ASRock Industrial is introducing new choices in industrial motherboards powered by 13th Gen Intel Core Processors (Raptor Lake-S) with up to 24 cores and 32 threads that boost computer-intensive edge performance. They come equipped with Intel W680, Q670, and H610 chipsets, and offer support for up to DDR5-5600 memory modules and PCIe Gen 5, allowing expanded possibilities and seamless integration within industry-specific applications.

By harnessing the power of the 13th Gen Intel Core Processors, they leap up to 1.04x/1.34x/1.25x faster in single-thread, multi-thread, and CPU image classification inference performance, respectively, compared to the preceding 12th Gen Intel Core processors. The new 13th Gen Intel CPU motherboards with DDR5 support, available in Mini-ITX, Micro-ATX, and ATX form factors, have been specifically designed to cater to the unique requirements of the Edge AIoT applications in commerce, automation, robot, entertainment, and security industries.

TrendForce reports that explosive growth in generative AI applications like chatbots has spurred significant expansion in AI server development in 2023. Major CSPs including Microsoft, Google, AWS, as well as Chinese enterprises like Baidu and ByteDance, have invested heavily in high-end AI servers to continuously train and optimize their AI models. This reliance on high-end AI servers necessitates the use of high-end AI chips, which in turn will not only drive up demand for HBM during 2023~2024, but is also expected to boost growth in advanced packaging capacity by 30~40% in 2024.

TrendForce highlights that to augment the computational efficiency of AI servers and enhance memory transmission bandwidth, leading AI chip makers such as Nvidia, AMD, and Intel have opted to incorporate HBM. Presently, Nvidia's A100 and H100 chips each boast up to 80 GB of HBM2e and HBM3. In its latest integrated CPU and GPU, the Grace Hopper Superchip, Nvidia expanded a single chip's HBM capacity by 20%, hitting a mark of 96 GB. AMD's MI300 also uses HBM3, with the MI300A capacity remaining at 128 GB like its predecessor, while the more advanced MI300X has ramped up to 192 GB, marking a 50% increase. Google is expected to broaden its partnership with Broadcom in late 2023 to produce the AISC AI accelerator chip TPU, which will also incorporate HBM memory, in order to extend AI infrastructure.

ASUS today announced ProArt Station PD500TE, an all-new tower PC meticulously designed to deliver seamless professional content creation. Powered by an up to 13th Generation Intel Core i9-13900 CPU and NVIDIA RTX A4000 graphics, plus support for NVIDIA GeForce RTX 4070 graphics cards, PD500TE delivers robust and stable performance for processor-intensive tasks like video editing and 3D modelling. This latest addition to the popular ProArt Station lineup also has a new thermal design for efficient, quieter cooling.

To maximize its creator-friendly credentials, PD500TE has undergone an extensive Independent Software Vendor (ISV) certification process to assure compatibility with leading creative tools. It also features customizable ASUS Lumiwiz LED indicators, a power-button shield to prevent accidental shutdowns, and even rendering-progress email notifications.

Mark Zuckerberg just announced Meta Quest 3, our next-generation virtual and mixed reality headset, which launches later this year. It features higher resolution, stronger performance, breakthrough Meta Reality technology, and a slimmer, more comfortable form factor. Quest 3 will ship in all countries where Meta Quest is currently supported this fall. The 128 GB headset starts at $499.99 USD, and we'll offer an additional storage option for those who want some extra space. Mark your calendars because we'll have lots more to share at Meta Connect, which returns this year on September 27.

Quest 3 is the supercharged all-in-one headset you've been waiting for—no wires required. Sign up to be the first to learn about Meta Quest 3.

Amazon today announced the new Fire Max 11—its biggest and most powerful tablet yet—that helps you stay entertained, connected, and productive. Featuring a brilliant 11-inch screen, a powerful octa-core processor, and 4 GB RAM, Fire Max 11 provides unrivaled value, performance, and fun and starts at just $229.99. A new optional magnetic attach keyboard and stylus enhance productivity and creativity to help you get more done—with a bundle starting at $329.99. Customers can pre-order Fire Max 11 and companion accessories starting today.

"Fire Max 11 is our most powerful tablet yet, with a beautiful screen and a sleek new design—it's built to help you have fun and get things done," said Kevin Keith, vice president of Amazon Devices. "The team has packed in an amazing number of premium features—a powerful octa-core processor, crystal-clear display, fingerprint recognition, superfast Wi-Fi 6 connectivity, 14 hour of battery life, support for great new accessories, and more—all at an incredible value. The new Fire Max 11 is proof you can get everything you need from a tablet without paying premium prices."

