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AMD Hawaii
Hawaii
Hawaii PRO
Hawaii XT
Fritzchens Fritz
Die Shot
Block Diagram
SE Diagram
AMD's Hawaii GPU uses the GCN 2.0 architecture and is made using a 28 nm production process at TSMC. With a die size of 438 mm² and a transistor count of 6,200 million it is a very big chip. Hawaii supports DirectX 12 (Feature Level 12_0). For GPU compute applications, OpenCL version 2.1 can be used. It features 2816 shading units, 176 texture mapping units and 64 ROPs.
Graphics Processor
Released
Oct 24th, 2013
GPU Name
Hawaii
Desktop Variant Grenada / Vesuvius
Codename Ibiza
Generation Volcanic Islands
Architecture
GCN 2.0
Foundry
TSMC
Process Size
28 nm
Transistors
6,200 million
Density
14.2M / mm²
Die Size
438 mm²
Graphics Features
DirectX
12 (12_0)
OpenGL
4.6
OpenCL
2.1
Vulkan
1.2.170
Shader Model
6.5
WDDM 2.7
Compute GFX7 (gfx702)
DCE 8.5
UVD 4.2
VCE 2.0
SDMA 1.0.0
CLRX GCN 1.1.0
Render Config
Shading Units
2816
TMUs
176
ROPs
64
Compute Units
44
Z-Stencil 256
ACEs 8
GEs 4
L1 Cache
16 KB per CU
L2 Cache
1024 KB
Max. TDP
580 W
AMD GPU Architecture History
Graphics cards using the AMD Hawaii GPU
Name
Chip
Memory
Shaders
TMUs
ROPs
GPU Clock
Memory Clock
Hawaii PRO
4 GB
2560
160
64
947 MHz
1250 MHz
Hawaii XT
4 GB
2816
176
64
1000 MHz
1250 MHz
Hawaii GL44
16 GB
2816
176
64
930 MHz
1250 MHz
Hawaii XT
4 GB
2816
176
64
1000 MHz
1350 MHz
Hawaii GL40
8 GB
2560
160
64
824 MHz
1250 MHz
Hawaii GL44
16 GB
2816
176
64
900 MHz
1250 MHz
Hawaii GL40
12 GB
2560
160
64
824 MHz
1250 MHz
Hawaii XT GL
32 GB
2816
176
64
930 MHz
1250 MHz
Hawaii GPU Notes
Generation: Volcanic Islands
Desktop Variant: Grenada / Vesuvius
Codename: Ibiza
Graphics/Compute: GFX7 (gfx701 / gfx702)
Display Core Engine: 8.5
Unified Video Decoder: 4.2
Video Compression Engine: 2.0
System DMA: 1.0.0
CLRX: GCN 1.1.0
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