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Samsung Announces Improved Speeds for PRO Plus Memory Card Line-Up

Samsung Electronics America, the leader in advanced memory technology, today unveiled upgrades to its PRO Plus memory cards, designed for professional and enthusiast photographers, videographers, and content creators. The Samsung PRO Plus microSD and full-size SD cards boast increased read and write speeds of up to 180 MB/s and 130 MB/s, a 12 percent and 8 percent increase, respectively, over their predecessors.

Optimized for professional use, the new PRO Plus microSD and SD cards allow users to seamlessly capture 4K ultra-high definition (UHD) and Full HD (FHD) videos and photos. The cards also support a video speed class rating of V30, enabling professionals to quickly move large video files while editing. Available in capacities up to 512 GB, Samsung memory cards provide ample storage for up to 207,159 4K UHD photos or 30 hours of 4K UHD video.[1] Professionals need memory cards that make it easy to save and retrieve data, while also safeguarding their valuable images and video files. With the additional Samsung Card Reader supporting USB 3.0 and providing backward compatibility with USB 2.0, consumers can use Samsung memory cards on any device with a USB port.

WD Plans to Muscle in on Xbox Series X|S Storage Expansion Card Scene

It appears that Western Digital is readying its own line of Xbox Series X|S Storage Expansion cards, and undercutting its big rival - Seagate - in a currently exclusive storage solution market. Word spread across several gaming communities over the past weekend about a new listing on Best Buy, now removed as of late April 2, for a 1 TB capacity WD_BLACK C50 Expansion Card with an asking price of $179.99. WD has offered official external storage solutions for the current generation of Xbox home games consoles, under its WD_BLACK range, but Microsoft granted exclusive manufacturing rights to Seagate for the proprietary Xbox Series X|S storage expansion card system. According to official site information and documentation, these expansion cards are effective in "delivering additional external memory while maintaining the same peak speed and performance as the console's internal SSD".

The Seagate range could have been a timed exclusive, and based on the now deleted Best Buy listing, Microsoft seems to have handed a license to WD. The 1 TB WD_BLACK C50 Expansion Card's pricing was a big talking point, due to it being substantially cheaper than the equivalent capacity Seagate model ($219.99) - a saving of forty dollars, which is an encouraging sign for gamers who have long complained that the Xbox proprietary expansion card offers bad value for money. Seagate's current crop of cards start at $139.99 (512 GB) and go up to $399.99 (2 TB).

LG Announces Availability of 2023 Gram Style Series Laptops

LG Electronics USA announced pricing and availability of its 2023 LG gram Style laptops at LG.com and select LG-authorized retailers. Created for those who love to express their unique style wherever they go, the LG gram Style laptops will be offered in 16- and 14-inch versions (models 16Z90RS and 14Z90RS). Exclusively available at LG.com from March 20, 2023 to April 16, 2023, customers can now get a 32 GB memory LG gram Style laptop for the price of a 16 GB model of the same screen size.

The LG gram Style features an elegant glass design that changes color when viewed from different angles. The focus on design continues inside the new laptop where a "hidden" haptic touch-pad with soft LED backlighting illuminates at the user's touch. Maintaining its reputation for its lightweight portability, the gram Style weighs under 3 pounds.

ASUS Announces Vivobook 13 Slate OLED with Core i3-N300 CPU

ASUS today announced Vivobook 13 Slate OLED (T3304), the new generation of this fun-filled 13.3-inch detachable 2-in-1 laptop that makes it make it easier to enjoy everything, everywhere. With its vivacious styling and versatile design, Vivobook 13 Slate OLED is a brilliant all-rounder. Its combination of a brilliant 13.3-inch OLED Dolby Vision Pantone Validated touchscreen and a quad-speaker Dolby Atmos sound system makes it the perfect choice for on-the-go entertainment.

Creativity is a cinch with the handy ASUS Pen 2.0, an MPP 2.0-compliant stylus with 4096 pressure levels, four swappable tips, and convenient one-click Bluetooth functions via a shortcut button. A speedy new eight-core Intel Core processor is faster and delivers better battery life than its predecessor, and is backed by a 512 GB PCIe SSD and up to 8 GB of fast LPDDR5 memory. The magnetically-attached keyboard, large touchpad, and a cover stand make it endlessly adaptable to any situation, and users can enjoy easy connectivity via the dual USB-C ports, audio jack and microSD card reader.

