According to the latest report from Bloomberg, the US government under Joe Biden's administration has announced plans to provide Taiwan Semiconductor Manufacturing Company (TSMC) with a substantial financial support package worth $11.6 billion. The package is composed of $6.6 billion in grants and up to $5 billion in loans. This represents the most significant financial assistance approved under the CHIPS and Science Act, a key initiative to resurrect the US chip industry. The funding will aid TSMC in establishing three cutting-edge semiconductor production facilities in Arizona, with the company's total investment in the state expected to exceed an impressive $65 billion. TSMC's multi-phase Arizona project will commence with the construction of a fab module near its existing Fab 21 facility. Production using 4 nm and 5 nm process nodes is slated to begin by early 2025. The second phase, scheduled for 2028, will focus on even more advanced 2 nm and 3 nm technologies.

TSMC has kept details about the third facility's production timeline and process node under wraps. The company's massive investment in Arizona is expected to profoundly impact the local economy, creating 6,000 high-tech manufacturing jobs and over 20,000 construction positions. Moreover, $50 million has been earmarked for training local workers, which aligns with President Joe Biden's goal of bolstering domestic manufacturing and technological independence. However, TSMC's Arizona projects have encountered obstacles, including labor disputes and uncertainties regarding government support, resulting in delays for the second facility's production timeline. Additionally, reports suggest that at least one TSMC supplier has abandoned plans to set up operations in Arizona due to workforce-related challenges.

Construction of Intel's New Albany, Ohio fabrication site started back in late 2022—since then, a series of setbacks have caused anticipated timelines to slip. Team Blue's original plans included a 2025 opening ceremony—last month, this was amended to late 2026 or early 2027. New equipment deliveries have been affected by extreme weather conditions—Intel appears to be shoring up its flood prevention systems at their Licking County location. Ohio's Department of Development received a progress report at the start of this month, authored by Team Blue staffers—revised figures indicate that Fabrication sites 1 and 2 are expected to reach operational status somewhere within "2027-2028."

Jim Evers (Intel's Ohio Site Manager) stated: "we are making great progress growing the Silicon Heartland. In addition to the approximately $1.5 billion investment in completed spends through 12/31/23 referenced in the report, Intel has an additional $3 billion in contractually committed spends underway, totaling $4.5 billion committed toward our Ohio One projects." Intel committed a hefty $20 billion greenfield investment into the two Ohio wafer fab sites, but the latest progress report indicates that just under a quarter of that budget has trickled out of company coffers (so far). Evers's statement continued: "this investment is growing every day as we work to establish a new manufacturing campus to build leading-edge semiconductor chips right here in Ohio." A Tom's Hardware report reminds us about Team Blue's New Albany project receiving "over $2 billion in incentives." Industry rumors posit that the US government is readying a multi-billion dollar grant for Intel's Arizona facility.

Canalys' latest forecast predicts that an estimated 48 million AI-capable PCs will ship worldwide in 2024, representing 18% of total PC shipments. But this is just the start of a major market transition, with AI-capable PC shipments projected to surpass 100 million in 2025, 40% of all PC shipments. In 2028, Canalys expects vendors to ship 205 million AI-capable PCs, representing a staggering compound annual growth rate of 44% between 2024 and 2028.

These PCs, integrating dedicated AI accelerators, such as Neural Processing Units (NPUs), will unlock new capabilities for productivity, personalization and power efficiency, disrupting the PC market and delivering significant value gains to vendors and their partners.

ASML has revealed that its cutting-edge High-NA extreme ultraviolet (EUV) chipmaking tools, called High-NA Twinscan EXE, will cost around $380 million each—over twice as much as its existing Low-NA EUV lithography systems that cost about $183 million. The company has taken 10-20 initial orders from the likes of Intel and SK Hynix and plans to manufacture 20 High-NA systems annually by 2028 to meet demand. The High-NA EUV technology represents a major breakthrough, enabling an improved 8 nm imprint resolution compared to 13 nm with current Low-NA EUV tools. This allows chipmakers to produce transistors that are nearly 1.7 times smaller, translating to a threefold increase in transistor density on chips. Attaining this level of precision is critical for manufacturing sub-3 nm chips, an industry goal for 2025-2026. It also eliminates the need for complex double patterning techniques required presently.

However, superior performance comes at a cost - literally and figuratively. The hefty $380 million price tag for each High-NA system introduces financial challenges for chipmakers. Additionally, the larger High-NA tools require completely reconfiguring chip fabrication facilities. Their halved imaging field also necessitates rethinking chip designs. As a result, adoption timelines differ across companies - Intel intends to deploy High-NA EUV at an advanced 1.8 nm (18A) node, while TSMC is taking a more conservative approach, potentially implementing it only in 2030 and not rushing the use of these lithography machines, as the company's nodes are already developing well and on time. Interestingly, the installation process of ASML's High-NA Twinscan EXE 150,000-kilogram system required 250 crates, 250 engineers, and six months to complete. So, production is as equally complex as the installation and operation of this delicate machinery.

