Hunters! Join us on Tuesday March 25th at 7:00AM PDT / 14:00 GMT for a Monster Hunter Wilds Showcase stream, presented by Monster Hunter Wilds producer, Ryozo Tsujimoto! The stream will be approximately 15 minutes with news on the next free title update that we're looking forward to sharing with you! Please note that actual stream time is subject to change.

The unbridled force of nature runs wild and relentless, with environments transforming drastically from one moment to the next. This is a story of monsters and humans and their struggles to live in harmony in a world of duality. Fulfill your duty as a Hunter by tracking and defeating powerful monsters and forging strong new weapons and armor from the materials you harvest from your hunt as you uncover the connection between the people of the Forbidden Lands and the locales they inhabit. The ultimate hunting experience awaits you in Monster Hunter Wilds.

Intel representatives have placed a Panther Lake demonstration sample unit on an actual pedestal; as reported by PC Games Hardware (PCGH). German press outlets and other visitors were greeted by Team Blue's dedicated showcase plinth at this week's Embedded World 2025 expo/trade fair. The Nuremberg-based event is advertised as a "world-leading conference presenting state-of-the art technology and forward-looking research." Attendees and industry watchdogs reckon that the prominently displayed demo piece is an example of Intel's Panther Lake-H (PTL-H) mobile-oriented chip design. Last October, Pat Gelsinger (now ex-CEO) unveiled a physical PTL-H sample on-stage during his special guest appearance at Lenovo Tech World 2024. During a CES 2025 keynote presentation, Michelle Johnston Holthaus (Intel's interim co-boss) confirmed a 2025 launch window, while holding up another (or the same) Panther Lake chip.

Recent industry insider whispers have suggested that the Intel Foundry is encountering problems with their 18A node process; thus causing a shift in Panther Lake's release schedule. One prominent leaker claims that Team Blue's opening salvo of PTL-H products will roll out in 2026, but rumors were dismissed by an official source (last week). John Pitzer—Corporate Vice President of Investor Relations at Intel—insisted on multiple occasions, during a fireside chat, that his team's Core Ultra 300 series (aka Panther Lake-H) is on track for launch within the second half of 2025. Intel's Embedded World 2025 booth does not feature any technical rundowns relating to the showcased next-gen offering; their minimalist plinth is simply adorned with blue text spelling out: "Panther Lake." NDA-busting details have emerged online, courtesy of insider leaks—the top-most PTL-H SKU could appear with a 4P+8E+4LP+12Xe3 configuration.

Around late January, concerned owners of high-end ASUS motherboards uploaded photo and video evidence of alleged physical damage caused by the manufacturer's PCIe "Q-Release Slim" system. Social media and forum posts showed worrying scraping and scratching on graphics card interfaces. The North American branch of ASUS responded to reports with a public service announcement: "in our internal testing and evaluation of the extremely small number of cases reported, we found no damage to the motherboard or graphics card that would affect functionality and/or performance....However, it is important to emphasize that any type of PCIe add-in card will exhibit signs of usage and wear marking after 60 continuous insertions and removals." Rival brands have kept tabs on this sorry situation; many offer similar motherboard-mounted GPU quick release systems. Yesterday, GIGABYTE's Japanese office posted a very "on the nose" demonstration of their EZ Latch Plus design.

The AORUS Japan social media account's "Ultimate PCIe Scratch Test" video involved the repeated insertion and removal of a candidate card from a GIGABYTE Z890 AORUS ELITE WIFI7 ICE motherboard. An anonymous employee completed one hundred cycles. Upon the experiment's conclusion, the graphics card's interface displayed zero evidence of physical deterioration. The manufacturer's Japanese AORUS branch boasted (via machine translation): "start building your PC with confidence! GIGABYTE's renowned easy DIY and ultra-durable design ensures smooth, hassle-free builds and rock-solid reliability. No more worrying about peeling golden finger contacts or scratches from metal edges." Their sarcastic delivery seemingly pokes fun at ASUS and the "troubled" Q-Release Slim system; it should be noted that it is a relatively new design. As reported back in early February, ASUS China launched an extensive customer support/compensation program. According to user accounts, some very expensive custom GeForce RTX 50-series cards have suffered cosmetic damage on PCIe interfaces. GIGABYTE's Western web presences have joined in on the fun—the AORUS Official social media account delivered a slightly different spin on their overall message: "game on with confidence! With our renowned DIY-friendly and Ultra Durable design, you'll enjoy a smooth, hassle-free build with rock-solid reliability. No more worries about gold finger paint peeling or scratches from metal edges—our design provides complete protection for both your GPU and motherboard."

