Tuesday, July 26th 2022
Team Group Launches Industry's First M.2 SSD with Vapor-Chamber Cooling
With the rise of high-performance computing (HPC), the demand for industrial product cooling has increased dramatically due to higher power requirements and heat generation in demanding industrial applications and platforms. In response, Team Group has adopted the VC (Vapor Chamber) liquid cooling technology, commonly for mobile devices, and introduced the industry's first M.2 SSD VC liquid cooling technology. The VC liquid cooling tube was redesigned from the ground up for PCIe M.2 SSD applications based on the high-speed transfer rates and heat generation patterns of high-speed PCIe M.2 SSD. The result is a liquid-cooled PCIe M.2 SSD with outstanding thermal performance that can sustain high-speed operation in harsh and dynamic industrial environments.
Team Group's N74V-M80 is an industrial grade VC Cooling M.2 SSD that utilizes proprietary liquid cooling technology (Taiwan Utility Model Patent: M626519). Through the specially designed VC liquid cooling tubes, cooling fluid is pumped to the heat zone of PCIe M.2 SSD controller. Heat is then transferred to the aluminium fin heat sink with a convective design via gas-liquid phase transition to enhance thermal performance. The N74V-M80 combines the functions of heat absorption, conduction, and dissipation to better transfer and regulate thermal energy.Team Group's industrial control T.R.U.S.T. technology ("T" for Temperature) ensures that its PCIe M.2 SSD products maintain excellent transfer performance over a wide temperature range of -40°C (-40°F) to 85°C (185°F). In addition, the Team Group N74V-M80 uses TLC Flash and supports the PCIe Gen3 x4 interface and NVMe 1.3 standard, providing write and read speeds of up to 3,400 and 2,500 MB/s, respectively, and is suitable for industrial-grade HPC devices with adequate installation space. It can fully meet the high-speed computing needs while keeping it cool and energy-saving.
Under temperature performance testing, the N74V-M80 SSD with its VC liquid thermal module was better at maintaining efficient data writing capability than SSDs without heat sinks at an ambient temperature of 85°C due to a delayed slowdown mechanism, reducing data write time by 75%. These features significantly improving data read/write efficiency and stability and extending product life, making it the perfect choice for a reliable and durable industrial-grade SSD upgrade. Team Group continuously strives for innovation in the development of diverse cooling technologies so that customers can easily overcome any heating issues in harsh operating environments and enjoy superior storage performance. The company will continue to create the most reliable industrial storage solutions in response to the changing landscape and needs of the industrial storage market.
For more information, visit the product page.
Team Group's N74V-M80 is an industrial grade VC Cooling M.2 SSD that utilizes proprietary liquid cooling technology (Taiwan Utility Model Patent: M626519). Through the specially designed VC liquid cooling tubes, cooling fluid is pumped to the heat zone of PCIe M.2 SSD controller. Heat is then transferred to the aluminium fin heat sink with a convective design via gas-liquid phase transition to enhance thermal performance. The N74V-M80 combines the functions of heat absorption, conduction, and dissipation to better transfer and regulate thermal energy.Team Group's industrial control T.R.U.S.T. technology ("T" for Temperature) ensures that its PCIe M.2 SSD products maintain excellent transfer performance over a wide temperature range of -40°C (-40°F) to 85°C (185°F). In addition, the Team Group N74V-M80 uses TLC Flash and supports the PCIe Gen3 x4 interface and NVMe 1.3 standard, providing write and read speeds of up to 3,400 and 2,500 MB/s, respectively, and is suitable for industrial-grade HPC devices with adequate installation space. It can fully meet the high-speed computing needs while keeping it cool and energy-saving.
Under temperature performance testing, the N74V-M80 SSD with its VC liquid thermal module was better at maintaining efficient data writing capability than SSDs without heat sinks at an ambient temperature of 85°C due to a delayed slowdown mechanism, reducing data write time by 75%. These features significantly improving data read/write efficiency and stability and extending product life, making it the perfect choice for a reliable and durable industrial-grade SSD upgrade. Team Group continuously strives for innovation in the development of diverse cooling technologies so that customers can easily overcome any heating issues in harsh operating environments and enjoy superior storage performance. The company will continue to create the most reliable industrial storage solutions in response to the changing landscape and needs of the industrial storage market.