TrendForce reports that mass production of new server platforms—such as Intel Sapphire Rapids and AMD Genoa—is imminent. However, recent market reports have indicated a PMIC compatibility issue for server DDR5 RDIMMs; DRAM suppliers and PMIC vendors are working to address the problem. TrendForce believes this will have two effects: First, DRAM suppliers will temporarily procure more PMICs from Monolithic Power Systems (MPS), which supplies PMICs without any issues. Second, supply will inevitably be affected in the short term as current DDR5 server DRAM production still uses older processes, which will lead to a convergence in the price decline of DDR5 server DRAM in 2Q23—from the previously estimated 15~20% to 13~18%.

As previously mentioned, PMIC issues and the production process relying on older processes are all having a short-term impact on the supply of DDR5 server DRAM. SK hynix has gradually ramped up production and sales of 1α-nm, which, unlike 1y-nm, has yet to be fully verified by consumers. Current production processes are still being dominated by Samsung and SK hynix's 1y-nm and Micron's 1z-nm; 1α and 1β-nm production is projected to increase in 2H23.

Samsung Electronics America, the leader in advanced memory technology, today unveiled upgrades to its PRO Plus memory cards, designed for professional and enthusiast photographers, videographers, and content creators. The Samsung PRO Plus microSD and full-size SD cards boast increased read and write speeds of up to 180 MB/s and 130 MB/s, a 12 percent and 8 percent increase, respectively, over their predecessors.

Optimized for professional use, the new PRO Plus microSD and SD cards allow users to seamlessly capture 4K ultra-high definition (UHD) and Full HD (FHD) videos and photos. The cards also support a video speed class rating of V30, enabling professionals to quickly move large video files while editing. Available in capacities up to 512 GB, Samsung memory cards provide ample storage for up to 207,159 4K UHD photos or 30 hours of 4K UHD video.[1] Professionals need memory cards that make it easy to save and retrieve data, while also safeguarding their valuable images and video files. With the additional Samsung Card Reader supporting USB 3.0 and providing backward compatibility with USB 2.0, consumers can use Samsung memory cards on any device with a USB port.

Getac has today announced the expansion of its flagship X600 rugged mobile workstation range with the launch of the X600 Server and X600 Pro-PCI. The new models will sit alongside the recently launched X600 and X600 Pro, creating a comprehensive lineup of rugged mobile workstations that are purpose-built to meet the demands of professionals working in challenging industries, such as defence, manufacturing and oil & gas.

X600 Server: The fully rugged mobile server
The all-new Getac X600 Server delivers a powerful commercial off-the-shelf (COTS) rugged mobile server that can be folded to a slim profile for easy transportation.

During its CES 2023 keynote, AMD announced its latest Instinct MI300 APU, a first of its kind in the data center world. Combining the CPU, GPU, and memory elements into a single package eliminates latency imposed by long travel distances of data from CPU to memory and from CPU to GPU throughout the PCIe connector. In addition to solving some latency issues, less power is needed to move the data and provide greater efficiency. The Instinct MI300 features 24 Zen4 cores with simultaneous multi-threading enabled, CDNA3 GPU IP, and 128 GB of HBM3 memory on a single package. The memory bus is 8192-bit wide, providing unified memory access for CPU and GPU cores. CLX 3.0 is also supported, making cache-coherent interconnecting a reality.

The Instinct MI300 APU package is an engineering marvel of its own, with advanced chiplet techniques used. AMD managed to do 3D stacking and has nine 5 nm logic chiplets that are 3D stacked on top of four 6 nm chiplets with HBM surrounding it. All of this makes the transistor count go up to 146 billion, representing the sheer complexity of a such design. For performance figures, AMD provided a comparison to Instinct MI250X GPU. In raw AI performance, the MI300 features an 8x improvement over MI250X, while the performance-per-watt is "reduced" to a 5x increase. While we do not know what benchmark applications were used, there is a probability that some standard benchmarks like MLPerf were used. For availability, AMD targets the end of 2023, when the "El Capitan" exascale supercomputer will arrive using these Instinct MI300 APU accelerators. Pricing is unknown and will be unveiled to enterprise customers first around launch.