pureLiFi, the global leader in LiFi technology, has announced the launch of its ground-breaking LINXC Bridge system, at Mobile World Congress Barcelona. Developed with Solace Power, this innovative solution empowers Fixed Wireless Access (FWA) broadband providers to deliver self-installable, higher quality and more reliable connectivity to consumers using outdoor Customer Premises Equipment (CPE). With this solution broadband customers will experience much faster installation times, more reliable speeds and an improved user experience.

The LINXC Bridge streamlines broadband deployment, eliminating complex installations, significantly reducing subscriber acquisition cost, shortening time to revenue and increasing customer satisfaction. The LINXC Bridge system will be showcased live at the pureLiFi booth (7B27) alongside the latest cutting-edge CPE equipment from demonstration collaborators, Sonim Technologies.

Hey hunters, how's it going? February is here, which means we are officially in the launch month of Monster Hunter Wilds! On February 28, your journey into the Forbidden Lands begins. Now, to help ensure you have a satisfying, fun experience come launch, we're pleased to share that the Monster Hunter Wilds Benchmark we'd previously mentioned we were looking into, is real, it's ready, and it's live from right now for you to try!

With the Monster Hunter Wilds Benchmark, we want to help our PC players feel more confident about how their PC will run Monster Hunter Wilds. In the next section, we're going to explain what the Monster Hunter Wilds Benchmark is, how it works, as well as some important information and differences you'll see between this and the Open Beta Test 1 and 2 experiences, so please take a moment to check it out.

LG Electronics (LG) has collaborated with Razer and MediaTek to introduce the world's first Bluetooth Ultra-Low Latency (BT ULL) Controller at LG webOS Summit 2024 on September 27. This groundbreaking technology was showcased through an LG webOS smart TV and Razer's Bluetooth gaming controller, demonstrating the game-changing 1 ms input lag.

The webOS summit, which welcomed 300 representatives from 140 partner companies - including content developers, producers and providers - from 24 countries, shared LG's strategic vision and future initiatives for expanding its AI webOS ecosystem and platform business.

SK hynix unveiled an enhanced Accelerator-in-Memory based Accelerator (AiMX) card at the AI Hardware & Edge AI Summit 2024 held September 9-12 in San Jose, California. Organized annually by Kisaco Research, the summit brings together representatives from the AI and machine learning ecosystem to share industry breakthroughs and developments. This year's event focused on exploring cost and energy efficiency across the entire technology stack. Marking its fourth appearance at the summit, SK hynix highlighted how its AiM products can boost AI performance across data centers and edge devices.

Booth Highlights: Meet the Upgraded AiMX
In the AI era, high-performance memory products are vital for the smooth operation of LLMs. However, as these LLMs are trained on increasingly larger datasets and continue to expand, there is a growing need for more efficient solutions. SK hynix addresses this demand with its PIM product AiMX, an AI accelerator card that combines multiple GDDR6-AiMs to provide high bandwidth and outstanding energy efficiency. At the AI Hardware & Edge AI Summit 2024, SK hynix presented its updated 32 GB AiMX prototype which offers double the capacity of the original card featured at last year's event. To highlight the new AiMX's advanced processing capabilities in a multi-batch environment, SK hynix held a demonstration of the prototype card with the Llama 3 70B model, an open source LLM. In particular, the demonstration underlined AiMX's ability to serve as a highly effective attention accelerator in data centers.

Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents patterned structures obtained after exposure with the 0.55NA EUV scanner in the joint ASML-imec High NA EUV Lithography Lab in Veldhoven, the Netherlands. Random logic structures down to 9,5 nm (19 nm pitch), random vias with 30 nm center-to-center distance, 2D features at 22 nm pitch, and a DRAM specific lay out at P32nm were printed after single exposure, using materials and baseline processes that were optimized for High NA EUV by imec and its partners in the framework of imec's Advanced Patterning Program. With these results, imec confirms the readiness of the ecosystem to enable single exposure high-resolution High NA EUV Lithography.