IBM has announced (on January 29) that Korea Quantum Computing (KQC) has engaged IBM to offer IBM's most advanced AI software and infrastructure, as well as quantum computing services. KQC's ecosystem of users will have access to IBM's full stack solution for AI, including watsonx, an AI and data platform to train, tune and deploy advanced AI models and software for enterprises. KQC is also expanding its quantum computing collaboration with IBM. Having operated as an IBM Quantum Innovation Center since 2022, KQC will continue to offer access to IBM's global fleet of utility-scale quantum systems over the cloud. Additionally, IBM and KQC plan to deploy an IBM Quantum System Two on-site at KQC in Busan, South Korea by 2028.

"We are excited to work with KQC to deploy AI and quantum systems to drive innovation across Korean industries. With this engagement, KQC clients will have the ability to train, fine-tune, and deploy advanced AI models, using IBM watsonx and advanced AI infrastructure. Additionally, by having the opportunity to access IBM quantum systems over the cloud, today—and a next-generation quantum system in the coming years—KQC members will be able to combine the power of AI and quantum to develop new applications to address their industries' toughest problems," said Darío Gil, IBM Senior Vice President and Director of Research. This collaboration includes an investment in infrastructure to support the development and deployment of generative AI. Plans for the AI-optimized infrastructure includes advanced GPUs and IBM's Artificial Intelligence Unit (AIU), managed with Red Hat OpenShift to provide a cloud-native environment. Together, the GPU system and AIU combination is being engineered to offer members state-of-the-art hardware to power AI research and business opportunities.

Intel has secured a $3.2 billion grant from the Israeli government for constructing a new $25 billion chip fabrication facility in southern Israel. This represents the company's largest-ever investment in a manufacturing facility. Intel's expansion aims to strengthen global semiconductor supply chains and reduce reliance on singular geographies like Taiwan. The new Fab 38 plant will be built alongside Intel's existing Fab 28 facility in Kiryat Gat. Construction has already begun, with operations slated to start in 2028 and serve until 2035. Intel expects to create thousands of local jobs as well. The company will receive a reduced 7.5% corporate tax rate and has committed to $16.6 billion in local procurement. The grant comes amid Israel's ongoing conflict with Palestinian militant group Hamas.

However, Intel's decades-long presence and investments in the country showcase economic priorities persevering. Its key processor technology was and is being designed in Israel labs. The Kiryat Gat expansion aligns with Intel CEO Pat Gelsinger's strategy of manufacturing diversification through mega-investments across the US, Europe, and Israel. It follows the company's record $20 billion fab project in Ohio. With significant government subsidies at each site, Intel aims to restore market dominance against rivals like AMD and Nvidia through scale of manufacturing. The new Israeli fab will complement Intel's lineup of leading-edge technologies and help maintain Israel's reputation as a global semiconductor hub.

Microsoft Gaming's chief, Phil Spencer, has issued a public-facing response to the recent leak of potential upcoming Xbox products (2024 to 2028): "We've seen the conversation around old emails and documents. It is hard to see our team's work shared in this way because so much has changed and there's so much to be excited about right now, and in the future. We will share the real plans when we are ready." The information dump (in part) consisted of presentation material prepared for (internal) April 2022 meetings, so it is possible that the Xbox division has changed direction in the meantime. Spencer was also involved in an August 2020 discussion with Microsoft marketing executives, regarding a possible buyout of Nintendo—according to leaked FTC legal case material. It should be noted that Microsoft has made attempts to acquire Nintendo in the past—but their approaches were "laughed off."

The Verge has managed to obtain an email distributed to Microsoft employees, as sent out by an embattled Spencer—he reiterates his public messaging of "real plans" in the company memo: "I know this is disappointing, even if many of the documents are well over a year old and our plans have evolved...We all put incredible amounts of passion and energy into our work, and this is never how we want that hard work to be shared with the community. That said, there's so much more to be excited about, and when we're ready, we'll share the real plans with our players."

A comprehensive leak of documents—from a FTC versus Microsoft case—has exposed short and long-term plans in the world of Xbox. It seems that a relatively mild refresh of current generation Xbox Series X and S is lined up for the second half of 2024, but presentation material (dated April 2022) also reaches far into the future with strategies for next-gen gaming hardware. The bigwigs at Xbox were projecting a "full convergence" of their proprietary "xCloud" gaming platform and physical console hardware to deliver "cloud hybrid games" for 2028—schemes and priorities could have shifted in the interim, given various legal challenges and takeover bids.

One of the slides points to Microsoft getting the technical nitty-gritty sorted by CY2023—with two main options presented for consideration: a licensed ARM 64 design or a "Zen 6-based" AMD 64 processor. The next-gen Xbox's GPU aspect could incorporate a Navi 5 design (RDNA 5)—weighing up either a co-operation with AMD, or an IP license of said graphics architecture. VideoCardz theorizes that: "the latter option seems more likely if the ARM 64 chip is chosen over the Zen 6 APU." A key goal in this area seems to be an implementation of "Next-Gen DirectX Ray tracing" and "ML-based Super Resolutions" features. A Neural Processing Unit (NPU) is marked as a key provision for the 2028 console—granting some nice-to-have perks including: latency compensation, frame rate interpolation and various enrichments of the user experience.