Benefitting from the company's power-saving architecture, transistor and circuit design expertise, plus unique manufacturing process techniques, Intel Corporation today unveiled its newest Intel Atom processor-based platform (formerly "Moorestown").

The technology package provides significantly lower power consumption and prepares the company to target a range of computing devices, including high-end smartphones, tablets and other mobile handheld products. The chips bring Intel's classic product strengths - outstanding performance to run a comprehensive and growing number of rich media and Internet applications, a choice of software, and the ability to easily multitask - across a number of applications, including HD video and multi-point videoconferencing.

Hynix Semiconductor, Inc. announced the 4Gb (Gigabits) mobile DDR SDRAM is now supported on Intel's 'Moorestown' platform for MID (Mobile Internet Device) applications.

This high density memory device packs twice the storage capacity over current 2Gb mobile memory solutions and is offered in small form factor packages such as MCP (Multi Chip Package) and PoP(Package on Package). It boasts maximum operating speed of 400Mbps (Megabits per second), processing up to 1.6GB (Gigabytes) of data per second with a 32-bit I/O.

LG Electronics (LG) and Intel Corporation today announced a collaboration around mobile Internet devices (MIDs) based on Intel's next-generation MID hardware platform, codenamed "Moorestown," and Linux-based Moblin v2.0 software platform. The LG device is expected to be one of the first Moorestown designs to market.
LG and Intel's common goal is to unleash rich Internet experiences across a range of mobile devices while delivering the functionality of today's high-end smart phones. The collaboration on the new design extends a close working relationship the two companies have enjoyed across their respective mobile product lines, which now spans the notebook, netbook and MID categories.

In his keynote today at the Intel Developer Forum in Taiwan, Intel's senior vice president and general manager of Intel's Ultra Mobility Group discussed how technology innovation and strong industry collaboration have driven the digital economy over the past 40 years, and the universal impact that the Internet and mobile Web has had in people's lives. Also highlighted was the progress Intel is making in the Mobile Internet Devices (MID) market segment with the world's first working "Moorestown" platform demonstration. Scheduled for the 2009-2010 timeframe, the Moorestown prototype comprises of an SOC, codenamed "Lincroft," which integrates a 45nm processor, graphics, memory controller and video encode/decode onto a single chip and an I/O hub codenamed "Langwell". Langwell supports a range of I/O ports to connect with wireless, storage, and display components in addition to incorporating several board level functions. The Moorestown platform will support a range of wireless technologies including 3G, WiMAX, WiFi, GPS, Bluetooth and mobile TV. During his keynote Chandrasekher also stated that Intel hopes to revolutionize the MID world with Moorestown when released.

Ryan "Opie" Shrout, live blogger for PC Perspective took these snaps of slides pertaining to the next generation Atom processor that were on display at IDF.

According to the first slide, the next generation of Atom CPU, codenamed Moorestown planned for 2009 ~ '10 could reduce the idle power draw by greater than 10 times that of its predecessor. Intel also seems to be working on getting rid of the core-logic (chipset) the current implementations of the Atom processor are based on, the i945, which not many in the computing world seem to have appreciated owing to its power-draw. The second slide talks about a newer Langwell processor and Lincroft chipset which have been presented in a size comparison. If that plan materializes, expect a x86 PC module to be smaller in size than your credit card, fit for deployment into much smaller portable devices.