Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry's first 512-gigabyte (GB) eUFS (embedded Universal Flash Storage) 3.1 for use in flagship smartphones. Delivering three times the write speed of the previous 512 GB eUFS 3.0 mobile memory, Samsung's new eUFS 3.1 breaks the 1 GB/s performance threshold in smartphone storage.

"With our introduction of the fastest mobile storage, smartphone users will no longer have to worry about the bottleneck they face with conventional storage cards," said Cheol Choi, executive vice president of Memory Sales & Marketing at Samsung Electronics. "The new eUFS 3.1 reflects our continuing commitment to supporting the rapidly increasing demands from global smartphone makers this year."

It's finally here: a high-end PCI-Express gen 4.0 M.2 NVMe SSD by Samsung, made end-to-end by homebrew components. When it releases sometime later this year with a possible technical reveal in Q2, the SSD 980 will be possibly the only client-segment M.2 NVMe PCIe gen 4 SSD to feature MLC (2 bits per cell) NAND flash memory. This also means that the highest capacity on offer is just 1 TB. The company also put out sequential transfer rates: up to 6,500 MB/s reads, with up to 5,000 MB/s writes. The biggest payoffs of MLC would be sustained write performance and endurance (in its capacity class, compared to TLC and QLC).

Next up, is the Portable SSD T7 Touch, a successor to the T5 from 2017. This drive comes in an in-built fingerprint reader, letting you secure its data with your fingerprints. The drive is also a much needed update to the T5, which still uses 64-layer TLC NAND; and possibly uses the latest generation 96-layer V-NAND. The drive is built with an aluminium case that's drop-resistant up to 2 m. A single USB 3.2 connection handles power and data. The drive includes type-C to type-C and type-C to type-A cables, and will be compatible not just with PCs, but also Samsung Galaxy smartphones and tablets.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has brought the latest software innovations to the company's most cutting-edge PCIe Gen4 solid state drive (SSD) series, opening up a new paradigm in SSD performance.

"We are combining breakthrough speeds and capacities with revolutionary software solutions as we accelerate expansion in the premium SSD market," said Kye Hyun Kyung, executive vice president of Memory Solution Product & Development at Samsung Electronics. "We plan to introduce additional innovation led by our most advanced (sixth-generation) V-NAND in helping to trigger a lot more growth in the global IT market."

Samsung Electronics, Ltd., has taken its leadership position in the memory market a step further today by announcing support of the Samsung PM1733 PCIe Gen4 Solid State Drive (SSD) and high density RDIMM and LRDIMM dynamic random access memory (DRAM) for the AMD EPYC 7002 Generation Processors. AMD launched the 2nd Gen AMD EPYC processor in San Francisco yesterday.

"AMD has listened to the needs of its customers in developing the 2nd Gen AMD EPYC processors and has worked closely with us to integrate the best of our cutting-edge memory and storage products," said Jinman Han, senior VP of Memory Product Planning, Samsung Electronics. "With these new datacenter processors, AMD is providing customers with a processor that enables a new standard for the modern datacenter."

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing 250-gigabyte (GB) SATA solid state drive (SSD) that integrates the company's sixth-generation (1xx-layer) 256-gigabit (Gb) three-bit V-NAND for global PC OEMs. By launching a new generation of V-NAND in just 13 months, Samsung has reduced the mass production cycle by four months while securing the industry's highest performance, power efficiency and manufacturing productivity.

"By bringing cutting-edge 3D memory technology to volume production, we are able to introduce timely memory lineups that significantly raise the bar for speed and power efficiency," said Kye Hyun Kyung, executive vice president of Solution Product & Development at Samsung Electronics. "With faster development cycles for next-generation V-NAND products, we plan to rapidly expand the markets for our high-speed, high-capacity 512 Gb V-NAND-based solutions."

