AMD is looking to give its Phenom II series a finale, with a new quad-core Phenom II X4 model, the Phenom II X4 980 Black Edition. The new chip will be clocked at 3.70 GHz out of the box (18.5 x 200 MHz). It achieves this speed while staying within the 125W TDP envelope. Based on the 45 nm "Deneb" silicon, the X4 980 BE features four x86-64 cores with 512 KB dedicated L2 cache each, and a 6 MB shared cache. Compatible with AM3 and AM2+ sockets, the chip packs a dual-channel memory controller that supports DDR3-1333 MHz or DDR2-1066 MHz memory standards. AMD will unveil the new chip soon, as the company gears up to launch next-generation chips in June.

AMD's next-generation high-end desktop processor line, the AMD FX-series, is inching toward a June 11 launch, according to DonanimHaber. FX-Series is hyped for being based on the company's next-generation "Bulldozer" architecture, which is a built from ground up x86-64 processor design. AMD's FX-series will include 8-core, 6-core, and 4-core models, and will optimally run on a new socket currently referred to as "AM3+". Major motherboard vendors are expected to release AM3+ motherboards based on various chipsets around the same time.

Tablet PCs came and went, but "tablets" as a category began with the Apple iPad. Merely weeks after its launch, the rattled PC OEM industry announced plans for their tablets, some being ARM-based and driven by Google's touch-phone optimized Android OS, and some using x86 processors and Windows 7. Unfortunately, Windows 7 based tablets aren't cutting it in the market, and the problem is with the user-interface (UI) itself. While Windows 7 has a touchscreen/pen software framework, its UI is more PC-like. Menu items, buttons with applications, are not very optimized for a comfortable touch-only input device.

Hence, Microsoft seems to be expediting the release of Windows 8 for Tablets, and the software giant plans to do that as early as by CES 2012. Only the tablet version of Windows 8 will be released then, not the PC version.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the new VIA Eden X2 processor, the industry's lowest power dual-core processor, optimized for fanless implementation in a broad range of industrial and commercial embedded systems. VIA Eden X2 will debut at Embedded World 2011, Nuremberg, Hall 12, Booth No. 574

VIA Eden X2 processors combine VIA's signature 'Eden' fanless design principles, in a highly optimized, power-efficient dual-core architecture. This guarantees rock-solid stability for mission critical embedded systems without compromising on performance or features. With a component longevity guarantee of 7 years, VIA Eden X2 processors are guaranteed to extend the reach of fanless system design for years to come.

Employing rock-solid R&D capabilities, MSI rolled out a complete array of new notebook computers packing the new generation of CPU platforms introduced in 2011. It will be parading them March 1-5 at CeBIT, the international computer electronics exhibition in Hanover, Germany. MSI's wares will be displayed in Booth C38, Hall 17. Come to MSI's booth to see world gaming champions Fnatic.MSI as well as the MSI GT680-the world's fastest notebook computer. There'll be plenty of exciting things at the MSI booth to wow the crowds.

Eric Kuo, associate vice president for global sales, MSI Notebook, noted that the 20+ additions to be shown will include the awesome G Series gaming laptops, the high performance F Series, the deluxe multimedia C Series, the gorgeously slender X Series, and the highly mobile U netbook series. These stylish machines all pack the newest generation of either Intel or AMD's CPUs and advanced visual-display units. Most models also come with MSI Premium Sound-the best wrap around sound out there. Like supercar-class Dynaudio, cinema-grade THX TruStudio Pro, and premium multimedia SRS PC Sound for the home, programs designed to satisfy the audio-visual entertainment needs of users from around the world, will be on display in Hanover.

MSI introduces the CR650 notebook computer with the newest generation AMD dual core E-350 processor as well as SRS PC Sound and Cinema Pro technologies for a superior multimedia experience. The CR650 packs MSI's Turbo Battery+ power-saving technology and shortcuts for shutting off the screen to extend standby time. MSI's all-new C Series CR650 notebook computer features AMD's latest generation dual core E-350 processor with AMD Radeon HD 6310 Discrete-Class graphics chip for powerful display performance on par with that of a discrete graphics card. The CR650 also comes with high quality, theater-class wrap around stereo courtesy of SRS PC Sound for unprecedented sound fidelity. What's more, Cinema Pro allows you to make adjustments to graphics like a professional to maximize your multimedia experience.