Client SSDs constituted a major driver of demand bit growth in the NAND Flash market for the past two years as the effects of the COVID-19 pandemic were spurring procurement activities related to working and studying from home. TrendForce currently projects that the attach rate of client SSDs among notebook computers will reach 92% in 2022 and around 96% in 2023. However, the demand surge related to the pandemic is subsiding, and the recent headwinds in the global economy have caused a demand freeze in the wider consumer electronics market. Hence, among the major application segments of the NAND Flash market, client SSDs are going to experience the most significant demand slowdown. This, in turn, will constrain demand bit growth as well. TrendForce projects that for the period from 2022 to 2025, the YoY growth rate of NAND Flash demand bits will remain below 30%.

The average NAND Flash content of client SSDs has already surpassed 500 GB this year. Quotes for 512 GB SSDs have fallen sharply and come to a level that is roughly comparable to the quotes that were given for 256 GB SSDs half-a-year ago. In fact, quotes for 512 GB SSDs are also near the level for HDDs with the same capacity. On the other hand, upgrading to 1 TB or higher for notebook SSDs could be challenging for PC OEMs mainly because the licensing fee for the Windows OS has a positive correlation with device specifications. Therefore, an increase in SSD capacity will raise the cost of a whole notebook computer. With PC OEMs being less keen on adopting SSDs that are 1 TB or higher, growth in the average NAND Flash content of client SSDs will also be more limited in the future.

ASUS, a global technology leader renowned for continuously reimagining today's technologies for tomorrow, today announced ExpertBook B6 Flip (B6602F)—the first Expert-series flippable mobile workstation.

This high-performance mobile workstation with its versatile 360° hinge is designed specifically to help architecture, engineering and construction (AEC) companies running industry-leading software solutions like 3ds Max, MicroStation, and Vectorworks. With immense power packed in a slim and flippable form, ExpertBook B6 Flip handles complex workloads seamlessly across AEC disciplines. It helps users bring design concepts to life through BIM software like ArchiCAD, effortlessly transition from 2D sketches to 3D modelling and printing via tools like Creo and Solidworks, and handle data-intensive applications for deeper insights and better decision-making—delivering the edge that AEC companies need in today's competitive market.

Apple today announced the next generation of Apple TV 4K—more powerful, entertaining, and affordable than ever, and offering impressive cinematic quality. Driven by the A15 Bionic chip that delivers faster performance and more fluid gameplay, the new Apple TV 4K features endless entertainment options for everyone to enjoy on the biggest screen in the home. HDR10+ support joins Dolby Vision on Apple TV 4K, so users can watch their favorite movies and TV shows in the best quality possible across more TVs. Running tvOS, the powerful and intuitive OS for the living room, and featuring the popular Siri Remote, Apple TV 4K simplifies the way users discover and enjoy their favorite content. Its seamless integration with other Apple devices and services magically transforms the living room in different ways for the entire family, while also adding convenience as a smart home hub.

The new Apple TV 4K is available in two configurations: Apple TV 4K (Wi-Fi), which offers 64 GB of storage; and Apple TV 4K (Wi-Fi + Ethernet), which offers support for Gigabit Ethernet for fast networking and streaming, Thread mesh networking protocol to connect even more smart home accessories, and twice the storage for apps and games (128 GB). Customers can order the new Apple TV 4K with Siri Remote today at a new starting price of $129, with availability beginning Friday, November 4.

Verizon, the Network America relies on, together with Razer, the leading global lifestyle brand for gamers, today unveiled the Razer Edge 5G, the ultimate 5G handheld gaming device during the keynote address of RazerCon 2022. This groundbreaking collaboration will bring to market the world's first dedicated 5G handheld console—equipped with the world's most advanced display of any gaming handheld, powered by the latest Snapdragon G3xFort Gen 1 Gaming Platform, and running on Verizon 5G Ultra Wideband, the 5G network for gaming. It is specifically engineered to provide the best gaming performance while on the go.

"The core concept of every product we put out always boils down to one thing, our 'For Gamers. By Gamers.' motto," said Richard Hashim, Head of Razer's Mobile & Console Division. "With the Razer Edge, we've created the ultimate handheld gaming platform. Together with Verizon and Qualcomm, we designed the Razer Edge 5G to be a true gamer device, capable of supporting gamers' entire catalogs of AAA games or allowing them to stream endlessly online, taking their gaming experience on the go with low latency."