Samsung Electronics Unveils High-Performance PC SSD That Raises Everyday Computing and Gaming to a New Level

Samsung Electronics today announced production readiness of a high-performance PCIe 4.0 NVMe SSD, the PM9C1a. Integrated with a new controller based on Samsung's cutting-edge 5-nanometer (nm) process and the company's seventh-generation V-NAND technology, the PM9C1a will provide elevated computing and gaming performance in PCs and laptops.

"Our new PM9C1a SSD will deliver a robust combination of superior performance, greater power efficiency and increased security, which are the qualities that matter most to PC users," said Yong Ho Song, Executive Vice President of Memory Solution Product & Development at Samsung Electronics. "We are committed to creating storage that satisfies the diverse and changing market requirements as we continue to advance innovation in the PC SSD space."

Sabrent Launches Rocket NVMe SSD in M.2 2230 Form Factor for Steam Deck Compatibility

For those looking at upgrading—or adding an SSD—to their Steam Deck, there's now a new option from Sabrent. The company has launched an M.2 2230 sized version of its Rocket SSD that will be available in sizes of 256 GB, 512 GB and 1 TB. As one would expect, due to the form factor, we're looking at DRAM-less drives. Sabrent has gone with Phison's E21T controller and it has been paired with Micron's B47R, 176-layer NAND.

In other words, we're not talking about a high-performance drive here, but that might be a good thing as well, since it'll produce less heat, which should prevent drive throttling in the tiny space available inside the Steam Deck. Sabrent rates the drives as having a sequential read speed of up to 5,000 MB/s and a sequential write speed of up to 4,300 MB/s. The read IOPS are rated at up to 450K, with the write IOPS at up to 920K, which once again varies between the drive sizes. The 512 GB drive appears to have the overall best performance. The drives are rated for 200, 300 and 600 TBW and come with a five year warranty. No pricing has been revealed so far.

Micron Delivers the World's Most Advanced Client SSD Featuring 232-Layer NAND Technology

Micron Technology, Inc.,, today announced it is shipping the Micron 2550 NVMe SSD to global PC OEM customers for use in mainstream laptops and desktops. The 2550 is the world's first client SSD to ship using NAND over 200 layers. Delivering performance that eclipses the competition through its density and power advantages, the 2550 provides users with responsiveness and the low power consumption needed to extend battery life for work and home PCs.

"We focused on delivering a superior user experience for PC users with this SSD," said Praveen Vaidyanathan, vice president and general manager of the Client Storage Group at Micron. "The new 2550 SSD builds on our established and broadly adopted PCIe Gen4 architecture. It also incorporates Micron's industry-leading 232-layer NAND and focuses on thermal architecture and power design. These capabilities deliver impressive application performance and phenomenal power savings."

Supermicro Unveils a Broad Portfolio of Performance Optimized and Energy Efficient Systems Incorporating 4th Gen Intel Xeon Scalable Processors

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, at the 2022 Super Computing Conference is unveiling the most extensive portfolio of servers and storage systems in the industry based on the upcoming 4th Gen Intel Xeon Scalable processor, formerly codenamed Sapphire Rapids. Supermicro continues to use its Building Block Solutions approach to deliver state-of-the-art and secure systems for the most demanding AI, Cloud, and 5G Edge requirements. The systems support high-performance CPUs and DDR5 memory with up to 2X the performance and capacities up to 512 GB DIMMs and PCIe 5.0, which doubles I/O bandwidth. Intel Xeon CPU Max Series CPUs (formerly codenamed Sapphire Rapids HBM High Bandwidth Memory (HBM)) is also available on a range of Supermicro X13 systems. In addition, support for high ambient temperature environments at up to 40° C (104° F), with servers designed for air and liquid cooling for optimal efficiency, are rack-scale optimized with open industry standard designs and improved security and manageability.

"Supermicro is once again at the forefront of delivering the broadest portfolio of systems based on the latest technology from Intel," stated Charles Liang, president and CEO of Supermicro. "Our Total IT Solutions strategy enables us to deliver a complete solution to our customers, which includes hardware, software, rack-scale testing, and liquid cooling. Our innovative platform design and architecture bring the best from the 4th Gen Intel Xeon Scalable processors, delivering maximum performance, configurability, and power savings to tackle the growing demand for performance and energy efficiency. The systems are rack-scale optimized with Supermicro's significant growth of rack-scale manufacturing of up to 3X rack capacity."