Eric Kuo, associate vice president for global sales, MSI Notebook, notes that the CR650 multimedia laptop comes sheathed in MSI's own color film print coating with color gradient design, making it even more pleasing to the eye. The independent Chiclet keyboard and seamless touchpad give you a stylish machine with powerful computing capabilities, and unparalleled multimedia performance.

After a well-received launch of the Fusion "Zacate" accelerated processing unit (APU) for nettops and entry-level PCs, AMD's higher-performance APU, codenamed "Llano", is just around the corner. Llano is intended for use on mainstream desktops, business PCs, and all-in-one PCs, it is better geared for higher-resolution, visually-intensive computing. Its competitors include Intel's Core i3 and Core i5 dual-core processors. AMD is backing up this launch with a new multi-GPU technology which is both similar and different from Hybrid CrossFireX. The similar part is that the GPU embedded in the Fusion chip will work in tandem with a discrete AMD Radeon graphics card, the difference is that it can work with any HD 6000 series graphics card, and multiply the available display connectivity.

The Fusion Llano APU will be part of AMD's Lynx mainstream desktop platform. The Llano APU embeds two x86-64 processing cores that feature the latest SIMD extensions, a DirectX 11 compliant GPU, a dual-channel DDR3 memory controller, a PCI-Express 2.0 hub, and an interconnect to the Hudson M1 chipset. The APU gives out a PCI-Express 2.0 x16 port, which is configurable using external switching. AMD also ran its own internal tests to show the performance advantage the new multi-GPU technology will give. AMD's Lynx mainstream desktop platform is expected to launch a little later this year.

AMD (NYSE:AMD) today announced revenue for the fourth quarter of 2010 of $1.65 billion, net income of $375 million, or $0.50 per share, and operating income of $413 million. The company reported non-GAAP net income of $106 million, or $0.14 per share, and non-GAAP operating income of $141 million. The non-GAAP net income and non-GAAP operating income primarily excluded a net of tax gain of $236 million, and a pre-tax gain of $283 million, respectively, that the company recognized related to a patent license and legal settlement.

For the year ended December 25, 2010, AMD reported revenue of $6.49 billion, net income of $471 million, or $0.64 per share, and operating income of $848 million. Full year non-GAAP net income was $360 million, or $0.49 per share, and operating income was $553 million.

AMD today announced immediate availability of the new AMD Embedded G-Series processor, the world's first and only Accelerated Processing Unit (APU) for embedded systems. The AMD Embedded G-Series, based on AMD Fusion technology, delivers a complete, full-featured embedded platform and incorporates the new low-power, x86 CPU based on the "Bobcat" core with a world-class DirectX 11-capable GPU and parallel processing engine on a single piece of silicon.

"AMD's commitment is to ensure the game-changing technologies we develop for consumers and the enterprise are also available for the vast and growing embedded market," said Patrick Patla, corporate vice president and general manager, Server and Embedded Division, AMD. "Today, we have a record number of embedded launch partners. They are using the unique advancements of the AMD Embedded G-Series APU to develop a brand new generation of highly differentiated, energy-efficient, small form-factor embedded systems that can deliver the vivid visual experience expected in our always-connected world."

PowerColor is ready with its mini-ITX motherboard based on the AMD "Brazos" platform. The unnamed motherboard that is yet to get its heatsink(s) on, uses an AMD Fusion "Zacate" E-350 APU that embeds a dual-core x86-64 processor clocked at 1.60 GHz, and an AMD Radeon HD 6310 DirectX 11 compliant GPU. The APU is wired to two DDR3 SODIMM slots (notebook memory). Power is drawn in from a standard 24-pin ATX connector. The lone expansion slot is a PCI-Express 2.0 x4 with an open-end (to let you fit x16 graphics cards).