ASUS, a global technology leader renowned for continuously reimagining today's technologies for tomorrow, today announced a new Expert series desktop model, the ExpertCenter D7 SFF (D700SD).

The ExpertCenter D7 SFF is designed for long-term use, giving business users in financial, retail, manufacturing, creative fields, and other industries a durable solution. It's designed to suit growing business needs with tool-free expansion, making this model an investment that can evolve with a business. The case is rotatable and can be fully opened for convenient maintenance and upgrades, with side panels on the chassis that are easily removed without a screwdriver, and a 3.5-inch HDD tool-free tray that enables users to quickly replace or upgrade hard drives.

Apple today introduced iPhone 14 and iPhone 14 Plus, featuring two sizes—6.1 inches and 6.7 inches—in a sophisticated design with impressive camera upgrades and groundbreaking new safety capabilities. iPhone 14 and iPhone 14 Plus take stunning photos and video with a powerful camera system featuring new Main and front TrueDepth cameras, the Ultra Wide camera for unique perspectives, and Photonic Engine—an enhanced image pipeline. Both models include the A15 Bionic chip with a 5-core GPU, which offers incredible performance and efficiency for demanding workloads, and is designed with privacy and security built in. iPhone 14 and iPhone 14 Plus introduce critical safety capabilities such as Crash Detection and Emergency SOS via satellite, a first in the industry. And with amazing battery life, industry-leading durability features, and super-fast 5G, this iPhone lineup is more advanced than ever before. iPhone 14 and iPhone 14 Plus will be available in midnight, blue, starlight, purple, and (PRODUCT)RED finishes. Pre-orders begin Friday, September 9, with availability for iPhone 14 beginning Friday, September 16, and availability for iPhone 14 Plus beginning Friday, October 7.

"Our customers rely on their iPhone every day, and iPhone 14 and iPhone 14 Plus introduce groundbreaking new technologies and important safety capabilities. With the new, larger 6.7-inch display on iPhone 14 Plus, users can enjoy more content onscreen when browsing the web and even more text," said Greg Joswiak, Apple's senior vice president of Worldwide Marketing. "Both phones have a powerful new Main camera with a huge leap in low-light performance, advanced connectivity capabilities with 5G and eSIM, and the incredible performance of A15 Bionic, which helps enable even better battery life. All of this, tightly integrated with iOS 16, makes iPhone more essential than ever."

Apple today announced iPhone 14 Pro and iPhone 14 Pro Max, the most advanced Pro lineup ever, featuring the Dynamic Island—a new design that introduces an intuitive way to experience iPhone—and the Always-On display. Powered by A16 Bionic, the fastest chip ever in a smartphone, iPhone 14 Pro introduces a new class of pro camera system, with the first-ever 48MP Main camera on iPhone featuring a quad-pixel sensor, and Photonic Engine, an enhanced image pipeline that dramatically improves low-light photos. These groundbreaking advancements make iPhone even more indispensable for everyday tasks, creative projects, and now even emergency situations with features such as Emergency SOS via satellite and Crash Detection. iPhone 14 Pro and iPhone 14 Pro Max will be available in four gorgeous new finishes: deep purple, silver, gold, and space black. Pre-orders begin Friday, September 9, with availability beginning Friday, September 16.

"Our customers count on their iPhone every day, and with iPhone 14 Pro and iPhone 14 Pro Max, we're delivering more advancements than any other iPhone. iPhone 14 Pro introduces a camera system that empowers every user—from the casual user to the professional—to take their best photos and video, and innovative new technologies like the Always-On display and the Dynamic Island, which offers new interactions for notifications and activities," said Greg Joswiak, Apple's senior vice president of Worldwide Marketing. "Groundbreaking safety capabilities bring users even more security, offering help when they need it most. And with the incredibly powerful and efficient A16 Bionic chip and all-day battery life, this is the best iPhone yet."

Sony Electronics Inc. today introduced two new premium music players, the NW-WM1ZM2 and NW-WM1AM2, raising the bar to new heights in high-resolution audio listening, to satisfy the most demanding audiophiles. Designed to immerse the listener in sublime, nuanced sound, the NW-WM1ZM2 has been fine-tuned from years of audio mastery and crafted from the very best materials. This new addition sets a new benchmark for Sony's award-winning signature series, offering an exquisite listening experience in an ultra-premium design.