Following the recent opening of the joint ASML-imec High NA EUV Lithography Lab in Veldhoven, the Netherlands, customers now have access to the (TWINSCAN EXE:5000) High NA EUV scanner to develop private High NA EUV use cases leveraging the customer's own design rules and lay outs.

MaxLinear, Inc., a leading provider of data storage acceleration solutions for enterprise and data center applications, today announced it will demonstrate the advanced compression, encryption, and security performance of its storage acceleration solution, Panther III, at the Future of Memory and Storage (FMS) 2024 trade show from August 6-8, 2024. The demos will show that Panther III can achieve up to 40 times more throughput, up to 190 times better latency, and up to 1000 times less CPU utilization than a software-only solution, leading to significant cost savings in terms of flash drives and needed CPU cores.

MaxLinear's Panther III creates a bold new product category for maximizing the performance of data storage systems - a comprehensive, all-in-one "storage accelerator." Unlike encryption and/or compression solutions, MaxLinear's Panther III consolidates a comprehensive suite of storage acceleration functions, including compression, deduplication, encryption, data protection, and real-time validation, in a single hardware-based solution. Panther III is engineered to offload and expedite specific data processing tasks, thus providing a significant performance boost, storage cost savings, and energy savings compared to traditional software-only, FPGA, and other competitive solutions.

To accelerate humanoid development on a global scale, NVIDIA today announced it is providing the world's leading robot manufacturers, AI model developers and software makers with a suite of services, models and computing platforms to develop, train and build the next generation of humanoid robotics.

Among the offerings are new NVIDIA NIM microservices and frameworks for robot simulation and learning, the NVIDIA OSMO orchestration service for running multi-stage robotics workloads, and an AI- and simulation-enabled teleoperation workflow that allows developers to train robots using small amounts of human demonstration data.

Under the theme "Incredible Speed, Exceeding the Limit," ASMedia showcased its latest USB4 80 Gbps, 120 Gbps, and PCIe Gen 5 physical layer chips at Computex 2024. This demonstration highlighted ASMedia's leading position in the high-speed transmission field and outlined a one-stop solution for high-speed transmission, efficient charging, and multi-device connectivity for future smart working environments.

USB4 redefines data transfer speed
Computex Taipei 2024, ASMedia unveiled its world-leading USB4 80 Gbps and 120 Gbps physical layers, paving the way for the transfer of massive data and high-resolution videos in seconds, significantly improving work efficiency and user convenience. USB4's backward compatibility ensures seamless connection with existing USB devices.

Ahead of the 2024 Optical Fiber Communication Conference (OFC), MediaTek (last week) announced it is launching a next-generation custom ASIC design platform that includes the heterogeneous integration of both high-speed electrical and optical I/Os in the same ASIC implementation. MediaTek will be demonstrating a serviceable socketed implementation that combines 8x800G electrical links and 8x800G optical links for a more flexible deployment. It integrates both MediaTek's in-house SerDes for electrical I/O as well as co-packaged Odin optical engines from Ranovus for optical I/O. Leveraging the heterogeneous solution that includes both 112G LR SerDes and optical modules, this CPO demonstration delivers reduced board space and device costs, boosts bandwidth density, and lowers system power by up to 50% compared to existing solutions.

Additionally, Ranovus' Odin optical engine has the option to provide either internal or external laser optical modules to better align with practical usage scenarios. MediaTek's ASIC experience and capabilities in the 3 nm advanced process, 2.5D and 3D advanced packaging, thermal management, and reliability, combined with optical experience, makes it possible for customers to access the latest technology for high-performance computing (HPC), AI/ML and data center networking.

Leaked Samsung PBSSD presentation material popped up online a couple of days prior to the kick-off day of NVIDIA's GTC 2024 conference (March 18)—reports (at the time) jumped on the potential introduction of a "petabyte (PB)-level SSD solution," alongside an enterprise subscription service for the US market. Tom's Hardware took the time to investigate this matter—in-person—on the showroom floor up in San Jose, California. It turns out that interpretations of pre-event information were slightly off—according to on-site investigations: "despite the name, PBSSD is not a petabyte-scale solid-state drive (Samsung's highest-capacity drive can store circa 240 TB), but rather a 'petascale' storage system that can scale-out all-flash storage capacity to petabytes."