Solidigm Introduces the P44 Pro - the World's Premier Enthusiast Solid-State Drive (SSD)

Solidigm has introduced the P44 Pro solid-state storage drive (SSD), a high-performance client SSD for today's most demanding workloads. With blazing-fast speed and excellent power efficiency, the P44 Pro is the world's premier SSD for enthusiasts. The P44 Pro delivers spectacular PCIe Generation 4.0 performance, with up to 7,000 MB/s sequential read speeds. It provides a superb combination of speed and efficiency in Solidigm testing, meeting or exceeding published performance specifications while drawing just 5.3 W. The P44 Pro is available in 512 GB, 1 TB, and 2 TB capacities.

"Our flagship client SSD, the P44 Pro, is built with our cutting-edge NAND technology. Combined with our powerful software, it delivers the high performance users require in demanding applications. The P44 Pro is the most powerful client SSD Solidigm has launched to date and the premier enthusiast SSD on the market," said Sanjay Talreja, General Manager, Client Storage Group. "This drive delivers quick launch and load, and the fast save desired by gaming enthusiasts and content creators. With excellent power efficiency, the P44 Pro minimizes throttling that can come from excessive power and heat - resulting in consistent peak performance."
[Editor's note: Our in-depth review of the Solidigm Introduces the P44 Pro is now live]

Apple Introduces Next-Generation iPad Pro, Supercharged by the M2 Chip

Apple today announced the new iPad Pro with the M2 chip, delivering the ultimate combination of portability, versatility, and unbelievable performance. The new iPad Pro features a next-level Apple Pencil hover experience and superfast wireless connectivity, along with the world's most advanced mobile display, pro cameras, Face ID, Thunderbolt, and a four-speaker audio system. New features in iPadOS 16—including Stage Manager, full external display support, desktop-class apps, and Reference Mode—take pro workflows on iPad even further. Enabled by its advanced hardware and iPadOS 16, iPad Pro has an incredible ecosystem of powerful pro apps unlike any other device of its kind. The new iPad Pro is available to order starting today, and in stores beginning Wednesday, October 26.

"The next-generation iPad Pro pushes the boundaries of what's possible on iPad, bringing even more versatility, power, and portability to the ultimate iPad experience," said Greg Joswiak, Apple's senior vice president of Worldwide Marketing. "Powered by the M2 chip, the new iPad Pro features incredible performance and the most advanced technologies, including a next-level Apple Pencil hover experience, ProRes video capture, superfast wireless connectivity, and powerful iPadOS 16 features. There's nothing else like it."

ASUS Republic of Gamers Premieres ROG Phone 6D, Built Around MediaTek's Dimensity 9000+ SoC

ASUS Republic of Gamers (ROG) today premieres Dare to be Ultimate: Building a World-Leading Gaming Phone, the design story video that reveals the genesis of the new ROG Phone 6D series of gaming smartphones. The ROG Phone 6D and ROG Phone 6D Ultimate are powered by the latest flagship MediaTek Dimensity 9000+ 5G chipset. Clocking up to 3.2 GHz CPU speeds, and boasting up to 16 GB of LPDDR5X RAM and 512 GB ROM of storage, the Dimensity 9000+ chipset provides flagship 5G experiences, perfect for mobile gamers.

"The pursuit of the ultimate performance and gaming experience has always been central for the ROG Phone. With each iteration, we consistently strive to surpass ourselves, achieving the spirit of For Those Who Dare," said S.Y. Hsu, Co-CEO, ASUS. "We are thrilled that this first collaboration with MediaTek has achieved such stunning performance, and we will continue to strive for continuous performance improvements."