For more information, visit the product page.
26 Comments on Team Group Launches Industry's First M.2 SSD with Vapor-Chamber Cooling
I dont want drives that rely on external cooling, but it seems that's the way things are
Did you not understand what I wrote?
It's not the NAND that's an issue, it's the controllers that get too hot and that's when you have issues.
Have you even read a single SSD review here? The temps you see in Windows can be off by as much as 20 degrees due to uncalibrated thermal sensors.
I have read many of them, also on competitor webs. Usually tested on open bench or in full tower, with most common capacities like 1TB or 512GB, where only problem with temperature is your mythical controller.
dgianstefani said that ist pointless to cool them, I said its not pointless and it depends on circumstances.
When you have biggest capacities with 2TB OR 4TB, usually are double sided. Thast your first problem. If you are using mini itx board, your secod problem is your chipset and heat disipated to back of your new 400e ssd. Your third problem is your gpu with 300w+ near your nvme.
As you can see you can have environment in your case, which is not easy on your ssd without heatsink and also your problem is not just your mythical controller you blindly accouse of every problem with your ssd but also temperature of your nands could be crucial like in my case.
And no, I don't have a problem with text. FYI I have worked as a tech journalist for more than a decade and worked in the tech industry for my entire life, where I among other things, have helped design hardware products, but yeah, I'm the clueless one here.
That you have built a system that can't cool your components, is on you and no-one else. In fact, if claim your NAND is hitting 75 degrees C, then you've already voided your warranties, as you're operating your hardware outside of spec. This vapour chamber isn't likely to solve your problem.
I still believe you got a heatsink issue, as the heatsink is most likely not making good contact with the controller. I bought a Patriot Viper VPN100 SSD a couple of years ago and the pre-applied heatsink didn't make contact with the SSD controller and I saw exactly the kind of behaviour you're describing. Got it RMA:ed and the new SSD, where the heatsink is installed properly, haven't missed a beat.
Also, name calling isn't cool, especially when you have no idea who you're calling names.
If you understood how an SSD worked, you'd also understand that the heat from the controller is spread out through the heatsink, onto the the NAND.
The NAND doesn't get hot during normal write operations, hence why most older SSDs never had heatsinks. Heatsinks were only added once the controllers ended up getting faster and running hotter.
I laughed when m.2 came about, great more thermal build up on a motherboard around pcie ports. Rather just have a card plug straight into a pcie port at that rate.
It's why I would like to see SATA get faster as @lexluthermiester would.
PCB materials are terrible for heat transfer, the heatsink would do a much better job at spreading the heat from the controller to the NAND chips, due to the design of M.2 drives.
Go and look at some older M.2 drives, none of them had heatsinks and it wasn't an issue, as the controllers weren't running hot. Just like DRAM doesn't need heatsinks, NAND doesn't need heatsinks.
The rest of the heat in the case shouldn't even be an issue, if you got proper cooling in your system.
Some SSD's like Samsung 980 Pro series (and PM9A1 OEM version that i use) have very accurate thermal sensors on both the controller and NAND.
Also if your SSD does not have temperature sensors on NAND how do you know that NAND even reached 75c?
Did you manually attach thermal couple to it?
Nice did they actually add a temp sensor on this item ?
They don't on their memory sticks so kudos team group if they did it would be past time.
"The rest of the heat in the case shouldn't even be an issue, if you got proper cooling in your system."
- maybe in your dreams.. we are talking about 3w thing near 350w gpu, 170w cpu and 15w chipset, that definitely matters
As I said 214214 times, I had problem with temperature of backside NAND chips of NVME which is "sitting" on chipset. BTW that chipset consumes 5 times more than your controller on SSD and in this case is more problematic from heat radiation point of view as your controller... I know him, he worked for TPU, but he is wrong, that's the reason we are clashing here. Did you manually attach thermal couple to it?
yes
1. Throw insults around and you wont be able to post for much longer
2. NAND controllers overheat and need cooling. That's just... basic common knowledge?