Samsung showcased a Supermicro Petascale server design, but a lone unit is nowhere near capable of providing a petabyte of storage—the Tom's Hardware reporter found out that the demonstration model housed: "sixteen 15.36 TB SSDs, so for now the whole 1U unit can only pack up to 245.76 TB of 3D NAND storage (which is pretty far from a petabyte), so four of such units will be needed to store a petabyte of data." Company representatives also had another Supermicro product at their booth: "(an) H13 all-flash petascale system with CXL support that can house eight E3.S SSDs (with) four front-loading E3.S CXL bays for memory expansion."

Qualcomm Technologies, Inc. unveiled its latest advancements in artificial intelligence (AI) at Mobile World Congress (MWC) Barcelona. From the new Qualcomm AI Hub, to cutting-edge research breakthroughs and a display of commercial AI-enabled devices, Qualcomm Technologies is empowering developers and revolutionizing user experiences across a wide range of devices powered by Snapdragon and Qualcomm platforms.

"With Snapdragon 8 Gen 3 for smartphones and Snapdragon X Elite for PCs, we sparked commercialization of on-device AI at scale. Now with the Qualcomm AI Hub, we will empower developers to fully harness the potential of these cutting-edge technologies and create captivating AI-enabled apps," said Durga Malladi, senior vice president and general manager, technology planning and edge solutions, Qualcomm Technologies, Inc. "The Qualcomm AI Hub provides developers with a comprehensive AI model library to quickly and easily integrate pre-optimized AI models into their applications, leading to faster, more reliable and private user experiences."

Gamers love watching live streams, seeing their favorite players make incredible plays and get the wins - but what if we could take the action to the next level, and not just see and hear the stream, but feel it too? Imagine the new heights gamers can go to if they're enveloped in the game, the sights, the sounds and the sensations. The key to unlocking this dream is haptics, and at CES 2024, Razer turned this dream into reality with the unveiling of Project Esther - the World's First HD Haptics Gaming Cushion, powered by our latest innovation, Razer Sensa HD Haptics.

Streaming Haptics - bringing the viewer into the game: Razer is delighted to showcase, in partnership with global wireless, video, and AI research and development company InterDigital, the world's first MPEG haptics streaming experience at Mobile World Congress 2024. Showcased at InterDigital's booth at Hall 7 Stand 7B31 in a haptic-enhanced immersive streaming demo, this new gaming experience has to be felt to be believed. The demo will be shown on a Razer Sensa HD Haptics setup which includes the multi CES Award winning Project Esther, a modified version of the Razer Kraken HyperSense V3 headset, and an HD haptics controller, giving a total of 20 haptics endpoints, and will be streamed via InterDigital's contributions to MPEG haptic and immersive video codecs.

Samsung Electronics and Vodafone, in collaboration with AMD, today announced that the three companies have successfully demonstrated an end-to-end call with the latest AMD processors enabling Open RAN technology, a first for the industry. This joint achievement represents the companies' technical leadership in enriching the Open RAN ecosystem throughout the industry. Conducted in Samsung's R&D lab in Korea, the first call was completed using Samsung's versatile, O-RAN-compliant, virtualized RAN (vRAN) software, powered by AMD EPYC 8004 Series processors on Supermicro's Telco/Edge servers, supported by Wind River Studio Container-as-a-Service (CaaS) platform. This demonstration aimed to verify optimized performance, energy efficiency and interoperability among partners' solutions.

The joint demonstration represents Samsung and Vodafone's ongoing commitment to reinforce their position in the Open RAN market and expand their ecosystem with industry-leading partners. This broader and growing Open RAN ecosystem helps operators to build and modernize mobile networks with greater flexibility, faster time-to-market (TTM), and unmatched performance. "Open RAN represents the forthcoming major transformation in advancing mobile networks for the future. Reaching this milestone with top industry partners like Samsung and AMD shows Vodafone's dedication to delivering on the promise of Open RAN innovation," said Nadia Benabdallah, Network Strategy and Engineering Director at Vodafone Group. "Vodafone is continually looking to innovate its network by exploring the potential and diversity of the ecosystem."

