preference about do they want the best possible modem in the computer that's in their hand all the time." Qualcomm's chief expects that the supply of Snapdragon 5G Modem‑RF Systems—to Apple—will end in 2027.

The "Medusa" or "Medusa Point" codename started to appear online over the past couple of months. These mysterious AMD projects were linked to next-generation "Zen 6" Ryzen desktop and mobile processor families (respectively). Initially, insiders reckoned that Team Red had selected an RDNA 4-based graphics solution for integration their futuristic new-gen laptop APU design. Two days ago, Golden Pig Upgrade weighed in with a different theory—the veteran leaker believes that provisions have regressed on the "Medusa Point" iGPU front.

Previous reports have suggested that the "Medusa Point" processor's iGPU aspect will utilize up to 16 compute units (CU), based on a theorized count of eight workgroup processors (WGPs) from leaked imagery. The latest insider tip points to the utilization of a non-specific "RDNA 3.x" branch, instead of conjectured RDNA 4 graphics technology. Industry watchdogs hold the belief that AMD will be sticking with RDNA 3.5 for a while—as featured on their current-gen "Zen 5" mobile-oriented Strix Point, Strix Halo and Krackan Point chips. As pointed out by Notebookcheck, Team Red leadership disclosed that RDNA 4 is exclusive to discrete card families (for the time being). RDNA 3.5-equipped APUs have—so far—received a warm welcome; AMD engineers could be reserving development resources for a distant future project.

Jio Platforms Limited (JPL), together with AMD, Cisco, and Nokia, announced at Mobile World Congress 2025 plans to form an innovative, new Open Telecom AI Platform. Designed to support today's operators and service providers with real-world, AI-driven solutions, the Telecom AI Platform is set to drive unprecedented efficiency, security, capabilities, and new revenue opportunities for the service provider industry.

End-to-end Network Intelligence
Fueled by the collective expertise of world leaders from across domains including RAN, Routing, AI Data Center, Security and Telecom, the Telecom AI Platform will create a new central intelligence layer for telecom and digital services. This multi-domain intelligence framework will integrate AI and automation into every layer of network operations.

The telecommunications industry is undergoing a major transformation as AI and 5G technologies reshape networks and connectivity. While operators are eager to modernize infrastructure, challenges remain, such as high capital expenditures, security concerns and integration with legacy systems. At MWC 2025, Intel - alongside more than 50 partners and customers - will showcase groundbreaking solutions that deliver high capacity and high efficiency performance with built-in AI integration, eliminating the need for costly additional hardware and delivering optimized total cost of ownership (TCO).

"By leveraging cloud technologies and fostering close collaborations with partners, we are helping operators virtualize both 5G core and radio access networks - proving that the most demanding, mission-critical workloads can run efficiently on general-purpose silicon," said Sachin Katti, senior vice president and general manager of the Network and Edge Group at Intel Corporation. "Through our Xeon 6 processors, we are enabling the future of AI-powered network modernization."

pureLiFi, the global leader in LiFi technology, has announced the launch of its ground-breaking LINXC Bridge system, at Mobile World Congress Barcelona. Developed with Solace Power, this innovative solution empowers Fixed Wireless Access (FWA) broadband providers to deliver self-installable, higher quality and more reliable connectivity to consumers using outdoor Customer Premises Equipment (CPE). With this solution broadband customers will experience much faster installation times, more reliable speeds and an improved user experience.

The LINXC Bridge streamlines broadband deployment, eliminating complex installations, significantly reducing subscriber acquisition cost, shortening time to revenue and increasing customer satisfaction. The LINXC Bridge system will be showcased live at the pureLiFi booth (7B27) alongside the latest cutting-edge CPE equipment from demonstration collaborators, Sonim Technologies.

Samsung Display today revealed plans to exhibit its next-generation OLED technology, boasting an impressive maximum brightness of 5,000 nits, at the Mobile World Congress 2025 (MWC25) on March 3.

The ultra-high brightness OLED was developed based on the polarizer-less display, also known as on-cell film (OCF) technology, which Samsung Display was the first to commercialize. This innovation not only enhances outdoor visibility but also reduces power consumption, paving the way for significant design flexibility. OCF technology is being applied to a bar-type smartphone and a rollable laptop, following its success in foldable smartphones, and is being recognized by customers as a high-value display technology.

Qualcomm has introduced "Dragonwing," a new brand portfolio consolidating its non-Snapdragon products for industrial applications. The portfolio encompasses industrial IoT, networking, and cellular infrastructure solutions previously marketed under various product lines. The Dragonwing stack integrates AI processing capabilities with low-power computing and connectivity technologies optimized for edge deployment. Target applications include industrial robotics, specialized cameras, industrial handhelds, and unmanned aerial systems. Qualcomm aims to position these solutions in sectors including energy utilities, manufacturing, retail, supply chain, and telecommunications infrastructure.

The branding effort marks a strategic diversification beyond Qualcomm's consumer-focused Snapdragon line. Visually, Dragonwing adopts a purple color scheme that combines elements from Qualcomm's corporate identity with a stylized dragon icon. The portfolio will debut at the Mobile World Congress in Barcelona (March 3-7) and Embedded World in Nuremberg (March 11-13). Although limited, for now, information about Dragonwing processors and solutions should appear soon and give an insight into interesting low-power solutions that will power the next stage of the industrial revolution. Qualcomm has decided to use its mobile development experience and know-how to tap a large market, and solid branding will help it differentiate from competitors instead of the generic product names used in the past. Additionally, Qualcomm's Dragonwing products are mostly focused on more mature nodes like 14 nm and larger, instead of chasing the 3 nm and smaller like its Snapdragon product portfolio.

GL.iNet, a leading innovator in networking solutions, announces the launch of the Spitz Plus (GL-X2000), a powerful 4G LTE Wi-Fi 6 router engineered for seamless connectivity, even in challenging environments. Whether you're streaming in a remote cabin, video conferencing from an RV, or establishing a stable network in a rural area, the Spitz Plus delivers unwavering performance and flexibility.

Your Gateway to Uninterrupted Connectivity
The Spitz Plus seamlessly blends advanced technology with a practical minimalist design, perfectly suited for today's mobile and geographically diverse lifestyles. Its features simplify staying connected, no matter where life takes you.

Last month, ASUS revealed its refreshed ROG XG Mobile design at CES 2025. The latest iteration of their premium external GPU dock is prepped for NVIDIA's "Blackwell" GeForce RTX 50 Mobile GPU-series. According to an ITHome report, the new model will be released next week; the manufacturer's Chinese office has seemingly produced marketing material that teases a launch on February 25. The redesigned ROG XG platform leverages an improved vapor chamber system; offering "150% more cooling surface area," and features "pioneering" Thunderbolt 5 connectivity (max. 80 Gbps bidirectional bandwidth). Press material from January indicated that a top configuration would house Team Green's GeForce RTX 5090 Mobile 24 GB GPU.

An updated official product page also lists support for NVIDIA's "GeForce RTX 5070 Ti Laptop" 12 GB GPU. ASUS will bundle in a 330 W AC adapter, according to its spec sheet. The off-black translucent enclosure weighs in at 0.952 kg, and dimensions are listed as: "20.8 x 15.5 x 2.96 cm." ITHome expects ASUS to reveal regional pricing (for China) on February 25; Western markets will be charged $2199.99 (US MSRP) for the flagship configuration, if price hikes do not go into effect at launch. The less potent variant—powered by a GB205 GPU—is priced at $1199.99.