Apple introduces iPhone 14 and iPhone 14 Plus

Apple today introduced iPhone 14 and iPhone 14 Plus, featuring two sizes—6.1 inches and 6.7 inches—in a sophisticated design with impressive camera upgrades and groundbreaking new safety capabilities. iPhone 14 and iPhone 14 Plus take stunning photos and video with a powerful camera system featuring new Main and front TrueDepth cameras, the Ultra Wide camera for unique perspectives, and Photonic Engine—an enhanced image pipeline. Both models include the A15 Bionic chip with a 5-core GPU, which offers incredible performance and efficiency for demanding workloads, and is designed with privacy and security built in. iPhone 14 and iPhone 14 Plus introduce critical safety capabilities such as Crash Detection and Emergency SOS via satellite, a first in the industry. And with amazing battery life, industry-leading durability features, and super-fast 5G, this iPhone lineup is more advanced than ever before. iPhone 14 and iPhone 14 Plus will be available in midnight, blue, starlight, purple, and (PRODUCT)RED finishes. Pre-orders begin Friday, September 9, with availability for iPhone 14 beginning Friday, September 16, and availability for iPhone 14 Plus beginning Friday, October 7.

"Our customers rely on their iPhone every day, and iPhone 14 and iPhone 14 Plus introduce groundbreaking new technologies and important safety capabilities. With the new, larger 6.7-inch display on iPhone 14 Plus, users can enjoy more content onscreen when browsing the web and even more text," said Greg Joswiak, Apple's senior vice president of Worldwide Marketing. "Both phones have a powerful new Main camera with a huge leap in low-light performance, advanced connectivity capabilities with 5G and eSIM, and the incredible performance of A15 Bionic, which helps enable even better battery life. All of this, tightly integrated with iOS 16, makes iPhone more essential than ever."

Apple debuts iPhone 14 Pro and iPhone 14 Pro Max

Apple today announced iPhone 14 Pro and iPhone 14 Pro Max, the most advanced Pro lineup ever, featuring the Dynamic Island—a new design that introduces an intuitive way to experience iPhone—and the Always-On display. Powered by A16 Bionic, the fastest chip ever in a smartphone, iPhone 14 Pro introduces a new class of pro camera system, with the first-ever 48MP Main camera on iPhone featuring a quad-pixel sensor, and Photonic Engine, an enhanced image pipeline that dramatically improves low-light photos. These groundbreaking advancements make iPhone even more indispensable for everyday tasks, creative projects, and now even emergency situations with features such as Emergency SOS via satellite and Crash Detection. iPhone 14 Pro and iPhone 14 Pro Max will be available in four gorgeous new finishes: deep purple, silver, gold, and space black. Pre-orders begin Friday, September 9, with availability beginning Friday, September 16.

"Our customers count on their iPhone every day, and with iPhone 14 Pro and iPhone 14 Pro Max, we're delivering more advancements than any other iPhone. iPhone 14 Pro introduces a camera system that empowers every user—from the casual user to the professional—to take their best photos and video, and innovative new technologies like the Always-On display and the Dynamic Island, which offers new interactions for notifications and activities," said Greg Joswiak, Apple's senior vice president of Worldwide Marketing. "Groundbreaking safety capabilities bring users even more security, offering help when they need it most. And with the incredibly powerful and efficient A16 Bionic chip and all-day battery life, this is the best iPhone yet."

Kingston Digital Releases Type-A Addition to DataTraveler Max USB 3.2 Gen 2 Series

Kingston Digital, Inc., the flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announces the addition of the DataTraveler Max Type-A. It joins DataTraveler Max, the USB Type-C model, to complete the Kingston DT Max series of next-gen, high performance USB flash drives. Both drives leverage the latest USB 3.2 Gen 2 standard.

The DataTraveler Max (DT Max) series delivers record-breaking speeds up to 1,000 MB/s read and 900 MB/s write to make them some of the fastest USB drives on the market and the first of its kind. DT Max is designed with portability and convenience in mind. DT Max Type-A features a merlot and black design with Type-A connector, while the original DT Max features an all-black design with Type-C connector to differentiate the drives at first glance. The unique ridged casing protects the connector when it is not in use and is easy to move in a single motion. Seamlessly transfer and store large digital files such as HD photos, 4K/8K videos, music and more with top speeds and high capacities up to 1TB3. The addition of a keyring loop and LED status indicator makes the drive ideal for users who need storage on-the-go.