MemryX Inc. is announcing the availability of production level silicon of its cutting-edge AI Accelerator (MX3). MemryX is a pioneering startup specializing in accelerating artificial intelligence (AI) processing for edge devices. In less than 30 days after receiving production silicon from TSMC, MemryX will publicly showcase the ability to efficiently run hundreds of unaltered AI models at the 2024 Consumer Electronics Show (CES) in Las Vegas from Jan 9 through Jan 12.

Intel's advanced packaging prowess demonstration took place this week—attendees were able to get an early-ish look at Team Blue's sixth Generation Xeon Scalable "Sapphire Rapids" processors. This multi-tile datacenter-oriented CPU family is projected to hit the market within the first half of 2024, but reports suggest that key enterprise clients have recently received evaluation samples. Coincidentally, renowned hardware leaker—Yuuki_AnS—has managed to source more information from industry insiders. This follows their complete blowout of more mainstream Raptor Lake Refresh desktop SKUs.

The leaked slide presents a bunch of evaluation sample "Granite Rapids-SP" XCC and "Sierra Forest" HCC SKUs. Intel has not officially published core counts for these upcoming "Avenue City" platform product lines. According to their official marketing blurb: "Intel Xeon processors with P-cores (Granite Rapids) are optimized to deliver the lowest total cost of ownership (TCO) for high-core performance-sensitive workloads and general-purpose compute workloads. Today, Xeon enables better AI performance than any other CPU, and Granite Rapids will further enhance AI performance. Built-in accelerators give an additional boost to targeted workloads for even greater performance and efficiency."

KIOXIA America, Inc. today announced the availability of the first hardware samples that support the Linux Foundation's vendor-neutral Software-Enabled Flash Community Project, which is making flash software-defined. The company is expecting to deliver customer samples in August 2023. Built for the demanding needs of hyperscale environments, Software-Enabled Flash technology helps hyperscale cloud providers and storage developers maximize the value of flash memory. The hardware from KIOXIA is the first step to putting this working technology in the hands of developers.

The first running units will be showcased in live demonstrations in the KIOXIA booth (#307) next week at Flash Memory Summit 2023 (FMS 2023). This new class of drive consists of purpose-built, media-centric flash hardware focused on hyperscale requirements that work with an open source API and libraries to provide the needed functionality. By unlocking the power of flash, this technology breaks free from legacy hard disk drive (HDD) protocols and creates a platform specific to flash media in a hyperscale environment.

Introducing the Versal HBM Series VHK158 Evaluation Kit. This features the Versal HBM series VH1582 device, which integrates multi-Tbps High Bandwidth Memory (HBM), hardened connectivity IP, and adaptive compute in a single device, eliminating the bottlenecks between memory, I/O, and compute while delivering up to 6 times more memory bandwidth.

The VHK158 evaluation kit is an evaluation platform for the Versal HBM series VH1582 device designed to keep up with the higher memory needs of compute intensive, memory bound applications, providing adaptable acceleration for data center, wired networking, test & measurement, and aerospace & defense applications. The VHK158 board's primary focus is to enable demonstration and evaluation of the VH1582 silicon and support customer application development

Samsung Electronics and MediaTek completed the successful testing of 5G Standalone Uplink (UL) 2CC Carrier Aggregation (CA) with C-Band UL MIMO to reach top uplink speeds, marking a groundbreaking achievement in wireless mobile capabilities. This approach used three transmit (3Tx) antennas to improve upload experiences, ushering in an era of enhanced connectivity for consumers worldwide.

The demands on uplink performance are increasing with the rise of live streaming, multi-player gaming and video conferences. Upload speeds determine how fast your device can send data to gaming servers or transmit high-resolution videos to the cloud. As more consumers seek to document and share their experiences with the world in real-time, enhanced uplink experiences provide an opportunity to use the network to improve how they map out their route home, check player stats online and upload videos and selfies to share with friends and followers.

