Prince of Persia: The Lost Crown is beckoning players back to Mount Qaf starting on March 20, when a free content update will bring new modes and other content to the critically acclaimed, Metroidvania-inspired action-adventure. More updates will follow in spring, summer, and beyond, introducing more modes, challenges, and paid story-driven DLC.

The March 20 update, titled Warrior's Path, will add speedrun and permadeath modes, as well as four new outfits for Sargon. Later this spring, it'll be followed by the Boss Attack update, which adds a boss rush challenge in addition to more outfits. The Divine Trials update will follow this summer, adding new combat, platform, and puzzle challenges, along with new Amulets, outfits, and more. The new storyline will debut later this year as paid DLC, and will introduce new environments and enemies for Sargon to confront.

Prince of Persia: The Lost Crown is out now on Nintendo Switch, Sony PlayStation 4|5, Xbox Series X|S, Xbox One, PC (via Epic Games Store & the Ubisoft Store), and Amazon Luna. An all-new adventure set in a milieu of Persian mythology and history, Prince of Persia: The Lost Crown is a 2.5D action-adventure that casts players as Sargon, youngest member of the elite, superhero-like Immortals. Armed with acrobatic combat skills and an ever-growing arsenal of time powers, Sargon explores the mythical Mount Qaf in search of the kidnapped Prince Ghassan, and gradually unravels the dark secret at the heart of the mountain's time curse.

Inspired by Metroidvanias, Prince of Persia: The Lost Crown invites players to explore a vast citadel complex and its outlying biomes, including forests, caves, snowy peaks, and much more. Developed by Ubisoft Montpellier - the studio that also produced Rayman Origins and Rayman Legends - the game builds on the ultra-responsive, highly varied platforming action that the Rayman games established - as well as their tradition of spike- and trap-filled pathways that sometimes leave little room for error. Demanding quick reflexes, it delivers performance to match, with all platforms targeting at least 60 frames per second.

Prince of Persia: The Lost Crown launches tomorrow, January 18, for modern consoles and PC, and is available now with a Ubisoft+ subscription or for purchasers of the Digital Deluxe Edition. Prince of Persia: The Lost Crown is an adventure inspired by Persian mythology and the Metroidvania genre, in which players step into the boots of Sargon - the youngest member of Persia's most elite warriors, the Immortals - and brave the dangers of the mysterious Mount Qaf on a journey to save the kidnapped Prince Ghassan. Wielding acrobatic parkour abilities, mystical time powers, and fluid, combo-driven sword skills, Sargon discovers a world shattered by a time curse, where he'll battle sand zombies, screen-filling monsters, and even alternate versions of himself.

Prince of Persia: The Lost Crown was developed by Ubisoft Montpellier, the studio behind Rayman Origins and Rayman Legends - and some of those games' DNA persists in Sargon's adventure, particularly when it comes to platforming. Like Rayman and crew, Sargon has a certain rhythm and bounce to his movements that helps make exploration a blast, and a lot of his time is spent navigating deviously designed platforming sequences that dare players to thread their way through gauntlets of spikes and traps with increasingly less room for error. To find out more about this connection, and how Ubisoft Montpellier's experience on the Rayman games helped shape Prince of Persia: The Lost Crown, we spoke with Game Director Mounir Radi.

According to the report from a journal called Fundamental Research, researchers from the Institute of Computing Technology at the Chinese Academy of Sciences have developed a 256-core multi-chiplet processor called Zhejiang Big Chip, with plans to scale up to 1,600 cores by utilizing an entire wafer. As transistor density gains slow, alternatives like multi-chiplet architectures become crucial for continued performance growth. The Zhejiang chip combines 16 chiplets, each holding 16 RISC-V cores, interconnected via network-on-chip. This design can theoretically expand to 100 chiplets and 1,600 cores on an advanced 2.5D packaging interposer. While multi-chiplet is common today, using the whole wafer for one system would match Cerebras' breakthrough approach. Built on 22 nm process technology, the researchers cite exascale supercomputing as an ideal application for massively parallel multi-chiplet architectures.