Storage connectivity includes four internal SATA 3 Gb/s, other features include 8-channel HD audio with optical SPDIF output, gigabit Ethernet, two USB 3.0 and a number of USB 2.0 ports. Display outputs include DVI and D-Sub. The motherboard is best suited for entry-level home PCs and office PCs.

MSI is ready with its motherboard based on the AMD Fusion "Brazos" platform. The motherboard major announced E350IA-E45, its first motherboard based on the platform in mini-ITX form-factor. It is intended for use on most entry-thru-mid range desktop PCs, office PCs, and HTPCs. At the heart of it is the AMD Fusion E-350 dual-core processor based on the "Bobcat" architecture. It embeds an AMD Radeon HD 6310 graphics processor that is DirectX 11 compliant. The processor is aided by Hudson M1 single-chip chipset.

The processor is wired to two DDR3 DIMM slots and supports up to 8 GB of memory in x86-64 mode. It is powered by a 3+1 phase VRM. The lone expansion slot is a PCI-Express 2.0 x16 (electrical 2.0 x4). The chipset gives out four SATA 6 Gb/s ports supporting high-speed SSDs and HDDs. Connectivity is aplenty: 8+2 channel HD audio with optical and coaxial SPDIF connectors, two USB 3.0 ports, ten USB 2.0 ports, gigabit Ethernet, and PS/2 mouse/keyboard combo connector. Display connectivity includes D-Sub and HDMI 1.4a. The MSI E350IA-E45 will ship toward late January or early February.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its latest VIA Nano X2 processor for mainstream PC markets. Based on a 40 nanometer fabrication process, the VIA Nano X2 delivers better computational performance and improved multi-tasking ability without consuming more power.

"The VIA Nano X2 processor arrives at a time when software architectures are now optimized to for multi-thread computing," commented Richard Brown, VP International Marketing, VIA Technologies, Inc. "Improvements in semi-conductor fabrication means we can now double the number of processor cores while maintaining the same low energy consumption levels that our customers are used to."

Today at the Consumer Electronics Show, AMD launched a new class of accelerated processor that combines more compute capabilities than any processor in the history of computing. The AMD Fusion Family of Accelerated Processing Units (APUs) incorporate - in a single die design - multi-core CPU (x86) technology, a powerful DirectX 11-capable discrete-level graphics and parallel processing engine, a dedicated high-definition video acceleration block, and a high-speed bus that speeds data across the differing types of processor cores within the design. New generations of desktop, notebook and HD netbooks are now available based on AMD Fusion APUs at affordable price points. Tablets and embedded designs based on AMD Fusion APUs are expected be available later in Q1 2011. The new range of products features include stutter-free HD video playback, breakthroughs in computational horsepower to handle the most demanding applications, DirectX 11-capable graphics and all-day battery life.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the world's first graphics card designed specifically for the embedded market with the VIA eH1, a DX10.1 compliant, multi-display card that thrusts any system with a PCI Express slot into a new realm of graphics and video capability.

The VIA eH1 comes with a three year product longevity guarantee and is the most power-efficient discrete graphics and video solution on the market today. The VIA eH1 AIB features an advanced DirectX 10.1, OpenGL 3.1, OpenGL ES 2.0 compatible 64-bit architecture and offers multi-stream 1080p HD video decoding and Stereoscopic 3D rendering capability. This makes it the ideal solution for a range of embedded applications that require advanced graphics and video on multiple displays.

MSI jumped on the AMD Fusion "Brazos" bandwagon by showing off its first implementation based on the new platform. The company held a press-meet in Taipei well ahead of CES in hopes of giving its latest creation some exclusive exposure ahead of the mega event. The Wind U270 from MSI, is a 12-inch ultra-portable driven by AMD Fusion "Zacate" E-350 dual-core accelerated processing unit (APU), the x86-64 processor cores are clocked at 1.60 GHz, and feature the latest instruction sets. The APU embeds AMD Radeon HD 6310 graphics that's DirectX 11 compliant, featuring UVD 3.0 video acceleration. The third key component is 4 GB of DDR3 memory.

