GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the latest AMD B650 motherboards based on the success of the X670 series. The comprehensive lineup includes AORUS, AERO, and GAMING series to provide more reasonable options with notable features for users. GIGABYTE select B650 motherboards adopt PCIe 5.0 / 4.0 x16 graphics interface and PCIe 5.0 / 4.0 M.2 slots with EZ-Latch technology, making it easier than ever for users to upgrade graphics cards and M.2 SSDs, avoiding accidental damage to the surrounding components. Further, up to 16+2+2 phase Twin Digital power, 105 Amps Smart Power Stage, and up to 12-layer PCB provide increased stability, optimal compatibility, and performance for AMD Ryzen 7000 series processors. With the advanced thermal design, VRM temperature is reduced, stabilizing the power and performance of the PCIe 5.0 slot and PCIe 4.0 M.2 SSD and avoiding performance drop due to thermal throttling. Meanwhile, the enhanced shielding design of SMD slots strengthens the reliability of signals and slot structure. In addition, select models take advantage of Active OC Tuner technology to deliver optimized performance with a more flexible and user-friendly experience.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the launch of the newest X570S AORUS series motherboards primed to unleash the potential of the recently released AMD Ryzen 5000 series desktop processors with enhanced DrMOS direct power design and 6 layers and above ultra cool PCB for higher stability. The whole series equip with a brand new passive chipset thermal design and up to four sets of high thermal efficiency armored PCIe 4.0 M.2 slots with M.2 Thermal Guard III, which ensures effective heat dissipation of full operation on chipsets and 7000 MB/s high speed operating on NVMe SSDs without throttling by overheating. The brand new X570S series motherboards kick off the PCIe 4.0 era with extensive feature sets.

The flagship X570S AORUS MASTER motherboard is fitted with a 16-phase direct digital power design for the more solid power management and optimized overclocking performance. With advanced heat dissipation technology of Fins-Array II Stacked Fins Heatsink, Direct Touch Heatpipe II and Smart Fan 6, GIGIABYTE X570S motherboards can maintain cool and high performance under high loading operation. Furthermore, GIGABYTE Active OC Tuner technology integrated in select motherboards to provide a more flexible performance improvement.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, today announced the new Z590 VISION series motherboards for creators which power the 11th Gen Intel Core processors. The exclusive design of VisionLINK and VisionLINK TB enables the simple connection to pen displays with only one USB Type-C cable, releasing creators from the mess of transmission cables and switches to a neat space. Featuring an optimized power design, thermal design, superior connectivity and high quality components, GIGABYTE Z590 VISION series motherboards provide the remarkable platform for creators.

The VisionLINK technology allows for data and video transmission based on USB Type-C Interface and it provides power delivery up to 60 W. VisionLINK technology lets creators not only without cable clutter, but also the benefit of data, video, and power charging at the same time. One USB Type-C cable connected, turn the workspace into neat and tidy. VisionLINK TB is an advanced version of VisionLINK technology. It is based on Thunderbolt 4 delivers 40 Gb/s high-bandwidth speeds, data transferring, video signal, 60 W power charging, and daisy chain function to support up to 10 devices connection.