Careful software optimization is required to balance workloads across the system hierarchy. Integrating near-memory processing and 3D stacking could further optimize efficiency. The paper explores lithography and packaging limits, proposing hierarchical chiplet systems as a flexible path to future computing scale. While yield and cooling challenges need further work, the 256-core foundation demonstrates the potential of modular designs as an alternative to monolithic integration. China's focus mirrors multiple initiatives from American giants like AMD and Intel for data center CPUs. But national semiconductor ambitions add urgency to prove domestically designed solutions can rival foreign innovation. Although performance details are unclear, the rapid progress shows promise in mastering modular chip integration. Combined with improving domestic nodes like the 7 nm one from SMIC, China could easily create a viable Exascale system in-house.

Prince of Persia: The Lost Crown is a fast-paced action-adventure that challenges players with a wide variety of lethal monsters and traps, most of which take speed and precision to conquer—which means that smooth, responsive performance is especially important. To that end, Sargon's adventure through Mount Qaf will target at least 60 frames per second on all platforms when it launches on January 18 (or on January 15 for Ubisoft+ subscribers and owners of the Digital Deluxe Edition), whether you're playing on PC, Nintendo Switch, PlayStation 5, PlayStation 4, Xbox Series X|S, Xbox One, or Amazon Luna. First, let's take a look at the PC specs below.

The Story of Prince of Persia: The Lost Crown
Sargon, trained as a weapon to serve Persia, is on a mission to save its heir to the throne, Prince Ghassan. This perilous journey is sending him to Mount Qaf, where time no longer flows swift and sure in one direction. Sargon along with the other Immortals head to Mount Qaf to save the Prince, but it doesn't take long before he finds himself splitting paths, with some of the Immortals on a conflicting trajectory. Maybe that's because time seems to be mysteriously intertwined here and sometimes the past can happen after the present. No matter the cost, Sargon continues to strive when all odds are against him, gaining strength along the way.

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced that the Rambus HBM3 Memory Controller IP now delivers up to 9.6 Gigabits per second (Gbps) performance supporting the continued evolution of the HBM3 standard. With a 50% increase over the HBM3 Gen 1 data rate of 6.4 Gbps, the Rambus HBM3 Memory Controller can enable a total memory throughput of over 1.2 Terabytes per second (TB/s) for training of recommender systems, generative AI and other demanding data center workloads.

"HBM3 is the memory of choice for AI/ML training, with large language models requiring the constant advancement of high-performance memory technologies," said Neeraj Paliwal, general manager of Silicon IP at Rambus. "Thanks to Rambus innovation and engineering excellence, we're delivering the industry's leading-edge performance of 9.6 Gbps in our HBM3 Memory Controller IP."

Zero ASIC, a semiconductor startup, came out of stealth today to announce early access to its one-of-a-kind ChipMaker platform, demonstrating a number of world firsts:

• 3D chiplet composability enabling billions of new silicon products
• Fully automated no-code chiplet-based chip design
• Zero install interactive RTL-based chip emulation
• Roadmap to 100X reduction in chip development costs

"Custom Application Specific Integrated Circuits (ASICs) offer 10-100X cost and energy advantage over commercial off the shelf (COTS) devices, but the enormous development cost makes ASICs non-viable for most applications," said Andreas Olofsson, CEO and founder of Zero ASIC. "To build the next wave of world changing silicon devices, we need to reduce the barrier to ASICs by orders of magnitude. Our mission at Zero ASIC is to make ordering an ASIC as easy as ordering catalog parts from an electronics distributor."

Hotel Barcelona is the long-awaited collaboration between game design legends Swery65 and Suda51, and our Xbox Digital Broadcast brought us a never-before-seen gameplay trailer from the self-styled "2.5D slasher film parodic action" game. Drawing influences from across horror's history, you'll be pitted against everything from alien entities to AI-enhanced sharks, all while stuck in an endless time loop filled with serial killers - and only your deceased past selves to help you.

Both Swery and Suda appeared in the show to discuss the game. Swery discussed the game's unusual beginnings - with Suda asking him to announce a collaboration on the fly, with no prior discussion - and his inspirations from Stanley Kubrick's 'The Shining'. Suda explained that he and Swery worked on the initial concept together - "Then, all of a sudden, Swery completed tons of work on the development, and Hotel Barcelona materialized. Most of the time, when someone does lip service like that, the project never materializes… But Swery made this project a reality in order to deliver something to the fans."