Cooler Master is exhibiting new MM712 gaming mouse variants at Computex 2023 - the two updated offerings come in the form of a high-end "PRO" version and a (potentially) cheaper wired model. The original MM712 was released last autumn (after several delays) to a mostly warm reception, although user feedback did provide Cooler Master with plenty of insights for the development of possible successors. The peripheral design team has addressed a key negative point - the MM712 PRO and Wired models no longer sport primary button overhang - certain users complained about their fingers getting pinched by the original's sharp side pieces. The new model's sensor position has been adjusted to a more central placement according to documentation on hand.

The MM712 PRO looks to offer a significant bump in specifications (over the base model) thanks to it being fitted with Pixart's top PAW 3395 optical sensor. Cooler Master will be catching up with leading brands who already offer high polling rate gaming mice. The MM712 PRO in wired connection mode can operate at 8 kHz, while wireless operation is rated at 4 kHz via an included ultra-fast USB dongle. The spec upgrade has not meant that the model's weight has increased, Cooler Master reps at Computex claim that the PRO remains in the lightweight category - coming in at roughly 56 grams.

Renowned HDTVTest YouTube reviewer and presenter, Vincent Teoh, has been exploring the showroom floor at this year's Display Week trade symposium (in Los Angeles, CA). He was intrigued by some cutting-edge screen tech at BOE's booth and announced this discovery on Twitter yesterday evening: "Forget 8K. Here's the world's first 110-inch 16K display unveiled by BOE at Display Week 2023. LCD-based, max 400 nits. The resolution is unreal though, no visible pixels even right up close."

The demo unit appears to be a prototype - BOE Displays has not revealed any type of official product launch. Their giant screen is reported to be almost 2.8 meters wide in terms of diagonal length, and a specification sheet placed nearby lists a maximum 15360x8640 resolution paired with a 60 Hz refresh rate. The 16K display has a contrast ratio of 1200:1 and is capable of reproducing 99% DCI-P3 color coverage. We hope to view further reports from this tradeshow - hopefully a BOE rep will provide details about the required GPU power to run their monster LCD monitor.

Amnesia: The Bunker is a first-person horror game set in a desolate WW1 Bunker. Face the oppressing terrors stalking the dark corridors. Search for and use the tools and weapons at your disposal, while keeping the lights on at all costs. Overcome fear, persevere, and make your way out alive. Amnesia: The Bunker is a first-person horror game from the makers of SOMA and Amnesia.

RISING TENSION
Immerse yourself in the multiple ways of tackling survival. In the shoes of the French soldier Henri Clément, you are armed with a revolver gun, a noisy dynamo flashlight, and other scarce supplies to scavenge and craft along the way. With randomization and unpredictable behavior, no play-through is the same. Hunted by an ever-present threat reacting to your every move and sound, you must adapt your play-style to face hell. Every decision will change the outcome of how the game responds. Actions bear consequences.

Samsung and LG are among an number of tech companies reportedly pushing for radical changes in the cinema viewing experience. In a piece published by the Hollywood Reporter last week, new behind-the-scenes information has come to light about an effort to replace the (some will say tried and true) traditional cinema theater projection system with LED walls. The vast majority of international theater chains rely on a front projection method (via a back of the booth), and very few locations have a more state-of-the-art LED display-based system in place. The Culver Theater (naturally located in Culver City, CA) is one of a hundred cinemas worldwide to possess a Samsung Onyx LED display - although the tech on show is said to be of an older standard. Industry insiders have been invited to attend demonstrations of a newer generation LED wall technology destined for cinemas in the future, and early impressions are purported to be mixed.

A cinema-based LED wall display functions in a similar way to how a modern LED-based flat screen TV works - although on a much greater massive scale - with particular benefits of the technology resulting in fantastic performance in terms of high dynamic range and peak brightness. The main downside of having a tightly packed array of large LED panels is the resultant heat output - critics of the technology state that it will be difficult to implement an adequate cooling system (through air conditioning) to tame the wall's temperature increasing properties. The power required to operate the LED panel array (plus required cooling solution) is said to be much higher than that of an old-fashioned projector's relatively modest draw from the electricity supply. An LED wall will also completely negate the traditional placement of loudspeakers behind a cinema's front-placed screen - and sound engineers will need to explore a different method of front audio channel output within the context of a next generation LED theater room.