DataLocker Sentry Launches K350 FIPS 140-2 Level 3 Keypad Flash Drive

DataLocker, Inc., a leading provider of encryption solutions, today announced that the company's recently announced DataLocker Sentry K350 encrypted flash drive is in stock and now available for order with expanded storage capacities up to 512 GB. The company first introduced the K350 in Q4 of 2021 as an expansion of the product line aimed at bridging the gap of managing encrypted USB devices with the flexibility to connect to any machine that supports USB Mass Storage regardless of the operating system, all developed around DataLocker's "Simply Secure" design principles.

The new firmware release for K350 enables boot of operating systems while keeping the device under full management control, critical functionality for administrators of air gapped and microsegmented machines across industries. The Sentry K350 is the industry's only platform-independent and OS agnostic keypad flash drive which incorporates an OLED display and represents the next generation of encrypted data storage products. In addition to the display's true alpha-numeric password-based authentication, the Sentry K350 offers users a full-featured, visual-based menu-driven system to easily change passwords, set password policy and enable other security features without needing to consult a user manual. Further enhancing the feature set is the achievement of the FIPS 140-2 Level 3 certification, the MIL-Std810G, and an IP67 rating making it both secure and rugged enough for any environment.

KIOXIA First to Introduce Next-Generation UFS Embedded Flash Memory Devices Supporting MIPI M-PHY v5.0

Continuing to lead the way forward for UFS technology, KIOXIA America, Inc. today announced sampling of the industry's first Universal Flash Storage (UFS)3 embedded flash memory devices supporting MIPI M-PHY v5.04. The new lineup utilizes the company's BiCS FLASH 3D flash memory and is available in three capacities: 128 GB, 256 GB and 512 GB. The new devices deliver high speed read and write performance and are targeted to a variety of mobile applications, including leading-edge smartphones.

The new KIOXIA devices are next-generation UFS (MIPI M-PHY 5.0), which has a theoretical interface speed of up to 23.2 Gbps per lane (x2 lanes = 46.4 Gpbs) in HS-GEAR mode. Sequential read and write performance of the 256 GB device is improved by approximately 90 percent and 70 percent, respectively, over previous generation devices. Also, random read and write performance of the 256 GB device is improved by approximately 35 percent and 60 percent, respectively, over previous generation devices. This next generation of UFS provides significant increases in performance, enabling next-generation smartphones and other products to enhance their capabilities and end user experiences in the 5G era and beyond.

Intel Arc Alchemist DG2 GPU Memory Configurations Leak

Intel's upcoming Arc Alchemist lineup of discrete graphics cards generates a lot of attention from consumers. Leaks of these cards' performance and detailed specifications appear more and more as we enter the countdown to the launch day, which is sometime in Q1 of this year. Today, we managed to see a slide from @9950pro on Twitter that shows the laptop memory configuration of Intel's DG2 GPU. As the picture suggests, we can see that the top-end SKU1 with 512 EUs supports a 16 GB capacity of GDDR6 memory that runs at 16 Gbps speeds. The memory runs on a 256-bit bus and generates 512 GB/s bandwidth while having eight VRAM modules present.

When it comes to SKU2, which is a variant with 384 EUs, this configuration supports six VRAM modules on a 192-bit bus, running at 16 Gbps speeds. They generate a total capacity of 12 GBs and a bandwidth of 384 GB/s. We have SKU3 DG2 GPU going down the stack, featuring 256 EUs, four VRAM modules on a 128-bit bus, 8 GB capacity, and a 256 GB/s bandwidth. And last but not least, the smallest DG2 variants come in the form of SKU4 and SKU5, feating 128 EUs and 96 EUs, respectively. Intel envisions these lower-end SKUs with two VRAM modules on a 64-bit bus, and this time slower GDDR6 memory running at 14 Gbps. They are paired with 4 GB of total capacity, and the total bandwidth comes down to 112 GB/s.

Huawei Prepares Laptop Powered by Custom Kirin 5 nm SoC and DDR5 Memory

China's technology reliance on 3rd party companies seems to be getting smaller. One of the leading technology companies in China, Huawei, has designed a laptop powered by a custom 5 nm Kirin SoC with DDR5 memory. Called the Dyna Cloud L420, Huawei has prepared this model for the Chinese market to provide a fully functional laptop that will get the job done, with no risk of the potential security backdoors implemented in the processor. Powered by a brand new Kirin 9006C SoC manufactured on TSMC's 5 nm process, it features eight unknown cores running at 3.1 GHz frequency. We assume that those are custom cores designed by Huawei. This SoC is accompanied by 8 GB of LPDDR5 memory, with 256 GB and 512 GB UFS 3.1 configurations storage options.

