A manufacturing plant near Hsinchu, Taiwan's Silicon Valley, is among facilities worldwide boosting energy efficiency with AI-enabled digital twins. A virtual model can help streamline operations, maximizing throughput for its physical counterpart, say engineers at Wistron, a global designer and manufacturer of computers and electronics systems. In the first of several use cases, the company built a digital copy of a room where NVIDIA DGX systems undergo thermal stress tests (pictured above). Early results were impressive.

Making Smart Simulations
Using NVIDIA Modulus, a framework for building AI models that understand the laws of physics, Wistron created digital twins that let them accurately predict the airflow and temperature in test facilities that must remain between 27 and 32 degrees C. A simulation that would've taken nearly 15 hours with traditional methods on a CPU took just 3.3 seconds on an NVIDIA GPU running inference with an AI model developed using Modulus, a whopping 15,000x speedup. The results were fed into tools and applications built by Wistron developers with NVIDIA Omniverse, a platform for creating 3D workflows and applications based on OpenUSD.

FSP at CES made its case for computer cases (ahem) and power supplies alike, looking to cement itself as a viable, gamer-oriented choice in some of its design principles and product styling. The CMT 520 Plus, for example, is an ATX case with support for up to seven system fans that has four preinstalled ARGB fans, compatible with RGB controller software form most motherboard vendors for a seamless experience. Tempered glasses on the black body design take a subdued, mass-market approach which, nevertheless, doesn't get old.

The CMT 340 features much the same design principles, though some additional material touches present on the CMT 520 Plus are now absent, and the footprint of the chassis is now reduced, which brings the maximum number of supported system fans down to four.