The Wind U270 uses MSI's tried and tested 12-inch Wind chassis with Chiclet keyboard. Other hardware specifications include 320 GB (500 GB optional) hard drive based storage, WiFi b/g/n, gigabit Ethernet, display connectivity that includes D-Sub, and HDMI; two USB 3.0 ports, card reader, and VGA webcam. Although battery life isn't mentioned, the notebook features an Eco mode that conserves power.

Acer will be one of the first adopters of AMD's "Brazos" Fusion platform for its netbooks. The company is developing a new 10-inch Aspire One model, the Aspire One 522, which makes use of AMD Fusion C-50 "Ontario" dual-core processor clocked at 1.00 GHz, with TDP of under 9W, and AMD Radeon HD 6250 graphics embedded. The x86-64 processor cores are based on the "Bobcat" architecture, feature the latest instruction sets, while the graphics core supports DirectX 11 and UVD 3.0 video acceleration.

The 10.1-inch screen features a native resolution of 1280 x 720 pixels, which can be extended onto a HDTV or a monitor using HDMI. Most other features including connectivity are similar to existing Aspire One netbooks. The battery can provide 6 hours of usage on full charge. Acer is expected to unveil this powerful netbook in early 2011.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-P830 Pico-ITX board for advanced portable and network connected embedded applications. The VIA EPIA-P830 features the VIA Nano E-Series processor and the latest VIA VX900 media system processor with additional support for dual Mini-PCIe modules, bringing a wealth of 3G and wireless connectivity options.

"Modern enterprise environments in healthcare, logistics and fleet management require more connected and portable devices that don't hold back on multimedia ability," said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. "The VIA EPIA-P830 addresses these needs, creating the most complete Pico-ITX board on the market with great HD video performance and a variety of display and network connectivity options."

The first motherboard that brings the AMD Fusion "Brazos" platform to nettops was pictured, the GA-E350V-USB3, which is a mini-ITX motherboard that makes use of AMD Fusion E-350 accelerated processing unit (APU), and Hudson M1 chipset. AMD is targeting the nettop and HTPC markets with such motherboards, also as competitors to Atom and new Pentium Dual-Core (LGA1156/LGA1155) desktops. The GA-E350V-USB3 makes use of Gigabyte's Ultra Durable 3 construction that makes use of a PCB with 2x copper layers, solid-state capacitors, low RDS (on) MOSFETs, and ferrite core chokes.

The board uses a 3+2 phase power design. The Fusion E-350, like the Intel Atom, is hard-wired to the board, and cooled by a small fan-heatsink. It connects to two DDR3 DIMM slots for single-channel DDR3-1800+ MHz memory. The lone expansion slot is a PCI-Express 2.0 x16 (electrical x8). The Fusion APU packs two x86-64 cores clocked at 1.60 GHz, and an AMD Radeon HD 6310 graphics processor that features 80 stream processors, and clock speed of 500 MHz. Connectivity include four SATA 3 Gb/s ports, 8-channel HD audio, two USB 3.0 ports, display connectivity includes DVI, D-Sub, and HDMI. Pricing and availability are not known, as AMD didn't officially launch the platform.

TYAN, an industry-leading server platform manufacturer, and a subsidiary of MiTAC International Corp., today announced four server platforms that are fully compatible with AMD FireStream GPU compute accelerators.

The AMD FireStream GPU compute accelerators are general purpose graphics processing units that deliver exceptional floating point processing capabilities, and are used widely in HPC, cloud and enterprise-scale applications, helping reduce cycle times with up to 2.64 TFLOPs of single precision performance.

At its annual Financial Analyst Day, AMD (NYSE: AMD) demonstrated how its unique combination of CPU and GPU computing technologies on a single die will enable breakthrough capabilities in an innovative processor design with planned OEM system availability in early 2011. AMD executives detailed how this new class of processor, AMD Fusion Accelerated Processing Units (APUs), is poised to create a sustained position of advantage by powering demanding PC workloads in sleek form factors with long battery life, pacing future AMD growth. AMD Fusion APUs are built from DirectX 11-capable GPU technology and either low-power or high-performance multi-core x86 CPU technology. These APUs are designed to vastly improve today's Internet, video processing and playback, and gaming (client and online) experiences. For the first time, AMD also demonstrated its new high-performance x86 multi-core CPU architecture codenamed "Bulldozer" and provided additional information around the "Bulldozer" launch schedule.