When it comes to the rest of the laptop, it rocks a 14-inch 2160x1440 display. I/O options are solid as well, as this machine has an HDMI video output, two USB-A, one USB-C, and Gigabit Ethernet using a mini-RJ45 port. Connectivity is provided by Wi-Fi 6 and Bluetooth 4.2. There is a 56 W/h battery that provides the juice to keep it running when it comes to the battery. And to complete all of that, this laptop officially only supports Huawei's proprietary Kirin OS (KOS) and Unity OS (UOS), with expected support for HarmonyOS in the future. Pricing and availability information is a mistery at the present date.

Global Ranking of Top 10 SSD Module Makers for 2020 Shows 15% YoY Drop in Annual Shipment, Says TrendForce

The emergence of the COVID-19 pandemic led to severe delays in manufacturing and logistics. In particular, governments worldwide began implementing border restrictions in 2Q20 to combat the ongoing health crisis, leading to a sudden decline in order volumes for channel-market SSDs, according to TrendForce's latest investigations. Annual shipment of SSDs to the channel (retail) market reached 111.5 million units in 2020, a 15% YoY decrease. In terms of market share by shipment, Kingston, ADATA, and Kimtigo once again occupied the top three spots, respectively.

Looking at the channel market for SSDs as a whole, NAND Flash suppliers (among which Samsung possessed the largest market share) accounted for around 35% of the total shipments in 2020, while SSD module makers accounted for the other 65%. The top 10 module makers accounted for 71% of channel-market SSD shipments from all SSD module makers. Taken together, these figures show that the market remained relatively oligopolistic in 2020. However, it should be noted that TrendForce's ranking of SSD module makers for 2020 takes account of only products bound for the channel market and under brands owned by the module makers themselves; NAND Flash suppliers were therefore excluded from the top 10 ranking.

NAND Flash Prices Projected to Enter Cyclical Downturn in 2022 Due to Modest Demand Growth and Competition for Higher-Layer NAND, Says TrendForce

Contract prices of NAND Flash products are expected to undergo a marginal drop of 0-5% QoQ in 4Q21 as demand slows, according to TrendForce's latest investigations. Hence, the current cyclical upturn in NAND Flash prices will have lasted for only two consecutive quarters. Looking ahead, NAND Flash suppliers' capacity expansion plans will be affected by the outlook on future trends and the supply of other non-memory components. At the same time, attention will have to be paid to the demand projection. At the moment, NAND Flash suppliers appear likely to downsize their capacity expansion activities for 2022, resulting in a 31.8% YoY increase in NAND Flash bit supply next year. Annual bit demand, on the other hand, is projected to increase by 30.8% YoY. With demand being outpaced by supply and competition intensifying among suppliers for higher-layer products, the NAND Flash market will likely experience a cyclical downturn in prices in 2022.

Samsung Develops 512 GB DDR5 Memory Modules Running at 7.2 Gbps

At this year's Hot chips 33 conference, Samsung has presented its works on the upcoming DDR5 memory standard. The company has managed to achieve a lot of new developments, as the newer standard pairs with new technologies to deliver higher speeds and better capacity. The Korean company designed its DDR5 modules as 8-high (8H) stacked TSV (through silicon via) dies. In the previous DDR4 implementations, Samsung used 4-high (4H) stacked TSV dies, which are actually thicker than the latest 8-high implementations. To achieve the new thin design, Samsung has used thin wafer handling techniques, which resulted in a 40% reduction in gab between stacked dies. The new 8H DDR5 modules are only 1.0 mm thick, compared to the 1.2 mm of the older 4H modules.

When it comes to performance, Samsung expects the new DDR5 modules to deliver big. Running at 7.2 Gbps speeds, the Samsung-made RDIMM/LRDIMM modules can reach up to 512 GB in capacity. This is, of course, limited to the server/enterprise market. Regular consumers/PC users can expect to have UDIMMs with up to 64 GB of capacity. The aforementioned 7.2 Gbps speed is achieved at the specified 1.1 Volts of power, meaning that Samsung's implementation is very efficient. According to some estimations made by the company, the DDR5 crossover for the mainstream market is not expected before 2023/2024, meaning that there is still a lot of time for memory makers to refine their DDR5 products.