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry's first 512-gigabyte (GB) embedded Universal Flash Storage (eUFS) 3.0 for next-generation mobile devices. In line with the latest eUFS 3.0 specification, the new Samsung memory delivers twice the speed of the previous eUFS storage (eUFS 2.1), allowing mobile memory to support seamless user experiences in future smartphones with ultra-large high-resolution screens.

"Beginning mass production of our eUFS 3.0 lineup gives us a great advantage in the next-generation mobile market to which we are bringing a memory read speed that was before only available on ultra-slim laptops," said Cheol Choi, executive vice president of Memory Sales & Marketing at Samsung Electronics. "As we expand our eUFS 3.0 offerings, including a 1-Terabyte (TB) version later this year, we expect to play a major role in accelerating momentum within the premium mobile market."

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry's first one-terabyte (TB) embedded Universal Flash Storage (eUFS) 2.1, for use in next-generation mobile applications. Just four years after introducing the first UFS solution, the 128-gigabyte (GB) eUFS, Samsung has passed the much-anticipated terabyte threshold in smartphone storage. Smartphone enthusiasts will soon be able to enjoy storage capacity comparable to a premium notebook PC, without having to pair their phones with additional memory cards.

"The 1 TB eUFS is expected to play a critical role in bringing a more notebook-like user experience to the next generation of mobile devices," said Cheol Choi, executive vice president of Memory Sales & Marketing at Samsung Electronics. "What's more, Samsung is committed to assuring the most reliable supply chain and adequate production quantities to support the timely launches of upcoming flagship smartphones in accelerating growth of the global mobile market."

Samsung today introduced the Samsung 970 EVO Plus, the newest enhancement in its Non-Volatile Memory Express (NVMe) SSD portfolio. With industry-leading performance and up to two terabytes in capacity, Samsung's 970 EVO Plus sets a new bar for high-performance storage, enabling IT professionals, tech enthusiasts and gamers to handle intensive workloads on PCs and workstations with more ease.

"Since introducing the first NVMe SSDs to the consumer market in 2015, Samsung has continued to challenge technical barriers in SSD design and performance," said Dr. Mike Mang, vice president of Brand Product Marketing, Memory Business at Samsung Electronics. "The new 970 EVO Plus powered by Samsung's latest fifth-generation V-NAND technology will now offer unrivaled performance in its class when taking on demanding tasks like 4K content editing, 3D modeling and simulation as well as heavy gaming."

Samsung Electronics, a world leader in advanced semiconductor technology, today announced several groundbreaking additions to its comprehensive semiconductor ecosystem that encompass next-generation technologies in foundry as well as NAND flash, SSD (solid state drive) and DRAM. Together, these developments mark a giant step forward for Samsung's semiconductor business.

"Samsung's technology leadership and product breadth are unparalleled," said JS Choi, President, Samsung Semiconductor, Inc. "Bringing 7 nm EUV into production is an incredible achievement. Also, the announcements of SmartSSD and 256GB 3DS RDIMM represent performance and capacity breakthroughs that will continue to push compute boundaries. Together, these additions to Samsung's comprehensive technology ecosystem will power the next generation of datacenters, high-performance computing (HPC), enterprise, artificial intelligence (AI) and emerging applications."

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry's first 4-bit (QLC, quad-level cell) 4-terabyte (TB) SATA solid-state drive (SSD) for consumers.

Based on 1-terabit (Tb) V-NAND with outstanding performance equivalent to the company's 3-bit design, Samsung's QLC SSD is expected to bring a new level of efficiency to consumer SSDs.

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing its fifth-generation V-NAND memory chips with the fastest data transfers now available. In the industry's first use of the 'Toggle DDR 4.0' interface, the speed for transmitting data between storage and memory over Samsung's new 256-gigabit (Gb) V-NAND has reached 1.4-gigabits per second (Gbps), a 40-percent increase from its 64-layer predecessor.