AMD today announced additional infrastructure and channel support for its AMD Opteron 6000 Series platform, the world's first 8- and 12-core x86 processor, addressing the needs of server customers worldwide with its unprecedented price/performance/watt. Since introducing the AMD Opteron 6000 Series platform earlier this year, the continued expansion of channel support and product lineups has helped drive a broad portfolio of highly customized solutions, available for small and medium businesses, enterprises and HPC environments.

Adding to the growing list of AMD Opteron 6100 Series-based channel products deployed in high-performance computing (HPC) environments, a major institution of higher education in Europe recently selected 2U, GPU-optimized Twin servers from AMD channel partner Supermicro for its flagship supercomputer. Furthermore, a nationally ranked research university in the United States recently deployed a 324-node/100 Teraflops system from AMD channel partner Appro to help solve critical research science using AMD Opteron 6100 Series processors.

The Portland Group, a wholly-owned subsidiary of STMicroelectronics and a leading supplier of compilers for high-performance computing (HPC), today announced it is developing a CUDA C compiler targeting systems based on the industry-standard general-purpose 64- and 32-bit x86 architectures. The new PGI CUDA C compiler for x86 platforms will be demonstrated at the SC10 Supercomputing conference taking place in New Orleans, LA, November 13-15, 2010.

The NVIDIA CUDA architecture was developed to enable offloading computationally intensive kernels to massively parallel GPUs. Through function calls and language extensions, CUDA gives developers explicit control over the mapping of general-purpose computational kernels to GPUs, as well as the placement and movement of data between an x86 processor and the GPU.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-M850 Mini-ITX board, the first board to feature the latest VIA VX900 media system processor, creating the ideal solution for today's HD-intensive, commercial multimedia-centric devices.

The VIA EPIA-M850 is targeted at OEM and ODM manufacturers of commercial multimedia embedded devices. Featuring a 64-bit, high performance VIA Nano E-Series processor and the VIA VX900 unified all-in-one media system processor, the VIA EPIA-M850 delivers a highly optimized platform that boasts comprehensive HD video performance, HD audio and HDMI support in a compact, power-efficient package.

VIA, in its recent announcement about posting a net loss of US $45 million for 1H 2010, revealed plans about future products and manufacturing process transitions with which it hopes to return to profits. These include release of dual-core VIA Nano processors based on a new manufacturing process due for released later this year, the new VN11 chipset that will embed DirectX 11 compliant integrated graphics, which it will released next year. The company also announced that it will release a new quad-core CPU in 2011, which is the company's first. VIA is only the third company that is an active license-holder of the x86 instruction set. Even as much larger x86 manufacturers such as Intel and AMD battle it out, VIA designs processors for low-power applications such as embedded industrial computers, and netbook/ULPC processors such as the VIA Nano and VIA C3.

At the ongoing IFA event in Berlin, AMD displayed one of the first derivatives of its Bobcat low-power x86 processor architecture, codenamed "Ontario". This Fusion APU (accelerated processing unit), which is a combination of an x86 CPU and a DirectX 11 compliant GPU is built for low-power devices such as netbooks, handhelds, and tablets. AMD also showed off the chip package itself, which is roughly the size of a 1 Euro coin. The package, like AMD's mobile Athlon/Phenom processors, has no integrated heatspreader (IHS), but like the Intel Atom, uses a ball-grid array (BGA) to permanently fix itself to the system board.

AMD claims that the chip offers "mainstream performance" at less than half the die area (in this case, below 100 mm²), and a fraction of the power. Speaking of which, the "Ontario" Fusion APU has a TDP of 9W, while a higher-performance APU codenamed "Zacate", which is probably competitive with Intel's CULV processors, and is built for ultra-thin notebooks, nettops and slim all-in-one PCs, has a TDP of 18W. AMD claims that the two will ship (to OEMs, because these are not end-user products) in Q4 2010. For the desktop, AMD is developing the "Llano" Fusion APUs that are of a different form-factor and package altogether.