Today, the Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, and JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, announce the availability of new Chiplet Design Kits for use with today's EDA tools covering Assembly, Substrate, Material and Test developed in collaboration within the OCP Open Chiplet Economy Project. Leveraging the alliance between OCP and JEDEC, these design kits are now part of the Global Worldwide Standard JEDEC JEP30: Part Model Guidelines.

The release of the Assembly, Substrate, Material, and Test Design Kits build on earlier joint efforts between the OCP and JEDEC integrating OCP Chiplet Data Extensible Markup Language (CDXML) specification into JEDEC JEP30: Part Model Guidelines, enabling Chiplet builders to provide electronically a standardized Chiplet part description to their customers, paving the way for automating System-in-Package (SiP) design and build using Chiplets.

Femtosense, in partnership with ABOV Semiconductor, today launched the AI-ADAM-100, an artificial intelligence microcontroller unit (AI MCU) built on sparse AI technology to enable on-device AI features such as voice-based control in home appliances and other products. On-device AI provides immediate, no-latency user responses with low power consumption, security, operational stability, and low cost compared to GPUs or cloud-based AI.

The AI-ADAM-100 integrates the Femtosense Sparse Processing Unit 001 (SPU-001), a neural processing unit (NPU), and an ABOV Semiconductor MCU to provide deep learning-powered AI voice processing and voice-cleanup capabilities on-device at the edge. With language processing, appliances can implement "say what you mean" voice interfaces that allow users to speak naturally and express their intent freely in multiple ways. For example, "Turn the lights off", "Turn off the lights," and "Lights off" all convey the same intent and are understood as such.