The NW-WM1AM2 allows music lovers to completely lose themselves in high-quality audio with a richer, smoother and more expansive sound field compared to its predecessor. Both music players let the user download and stream from endless catalogues of music with Wi-Fi compatibility, taking the listening enjoyment to the next level.

Every once in a while, a really odd product pops up and Verbatim's new write once SSD is such a product at first glance. The product is called SWOVA128G and the model name gives away that it's a 128 GB drive. As it's an external drive, it connects via USB-C 3.2 Gen 1, which is technically a regular old USB 3.0 port. Considering the read speed is a mere 540 MB/s this isn't going to hamper the performance. The write speed is a mere 180 MB/s, although don't expect to be storing data to this SSD using just any device, as Verbatim requires a full-fat version of Windows 10 or 11 running on an x86/x64 based CPU, with Microsoft's.NET Framework 4.8 or later installed.

Verbatim provides a custom piece of software for writing data to the SSD, although the company hasn't provided any screenshots of said software, so it's unclear as to what it looks like. The idea behind the SWOVA128G is for it to be used in place of optical media in situations where copies of data have to be made, but where it can't be changed at a later point in time. According to Verbatim this includes things like company ledgers and electronic bookkeeping, backup and offline storage of confidential data and for things like disc images. Once the data has been stored on the SSD, it can be read by any device that supports exFAT. Although Verbatim provides a 10 year warranty, they don't guarantee the data retention. The company didn't release any pricing.

Last week the first details of Dell's CAMM (Compression Attached Memory Module) made an early appearance courtesy of a product leak, but now official details have appeared and the good news is that Dell is saying it won't be a proprietary solution. The Compression Connector looks unlike anything used by consumer computers today and Dell is said to be hoping that it'll be the next industry standard for memory modules, according to PCWorld. The interposer mentioned in the previous news article is also mentioned and allows for a pair of DDR5 SO-DIMMs to be used, albeit with a much taller Z-height.

Dell is apparently planning on getting its CAMM approved by the JEDEC, which is the standards organisation when it comes to memory. However, even if the CAMM format is accepted as a JEDEC standard, Dell holds patents and is likely to charge some kind of royalty fees to interested parties. That said, if it becomes a JEDEC standard, Dell has to follow RAND or Reasonable and Non-Discretionary terms, so the royalty fees would have to be reasonable for JEDEC to agree on making CAMM a standard. The main benefit of Dell's CAMM is that the memory traces end up being shorter and more direct, since the CAMM has a single-sided interface, whereas SO-DIMMs are interfaced on both sides, just like standard DIMMs. This would allow for higher speed memory interfaces, without the need of using something like signal re-drivers or re-timers.

A leak with details about upcoming Dell notebooks has revealed that Dell's upcoming notebooks with DDR5 memory will feature a custom memory module that Dell calls CAMM, or Compression Attached Memory Module. The CAMM can support up to 128 GB RAM according to the leak and initial modules will support memory speeds of 4800 MHz. It's unclear if notebooks with CAMM support will have soldered down memory as well, but what is clear is that Dell is not looking at using traditional SO-DIMM type modules.

The first notebooks from Dell to feature the new module appears to be the Precision 7-series, which will also feature an Intel 55 W Alder Lake-HX series CPU, a choice of an NVIDIA RTX A5000 GPU or Intel Arc DG2 based graphics with a 90 W TDP, as well as up to 12 TB of NVMe storage over PCIe 4.0. Apparently Dell has developed what it calls DGFF or Dell Graphics Form Factor for these laptops, which suggests that they'll feature some kind of modular graphics solution. Considering that at least some models in Precision 7-series will sport 16-inch displays, there should be plenty of space for a GPU module, although it'll be interesting to see exactly what Dell is bringing to the table that's new here.

ASRock Industrial launches a new range of industrial motherboards powered by 12th Gen Intel Core Processors (Alder Lake-S) with up to 16 cores and 24 threads, supporting the new Intel 600 Series W680, Q670, and H610 chipsets. Featuring high computing power with performance hybrid architecture and enhanced AI capabilities, rich IOs and expansions for up to quad displays 4K@60 Hz, USB 3.2 Gen2x2 (20 Gbit/s), triple Intel 2.5 GbE LANs with real-time TSN, multi M.2 Key M, ECC memory, plus TPM 2.0, and wide voltage support. The new series covers comprehensive form factors, including industrial Mini-ITX, Micro-ATX, and ATX motherboards for diverse applications, such as factory automation, kiosks, digital signage, smart cities, medical, and Edge AIoT applications.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, unveils the brand new B660MX-E PRO motherboard. Based on the Intel B660 chipset, the new B660MX-E PRO motherboard brings life to casual gaming and content consumption. Available with a set of great base features and functionality, BIOSTAR's B660MX-E PRO motherboard is one of the best entry-level motherboards in the market.

