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Raytheon works with AMD to develop next-gen Multi-Chip Package

Raytheon, an RTX business, has been awarded a $20 million contract through the Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS) consortium to develop a next-generation multi-chip package for use in ground, maritime and airborne sensors. Under the contract, Raytheon will package state-of-the-art commercial devices from industry partners like AMD to create a compact microelectronics package that will convert radio frequency energy to digital information with more bandwidth and higher data rates. The integration will result in new system capabilities designed with higher performance, lower power consumption and reduced weight.

"By teaming with commercial industry, we can incorporate cutting-edge technology into Department of Defense applications on a much faster timescale," said Colin Whelan, president of Advanced Technology at Raytheon. "Together, we will deliver the first multi-chip package that features the latest in interconnect ability - which will provide new system capabilities to our warfighters."
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Feb 6th, 2025 21:22 EST change timezone

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