We know a lot of you are pretty excited to play Star Ocean: The Second Story R. After all, the original game is a true classic of the RPG genre and this new remake improves it even further! It adds a beautiful new 2.5D art style, a revamped combat system, a rearranged soundtrack, new illustrations and a galaxy's-worth of quality of life improvements. To cut a long story short, this crown jewel of the Star Ocean series now sparkles even brighter than before! The game releases on November 2, 2023 for Nintendo Switch, PS5, PS4 and PC via Steam… but what if you want to play it earlier? Good news then because a free demo is available right now! Read on and we'll tell you all about it:

What's in the STAR OCEAN THE SECOND STORY R demo?
The free demo lets you experience this interstellar adventure for three hours or until you make your way to the exit of Krosse Cave - whichever comes first. In that time, you'll get to see how the story gets underway as Pangalactic Federation officer Claude C. Kenny is transported to a mysterious location by an equally mysterious mechanism. Around that time, a local named Rena, is attacked by a monster in the Sacred Forest. Claude jumps into action and saves her, but his advanced technology means Rena mistakes him for a hero of myths from her homeland. She hopes he can save her nation, while he wants to find a way back home. Together, they set off for the village of Arlia… and an epic adventure begins.

Micron Technology, Inc. today announced it has begun sampling the industry's first 8-high 24 GB HBM3 Gen2 memory with bandwidth greater than 1.2 TB/s and pin speed over 9.2 Gb/s, which is up to a 50% improvement over currently shipping HBM3 solutions. With a 2.5 times performance per watt improvement over previous generations, Micron's HBM3 Gen2 offering sets new records for the critical artificial intelligence (AI) data center metrics of performance, capacity and power efficiency. These Micron improvements reduce training times of large language models like GPT-4 and beyond, deliver efficient infrastructure use for AI inference and provide superior total cost of ownership (TCO).

The foundation of Micron's high-bandwidth memory (HBM) solution is Micron's industry-leading 1β (1-beta) DRAM process node, which allows a 24Gb DRAM die to be assembled into an 8-high cube within an industry-standard package dimension. Moreover, Micron's 12-high stack with 36 GB capacity will begin sampling in the first quarter of calendar 2024. Micron provides 50% more capacity for a given stack height compared to existing competitive solutions. Micron's HBM3 Gen2 performance-to-power ratio and pin speed improvements are critical for managing the extreme power demands of today's AI data centers. The improved power efficiency is possible because of Micron advancements such as doubling of the through-silicon vias (TSVs) over competitive HBM3 offerings, thermal impedance reduction through a five-time increase in metal density, and an energy-efficient data path design.

Glorious battles, shining armor, a sharp sword, and a trusty shield: That's the stuff that heroes are made of! Become a hero yourself when Trine 5: A Clockwork Conspiracy releases on August 31st, 2023 on PC, PlayStation 4, PlayStation 5, Xbox One, Xbox Series S/X, and Nintendo Switch! For now, meet Pontius the Knight, Protector of the Realm and also the biggest pie lover the land has ever seen! A real frontline hero who is always going head first into battle to protect his friends. Watch the new trailer for magical co-op adventure Trine 5: A Clockwork Conspiracy below.

Your sword and shield will aid you on your journey - if you know how to use them! As a skilled knight and professional pie eater, Pontius can use his sword to fight off enemies, get rid of obstacles, and even use it as a platform to help him reach higher areas. The shield, not only made to protect, will come in handy to reflect light, skate across water, and even use as a glider! Charge, smash, fight, and puzzle-solve your way through the dangers that await with your fellow adventurers. And should you need further help, the Prismatic Talisman will be your best friend - literally. Clones can be useful!

According to news out of Korea, NVIDIA is considering Samsung as a partner not only for HBM3 memory, but also as a potential partner when it comes to 2.5D chip packaging. The latter is due to TSMC having limited capacity when it comes to handling all of its customers advanced chip packaging needs, although Samsung is apparently not the only potential partner NVIDIA is looking at. Taiwan based SPIL and US based Amkor Technology are two alternative candidates for the 2.5D chip packaging according to the Elec.

As far as HBM3 memory goes, NVIDIA doesn't have as many potential options, with SK Hynix being its current partner, who NVIDIA will continue to work with when it comes to HBM memory for its high-end AI accelerators and GPUs. It's likely that Samsung is trying to win NVIDIA back as a foundry customer, by proving that it's capable of handling the chip packaging for NVIDIA. Samsung will likely use its I-Cube 2.5D packaging technology and the Elec suggests that Samsung would still be using TSMC made GPU wafers which will be mated with Samsung HMB3 memory. Samsung has as yet not started its mass production of HMB3 memory, but have sampled customers with evaluation samples that are said to have received very positive feedback. For now, nothing has been agreed and TSMC is, as we know, looking to expand its 2.5D packaging business by over 40 percent, but the question is how quickly TSMC can move before its customers consider other competitors.