New AMD Radeon PRO W6000X Series GPUs Bring Groundbreaking High-Performance AMD RDNA 2 Architecture to Mac Pro

AMD today announced availability of the new AMD Radeon PRO W6000X series GPUs for Mac Pro. The new GPU product line delivers exceptional performance and incredible visual fidelity to power a wide variety of demanding professional applications and workloads, including 3D rendering, 8K video compositing, color correction and more.

Built on groundbreaking AMD RDNA 2 architecture, AMD Infinity Cache and other advanced technologies, the new workstation graphics line-up includes the AMD Radeon PRO W6900X and AMD Radeon PRO W6800X GPUs. Mac Pro users also have the option of choosing the AMD Radeon PRO W6800X Duo graphics card, a dual-GPU configuration that leverages high-speed AMD Infinity Fabric interconnect technology to deliver outstanding levels of compute performance.

Micron Delivers 176-layer NAND and 1α (1-alpha) DRAM Technology

Micron, the US-based manufacturer of various kinds of memory technologies, has today announced some quite interesting products at its Computex 2021 keynote. For starters, the company has announced a new portfolio of products based on 176-layer NAND. There are currently two products listed that use this new technology and those are the Micron 3400 and 2450 M.2 NVMe SSDs. Based on the PCIe 4.0 interface, the 2450 SSD lineup is designed as a value-oriented solution that comes in M.2-2280, M.2-2242, and M.2-2230 sizes. It ranges from 256 GB to 1 TB in capacities, which are supposed to be priced as a value purchase.

In a contrast, the 3400 SSD is M.2-2280 design, meant for only the highest performance. The sequential read speeds go up to 6600 MB/s, while the sequential writes go up to 5000 MB/s (in the case of the 2 TB model). Capacities range from 512 GB to 2 TB and only the 1 TB and 2 TB variants have the 5000 MB/s write speeds, while the 512 GB version is capped at 3600 MB/s speed. Both SSD models are featuring a heat spreader on top of NAND chips and spot an in-house and Micron-developed NVMe 1.4 SSD controller. However, Micron does note that the company is free to use any 3rd party SSD controller as we are deep in component shortages with high demand for SSDs. You can get an in-depth look at the 2450 and 3400 M.2 SSDs from Micron's website.

Minisforum Announces EliteMini TL50 with Intel Tiger Lake-U and Thunderbolt 4

EliteMini TL50 is an ultra-compact and high-performance mini PC specially designed for home and office use. Equipped with Intel 11th generation CPU and Intel Iris Xe graphics. Intel Wi-Fi 6 & triple output, upgrade-friendly & windows 10 pro pre-installed.

TL50 comes with Intel Core i5-1135G7 processor (Tiger Lake), 4 cores/8 threads, backed up by Intel Iris Xe graphics, with 8M Cache, max turbo frequency up to 4.20 GHz. It is 20% faster than its predecessor with more cache memory, DDR4-3200 memory and PCIe 4.0 support. Not only ordinary work but also a little heavy games and video editing can be done comfortably.

Samsung Develops Industry's First HKMG-Based DDR5 Memory; Ideal for Bandwidth-Intensive Advanced Computing Applications

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has expanded its DDR5 DRAM memory portfolio with the industry's first 512 GB DDR5 module based on High-K Metal Gate (HKMG) process technology. Delivering more than twice the performance of DDR4 at up to 7,200 megabits per second (Mbps), the new DDR5 will be capable of orchestrating the most extreme compute-hungry, high-bandwidth workloads in supercomputing, artificial intelligence (AI) and machine learning (ML), as well as data analytics applications.

"Samsung is the only semiconductor company with logic and memory capabilities and the expertise to incorporate HKMG cutting-edge logic technology into memory product development," said Young-Soo Sohn, Vice President of the DRAM Memory Planning/Enabling Group at Samsung Electronics. "By bringing this type of process innovation to DRAM manufacturing, we are able to offer our customers high-performance, yet energy-efficient memory solutions to power the computers needed for medical research, financial markets, autonomous driving, smart cities and beyond."
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