The energy efficiency of Samsung's new V-NAND remains comparable to that of the 64-layer chip, primarily because the operating voltage has been reduced from 1.8 volts to 1.2 volts. The new V-NAND also has the fastest data write speed to date at 500-microseconds (μs), which represents about a 30-percent improvement over the write speed of the previous generation, while the response time to read-signals has been significantly reduced to 50μs.

Samsung Electronics, the world leader in advanced memory technology, today announced that it is being recognized for its environmental reliability by receiving the industry's first Environmental Product Declaration (EPD) certificate in Korea with its 512Gb 64-layer 3bit V-NAND and 860 EVO 4TB SSD.

The Environmental Product Declaration is a national certification system in Korea which recognizes a product's performance according to seven key environmental metrics including carbon footprint, resource footprint, ozone depletion, acidification, eutrophication, photochemical smog, and water footprint.

Samsung Electronics, the world leader in advanced memory technology, today announced that it has launched the industry's highest capacity NVMe solid state drive (SSD) based on the incredibly small Next-generation Small Form Factor (NGSFF) - an eight-terabyte (TB) NF1 SSD. The new 8TB NVMe NF1 SSD has been optimized for data-intensive analytics and virtualization applications in next-generation data centers and enterprise server systems.

"By introducing the first NF1 NVMe SSD, Samsung is taking the investment efficiency in data centers to new heights," said Sewon Chun, senior vice president of Memory Marketing at Samsung Electronics. "We will continue to lead the trend toward enabling ultra-high density data centers and enterprise systems by delivering storage solutions with unparalleled performance and density levels."

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it is rolling out its PM883, the highest density datacenter SATA drive, at eight terabytes (TB). Samsung's new solid state drive (SSD) offering is the industry's first datacenter SATA drive to incorporate LPDDR4 DRAM modules and features a 6.0-gigabits-per-second (Gbps) 2.5-inch SATA interface.

The high-performance PM883 is expected to accelerate a transition in many existing enterprise datacenters to SATA-formatted SSD designs, with improved economies of scale through the use of advanced-generation V-NAND technology at higher densities.

"We are thrilled to have the opportunity to enable a high level of storage density with low power consumption, which thanks to the efficiency of our 64-layer V-NAND-based technology, allows us to double the capacity of current SATA storage," said Jim Elliott, corporate senior vice president, memory sales and marketing, Samsung Semiconductor, Inc. "Our expanded lineup for the PM883 will offer up to 8TB to allow optimal use in existing enterprise and cloud storage systems."

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry's largest capacity Serial Attached SCSI (SAS) solid state drive (SSD) - the PM1643 - for use in next-generation enterprise storage systems. Leveraging Samsung's latest V-NAND technology with 64-layer, 3-bit 512-gigabit (Gb) chips, the 30.72 terabyte (TB) drive delivers twice the capacity and performance of the previous 15.36 TB high-capacity lineup introduced in March 2016.

This breakthrough was made possible by combining 32 of the new 1TB NAND flash packages, each comprised of 16 stacked layers of 512 Gb V-NAND chips. These super-dense 1 TB packages allow for approximately 5,700 5-gigabyte (GB), full HD movie files to be stored within a mere 2.5-inch storage device.

Samsung Electronics, the world leader in advanced memory technology, today announced that it has launched an 800-gigabyte (GB) solid state storage drive-the SZ985 Z-SSD, for the most advanced enterprise applications including supercomputing for AI analysis. Developed in 2017, the new 800 GB Z-SSD provides the most efficient storage solution for high-speed cache data and log data processing, as well as other enterprise storage applications that are being designed to meet rapidly growing demand within the AI, big data and IoT markets.

"With our leading-edge 800 GB Z-SSD, we expect to contribute significantly to market introductions of next-generation supercomputing systems in the near future, enabling improved IT investment efficiency and exceptional performance," said Jinman Han, senior vice president, Memory Product Planning & Application Engineering at Samsung Electronics. "We will continue to develop next-generation Z-SSDs with higher density and greater product competitiveness, in order to lead the industry in accelerating growth of the premium SSD market."