Every STAR OCEAN fan has their favorite game in the series, but if you asked them all at once, we'd wager that one game in particular grabbed hearts and minds: STAR OCEAN THE SECOND STORY. Widely considered one of the crown jewels of the series, this beloved RPG is being completely remade for Nintendo Switch, PS5, PS4 and PC (Steam) as STAR OCEAN THE SECOND STORY R.

Set to release November 2, 2023, It features a stunning new 2.5D visual style, a revamped battle system and quality of life improvements galore, while retaining everything that made that original adventure so beloved. If you've never played the original game, or even the STAR OCEAN series before, you are in for a true treat… and if you're a longtime fan, get ready to experience this classic adventure in a bold new way. Read on and we'll go into much more detail about what you can expect from the game.

Hello once again, friends of Lana and Mui! As we're here on launch day we finally get to share our off-earth odyssey with all you patient fans (Today! Tuesday, 23rd of May), we thought we'd drop a little summary post of what you can expect from the game we've worked so hard on for 6 years.

While we're feeling extremely proud of the final result, and confident that you'll have a great time exploring Novo with Lana and Mui, we think it's always a good idea to lay out the features of the game in black and white, so you know what to expect before spending your hard-earned money!

SUPER BOMBERMAN R 2 release date confirmed! SBR2 physical launch on SEPT. 12, digital launch on SEPT. 13, 2023! SBR2 is the perfect way to mark the Bomberman series' 40th anniversary this year. Pre-orders are open NOW! The latest title of the party battle games series SUPER BOMBERMAN R! With new adventures and game modes, it has the largest content volume in the series' history! The game features not only offline battles that can be played with family and friends, but also online battles that connect players from all over the world, as well as a single player mode.

In addition to the well-known "Standard", "Grand Prix" and "Battle 64" a new battle mode called "Castle" in which players are divided into Attack side and Castle side to battle for the treasure! A "Stage Editor" function has also been added, allowing players to create their own stages for "Castle" and share them online with players around the globe.

What do a Wizard, a Thief, and a Knight have in Common? Trine 5: A Clockwork Conspiracy will take Amadeus the Wizard, Zoya the Thief, and Pontius the Knight on their most action-packed journey in their fifth outing - and is set to to become the best Trine game of the series! Puzzles will change difficulty according to the number of players, the game also offers a skill quest system, and new tactical multi-phase boss fights!

This 2.5D puzzle-platforming game full of adventures is set in a fantastical fairytale world, offering players twenty beautifully designed levels to explore, from glistening gemstone caverns to perilous underwater passageways. But beware, the three Heroes are pitted against dastardly and duplicitous villains, who will stop at nothing to seize control of the kingdom!

Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium, the industry Consortium dedicated to advancing UCIe technology. This open industry standard defines interconnect between chiplets within a package, enabling an open chiplet ecosystem and facilitating the development of advanced 2.5D/3D devices.

A leader in high-performance memory ICs, Winbond is an established supplier of known good die (KGD) needed to assure end-of-line yield in 2.5D/3D assembly. 2.5D/3D multichip devices are needed to realize the exponential improvements in performance, power efficiency, and miniaturization, demanded by the explosion of technologies such as 5G, Automotive, and Artificial Intelligence (AI).

Samsung Electronics, a world leader in advanced semiconductor technology, announced today a strengthened business strategy for its Foundry Business with the introduction of cutting-edge technologies at its annual Samsung Foundry Forum event. With significant market growth in high-performance computing (HPC), artificial intelligence (AI), 5/6G connectivity and automotive applications, demand for advanced semiconductors has increased dramatically, making innovation in semiconductor process technology critical to the business success of foundry customers. To that end, Samsung highlighted its commitment to bringing its most advanced process technology, 1.4-nanometer (nm), for mass production in 2027.

