HP V10 RGB DDR4-3600 CL14 2x 8 GB Review 34

HP V10 RGB DDR4-3600 CL14 2x 8 GB Review

Test System Setup »

A Closer Look


Now that the HP V10 RGB DIMM modules are out of the package, it becomes clear that these have a unique appearance with a black and silver checkerboard heatsink design.


It is hard to mistake these for any other brand because the HP logo has been placed in the center on each side.


Laying these DIMMs on the side, we see HP taking a different approach from other vendors by not placing the product or company name on the light bar diffuser.


On one side of each DIMM module is the identification sticker listing the product number, rated XMP operating frequency, and timings. HP lays these out in an easy to read format helpful for quick identification without the box. The only important thing missing is the XMP profile voltage. While not necessary, there is practical reason to include it along with everything else.


The HP V10 RGB weighs in at 68 grams on my scale. For Z-height, it is 47 mm rounding up with my calipers. This memory kit is considered slightly oversized. Caution is once again advised for air-coolers in relation to the DIMM slots. Most have adjustable fan heights or simply do not overhang the memory. On the off-chance of it being a problem, you have been given notice.


After taking the heatspreader off, we see a single-sided DIMM with eight 1 GB ICs. Thermal tape has been placed across the entire length of the PCB. On the light diffuser bar, white tape keeps light bleed to a minimum, and it does make a marked difference. After messing up the tape during reassembly, light bleed can be seen in those areas no longer covered.


Getting a closer look at the ICs, these are Samsung B-Die (K4A8G085WB-BCPB). B-Die is known for its unmatched low latency DDR4 timings. HP cannot swap these ICs out at a later date without changing the timings as well. Currently, no other IC manufacturer has memory that can be binned to CAS 14 for mass-production—it has to be Samsung B-Die. HP even promotes B-Die usage on the product page, which is a bold move, I might add; that said, HP seems to understands that changing timings mid-life will drive customers away in droves, as they expect one thing and get something completely different.

Thaiphoon Burner Readout


Thaiphoon reports the SPD correctly, listing Samsung ICs and an 8-layer PCB. This HP V10 RGB kit uses an XMP profile of DDR4-3600 14-15-15-35 at an operating voltage of 1.45. It also has a JEDEC SPD of 2133 MT/s, which is unfortunate if you cannot enable the XMP profile. It does allows for maximum compatibility across a number of platforms and OEM systems. However, I would have liked a second fallback XMP profile like DDR4-3200 CL14 for newer computers on the market.
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Sep 26th, 2024 21:33 EDT change timezone

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