Samsung Electronics America, Inc. today introduced the 860 PRO and 860 EVO solid state drives (SSDs), the most up-to-date additions to the company's SATA interface lineup. The products are aimed at consumers who require fast, reliable performance across various applications, from everyday computing to heavy workloads and graphic-intensive operations. Building on the successful launch of the 850 PRO and 850 EVO - the industry's first consumer SSDs with V-NAND technology - the 860 PRO and 860 EVO achieve industry-leading performance for SATA SSDs, offering enhancements in speed, reliability, compatibility and capacity.

"The new 860 PRO and 860 EVO SSDs combine the latest 512Gb and 256Gb 64-layer V-NAND, up to 4GB LPDDR4 mobile DRAM and a new MJX controller to elevate the user experience for both consumers and businesses," said Un-Soo Kim, senior vice president of Brand Product Marketing, Memory Business at Samsung Electronics. "Samsung will continue to fuel meaningful innovations in the consumer SSD space and drive growth of the overall memory industry for years to come."

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass production of the industry's first 512-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution for use in next-generation mobile devices. Utilizing Samsung's latest 64-layer 512-gigabit (Gb) V-NAND chips, the new 512GB eUFS package provides unparalleled storage capacity and outstanding performance for upcoming flagship smartphones and tablets.

"The new Samsung 512GB eUFS provides the best embedded storage solution for next-generation premium smartphones by overcoming potential limitations in system performance that can occur with the use of micro SD cards," said Jaesoo Han, executive vice president of Memory Sales & Marketing at Samsung Electronics. "By assuring an early, stable supply of this advanced embedded storage, Samsung is taking a big step forward in contributing to timely launches of next-generation mobile devices by mobile manufacturers around the world."

Last week, we were introduced to Samsung's upcoming PM981 SSDs, which should give way to higher-performance parts such as the 980 series. Today, however, it's the slightly lower-tier PM971 platform that has surfaced, which should give way to Samsung 970 series of NVMe SSDs. Remember that the company seems to be moving away from their "EVO" and "PRO" monikers as performance differentiators, and this new nomenclature series should replace it come launch time.

The PM971-based SSDs will feature a 22mm x 16mm x 1.5mm multi-chip package that includes Samsung's Proton controller, LPDDR4 DRAM cache, and V-NAND flash into a single chip. As was to be expected from a more mainstream solution, performance will be noticeably lower (at least in pure numbers) when compared to the higher-tier 980 series.

Samsung is the most well-regarded company when it comes to consumer SSDs. even if their SSD solutions do usually carry a premium versus the competition, that price delta is usually well justified: Samsung's SSDs are frequently the most reliable, fastest option in the market. Samsung's 960 PRO and 960 EVO SSDs have done a good job of clarifying the company's market positioning, and now, the successors for those Samsung SSDs have already surfaced.

The next-gen Samsung NVMe drives carry the PM981 code-name - where "PM" stands for TLC NAND (in this case, based on 64-layer 3-bit per cell V-NAND chips), "9" stands for Samsung's highest performing solutions, and "81" stands for the part number - two tiers ahead of Samsung's 960 series. It's expected that there will be a 970 part, since Samsung seems to be steering away from the "EVO" and "PRO" monikers to differentiate products according to performance - a straight numeral is expected to be the norm going forward. For now, the parts that have surfaced carry 512 GB and 1 TB of memory. These will make use of Samsung's Polaris V2 controller (with a metal heatsink over it to aid in cooling), and deliver 3,000 MB/s and 3,200 MB/s sequential read speeds (for the 512 GB and 1 TB versions respectively) and 1,800 MB/s and 2,400 MB/s sequential write, respectively. The models surfaced from a Vietnamese retailer, which has them going for $233 and $439 - which doesn't mean this will be the final consumer retail price, but seems reasonable for the technology and performance tier of these NVMe SSD solutions.