During the event, Samsung also outlined steps its Foundry Business is taking in order to meet customers' needs, including: foundry process technology innovation, process technology optimization for each specific applications, stable production capabilities, and customized services for customers. "The technology development goal down to 1.4 nm and foundry platforms specialized for each application, together with stable supply through consistent investment are all part of Samsung's strategies to secure customers' trust and support their success," said Dr. Si-young Choi, president and head of Foundry Business at Samsung Electronics. "Realizing every customer's innovations with our partners has been at the core of our foundry service."

The Exascale supercomputing race is now well underway, as the US-based Frontier supercomputer got delivered, and now we wait to see the remaining systems join the race. Today, during 79th HPC User Forum at Oak Ridge National Laboratory (ORNL), Terri Quinn at Lawrence Livermore National Laboratory (LLNL) delivered a few insights into what El Capitan exascale machine will look like. And it seems like the new powerhouse will be based on AMD's Instinct MI300 APU. LLNL targets peak performance of over two exaFLOPs and a sustained performance of more than one exaFLOP, under 40 megawatts of power. This should require a very dense and efficient computing solution, just like the MI300 APU is.

As a reminder, the AMD Instinct MI300 is an APU that combines Zen 4 x86-64 CPU cores, CDNA3 compute-oriented graphics, large cache structures, and HBM memory used as DRAM on a single package. This is achieved using a multi-chip module design with 2.5D and 3D chiplet integration using Infinity architecture. The system will essentially utilize thousands of these APUs to become one large Linux cluster. It is slated for installation in 2023, with an operating lifespan from 2024 to 2030.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and network products that require high-performance and large-area packaging technology.

"H-Cube solution, which is jointly developed with Samsung Electro-mechanics (SEMCO) and Amkor Technology, is suited to high-performance semiconductors that need to integrate a large number of silicon dies," said Moonsoo Kang, senior vice president and Head of Foundry Market Strategy Team at Samsung Electronics. "By expanding and enriching the foundry ecosystem, we will provide various package solutions to find a breakthrough in the challenges our customers are facing."

Synopsys, Inc. today announced the industry's first complete HBM3 IP solution, including controller, PHY, and verification IP for 2.5D multi-die package systems. HBM3 technology helps designers meet essential high-bandwidth and low-power memory requirements for system-on-chip (SoC) designs targeting high-performance computing, AI and graphics applications. Synopsys' DesignWare HBM3 Controller and PHY IP, built on silicon-proven HBM2E IP, leverage Synopsys' interposer expertise to provide a low-risk solution that enables high memory bandwidth at up to 921 GB/s.

The Synopsys verification solution, including Verification IP with built-in coverage and verification plans, off-the-shelf HBM3 memory models for ZeBu emulation, and HAPS prototyping system, accelerates verification from HBM3 IP to SoCs. To accelerate development of HBM3 system designs, Synopsys' 3DIC Compiler multi-die design platform provides a fully integrated architectural exploration, implementation and system-level analysis solution.

AMD is in a constant process of processor development, and there are always new technologies on the horizon. Back in March of 2020, the company has revealed that it is working on new X3D packaging technology, that integrated both 2.5D and 3D approaches to packing semiconductor dies together as tightly as possible. Today, we are finally getting some more information about the X3D technology, as we have the first codename of the processor that is featuring this advanced packaging technology. According to David Schor, we have learned that AMD is working on a CPU that uses X3D tech with stacked dies, and it is called Milan-X.

The Milan-X CPU is AMD's upcoming product designed for data center usage. The rumors suggest that the CPU is designed for heavy bandwidth and presumably a lot of computing power. According to ExecutableFix, the CPU uses a Genesis-IO die to power the connectivity, which is an IO die from EPYC Zen 3 processors. While this solution is in the works, we don't know the exact launch date of the processor. However, we could hear more about it in AMD's virtual keynote at Computex 2021. For now, take this rumor with a grain of salt.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the immediate availability of its next-generation 2.5D packaging technology Interposer-Cube4 (I-Cube4), leading the evolution of chip packaging technology once again. Samsung's I-CubeTM is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, etc.) and several High Bandwidth Memory (HBM) dies on top of a silicon interposer, making multiple dies operate as a single chip in one package.

Samsung's new I-Cube4, which incorporates four HBMs and one logic die, was developed in March as the successor of I-Cube2. From high-performance computing (HPC) to AI, 5G, cloud and large data center applications, I-Cube4 is expected to bring another level of fast communication and power efficiency between logic and memory through heterogeneous integration.