With solid support for Intel 12th generation processors, the B660MX-E PRO motherboard brings highly desirable features like PCIe 4.0, PCIe M.2.4.0 and Wi-Fi 6E enable versatile usability all around. 4 DIMMs of DDR4 high speed ram slots enable up to 128 GB DDR4 memory with boosted clock speeds up to 4600 MHz. A 10-phase power design controlled with BIOSTAR's signature digital PWM technology ensures stable power delivery across all components that protect and enhance hardware lifetime.

Leading global memory provider TEAMGROUP has been actively expanding in the industrial control field for many years. With the arrival of the new DDR5 generation, the company today announced the DDR5 ECC DIMM and DDR5 R-DIMM Industrial Server Memory modules. In recent years, there has been a steady growth in AI and HPC data applications, driving memory specifications toward higher capacities and greater performance. To meet this rising demand, TEAMGROUP has created multiple solutions with its latest innovations of DDR5 industrial server memory.

Its next-gen server memory modules can reach speeds of 6,400 MT/s, come with a maximum capacity of up to 128 GB, and operate at 1.1 V, resulting in lower overall power consumption. The memory also features two innovations in its power supply architecture and channel architecture. The new power supply architecture shifts power management from the motherboard to the DIMM itself, enhancing signal integrity and resistance to interference. The channel architecture is updated with two independent sub-channels per memory module (DIMM) to significantly improve memory access efficiency and meet the elevated demands of smart platform applications.

Chinese company Jiahe Jinwei owns a sub-brand of gaming-oriented products named after Norse mythology - Asgard. The company has now announced that the trial production for high-speed DDR5 modules using Micron's semiconductors has completed without issue, meaning that their roadmap is going through without a hitch. Of course, as with the introduction of any new DDR memory standard, operating frequencies are still in their nascent stage; Asgard currently is only offering 4,800 MHz DDR5 sticks, which the most premium DDR4 sticks can already surpass.

It's only a matter of time before DDR5 speeds accelerate however, and Asgard is already planning to launch 5600 MHz DDR5 kits as early as 2022. These should be available in 32 GB and 128 GB capacities with a CAS latency of 46 cycles. The next step in performance increase would look towards 6,400 MHz kits, but these should only be expected towards the end of 2022 and beginning of 2023, should the development continue to move along smoothly. All of the DDR5 memory speeds should still make do with a relatively puny 1.1 V.

As the industry is preparing for a shift to the new DDR standard, companies are trying to adopt the new technology and many companies are manufacturing the latest DDR5 memory modules. One of them is Shenzhen Longsys Electronics Co. Ltd, a Chinese manufacturer of memory chips, which has today demonstrated the power of DDR5 technology. Starting with this year, client platforms are expected to make a transition to the new standard, with the data center/server platform following. Using Intel's yet unreleased Alder Lake-S client platform, Longsys has been able to test its DDR5 DIMMs running at an amazing 6400 MHz speed and the company got some very interesting results.

Longsys has demoed a DDR5 module with 32 GB capacity, CAS Latency (CL) of 40 CL, operating voltage of 1.1 V, and memory modules clocked at 6400 MHz. With this being an impressive memory module, this is not the peak of DDR5. According to JEDEC specification, DDR5 will come with up to 8400 MHz speeds and capacities that are up to 128 GB per DIMM. Longsys has run some benchmarks, using an 8-core Alder Lake CPU, in AIDA64 and Ludashi. The company then proceeded to compare these results with DDR4-3200 MHz CL22 memory, which Longsys also manufactures. And the results? In AIDA64 tests, the new DDR5 module is faster anywhere from 12-36%, with the only regression seen in latency, where DDR5 is doubling it. In synthetic Ludashi Master Lu benchmark, the new DDR5 was spotted running 112% faster. Of course, these benchmarks, which you can check out here, are provided by the manufacturer, so you must take them with a grain of salt.