Samsung Electronics America, Inc. today announced the introduction of the Samsung Portable SSD T5 - the newest portable solid state drive (PSSD) that raises the bar for the performance of external memory products. The T5, built with Samsung's latest 64-layer V-NAND technology, delivers industry-leading transfer speeds with encrypted data security in a compact and durable design, making it easier than ever for consumers to access their most valuable data anywhere, at any time.

"Samsung has been pushing the envelope of what is possible in portable storage and solid state drives for years, and the Portable SSD T5 continues our legacy of leadership and innovation," said Un-Soo Kim, Senior Vice President of Brand Product Marketing, Memory Business at Samsung Electronics. "We are confident that the T5 will exceed consumers' expectations for external storage by offering faster speeds and a solid design that is lightweight and conveniently pocket-sized. It is the ideal portable storage product for consumers and professionals who are in search of a fast, durable and secure device."

At its Flash Memory Summit booth, Samsung revealed plans to launch new consumer-segment SSDs which succeed its current 960 EVO and 960 Pro series. Over 2017-18, the company is expected to launch the new 970 series and 980 series NVMe SSDs. Tom's Hardware predicts that Samsung could dispose of the "EVO" and "Pro" brand extensions to a static model number (such as 960 or 950). Samsung could tap into its current 3-bit per cell (TLC) 64-layer 3D V-NAND flash memory for the 970 and 980 series. With the company busy capacity-building for 4-bit per cell (QLC), the new SSD lines may not feature it, although Samsung is capable of surprising with aggressive launch cycles. As drives supporting the NVMe protocol, the 970 and 980 series could ship in modern form-factors, such as M.2 and U.2.

Samsung Electronics, the world leader in advanced memory technology, has announced new V-NAND (Vertical NAND) memory solutions and technology that will address the pressing requirements of next-generation data processing and storage systems. With the rapid increase of data-intensive applications across many industries using artificial intelligence and Internet of Things (IoT) technologies, the role of flash memory has become extremely critical in accelerating the speed at which information can be extracted for real-time analysis.

At the inaugural Samsung Tech Day and this year's Flash Memory Summit, Samsung is showcasing solutions to address next-generation data processing challenges centered around the company's latest V-NAND technology and an array of solid state drives (SSDs). These solutions will be at the forefront of enabling today's most data-intensive tasks such as high-performance computing, machine learning, real-time analytics and parallel computing.

After announcing their intention to begin mass production of their latest 72-Layer 3D NAND Flash back in April, SK Hynix has now confirmed that it has entered mass production of the high density NAND modules. Apparently, SK Hynix has already achieved the much sought-after "golden yield" ratios, where the semiconductor yield is now at such a level that it is advantageous to finally enter mass production. Apparently, SK Hynix's leadership was fearful of not being able to achieve the golden yield in a timely manner after their announcement of the technology only three months ago; however, after its "management team and engineers repeatedly spent nights doing research, yield went up vertically and has become comparable to Samsung Electronics'" own yield - and as you know, Samsung is kind of the golden standard when it comes to NAND technology.

According to industry sources, SK Hynix is already mass-producing SSDs (Solid State Drives) with the company's own controllers and firmware which leverage this new 72-layer 256Gb NAND flash memory. This is a welcome change for the company which should allow it to increase revenue, since this is the first time controllers are developed in-house. The company is also said to be already producing eMMC (embedded Multimedia Card) for mobile devices based on this technology, with supply already arriving to its customers.

Samsung is one of the top tech players in the world, with tendrils extending through almost all conceivable markets. That position, and the varied sources of income the company has at its disposal, gives it enough leeway to make investments that echo throughout the industry, Now, after a 15 trillion won investment (something like $13 billion), the company's latest V-NAND fab has started production in Pyeongtaek.

The fab will produce the firm's latest three-dimensional, 64-layer 256Gb V-NAND chips. Here's hoping the expected influx of higher quantities of NAND memory will allows us poor users to see a stop to the NAND pricing increase we've been seeing of late. Not everybody needs all the NAND available in smartphones.