Intel Corporation today reported second-quarter 2023 financial results. "Our Q2 results exceeded the high end of our guidance as we continue to execute on our strategic priorities, including building momentum with our foundry business and delivering on our product and process roadmaps," said Pat Gelsinger, Intel CEO. "We are also well-positioned to capitalize on the significant growth across the AI continuum by championing an open ecosystem and silicon solutions that optimize performance, cost and security to democratize AI from cloud to enterprise, edge and client."

David Zinsner, Intel CFO, said, "Strong execution, including progress towards our $3 billion in cost savings in 2023, contributed to the upside in the quarter. We remain focused on operational efficiencies and our Smart Capital strategy to support sustainable growth and financial discipline as we improve our margins and cash generation and drive shareholder value." In the second quarter, the company generated $2.8 billion in cash from operations and paid dividends of $0.5 billion.

Today, Intel announced a strategic collaboration agreement with Ericsson to utilize Intel's 18A process and manufacturing technology for Ericsson's future next-generation optimized 5G infrastructure. As part of the agreement, Intel will manufacture custom 5G SoCs (system-on-chip) for Ericsson to create highly differentiated leadership products for future 5G infrastructure. Additionally, the companies will expand their collaboration to optimize 4th Gen Intel Xeon Scalable processors with Intel vRAN Boost for Ericsson's Cloud RAN (radio access network) solutions to help communications service providers increase network capacity and energy efficiency while gaining greater flexibility and scalability.

"As our work together evolves, this is a significant milestone with Ericsson to partner broadly on their next-generation optimized 5G infrastructure. This agreement exemplifies our shared vision to innovate and transform network connectivity, and it reinforces the growing customer confidence in our process and manufacturing technology," said Sachin Katti, senior vice president and general manager of the Network and Edge group at Intel. "We look forward to working together with Ericsson, an industry leader, to build networks that are open, reliable and ready for the future."

Samsung Electronics and MediaTek completed the successful testing of 5G Standalone Uplink (UL) 2CC Carrier Aggregation (CA) with C-Band UL MIMO to reach top uplink speeds, marking a groundbreaking achievement in wireless mobile capabilities. This approach used three transmit (3Tx) antennas to improve upload experiences, ushering in an era of enhanced connectivity for consumers worldwide.

The demands on uplink performance are increasing with the rise of live streaming, multi-player gaming and video conferences. Upload speeds determine how fast your device can send data to gaming servers or transmit high-resolution videos to the cloud. As more consumers seek to document and share their experiences with the world in real-time, enhanced uplink experiences provide an opportunity to use the network to improve how they map out their route home, check player stats online and upload videos and selfies to share with friends and followers.

Zebra Technologies Corporation, a leading digital solution provider enabling businesses to intelligently connect data, assets, and people, today announced the launch of the ET6x series of rugged Android tablets. Designed to help front-line workers in warehouses, manufacturing plants, ports, yards, field service and emergency medical environments be more productive and efficient, the ET6x series debuts the industry's only heated touch screen and vehicle dock for forklifts and other material handling vehicles.

The ET60 and ET65 are Zebra's first 2-in-1 Android tablets with a friction-hinge keyboard that transforms the tablets into a laptop to make heavy data entry easy in the office and in the field. The products feature consumer styling that can handle harsh indoor and outdoor environments from sub-zero cold to extreme heat. The tablets are dustproof, corrosion proof and tested for vibration, thermal shock, and solar radiation. Two of the most vulnerable tablet elements - the display and optional scanner exit window - are protected with shatter-and scratch-resistant Corning Gorilla Glass.

TrendForce reports that inventory reduction in Q1 fell short of expectations and coincided with the industry's traditional off-season, leading to overall subdued demand. However, due to new product release and a surge in urgent orders for specialized specifications, Q1 revenue of the global top ten IC design houses remained on par with 4Q22, with a modest QoQ increase of 0.1% for a total revenue of US$33.86 billion. Changes in ranking included Cirrus Logic slipping from the top ten as well as the ninth and tenth positions being replaced by WillSemi and MPS, respectively. The rest of the rankings remained unchanged.

The smartphone supply continues to grapple with overstock, but AI applications are entering a period of rapid growth
Qualcomm witnessed an uptick in its revenue, largely attributed to the launch and subsequent shipments of its latest flagship chip, the Snapdragon 8Gen2. The company saw 6.1% in QoQ growth in its smartphone business, which effectively offset the downturn from its automotive and IoT sectors. As a result, Qualcomm's Q1 revenue increased marginally by 0.6%, cementing its position at the top of the pack with a market share of 23.5%.

Today Apple announced a new multiyear, multibillion-dollar agreement with Broadcom, a leading U.S. technology and advanced manufacturing company. Through this collaboration, Broadcom will develop 5G radio frequency components - including FBAR filters - and cutting-edge wireless connectivity components. The FBAR filters will be designed and built in several key American manufacturing and technology hubs, including Fort Collins, Colorado, where Broadcom has a major facility.

"We're thrilled to make commitments that harness the ingenuity, creativity, and innovative spirit of American manufacturing," said Tim Cook, Apple's CEO. "All of Apple's products depend on technology engineered and built here in the United States, and we'll continue to deepen our investments in the U.S. economy because we have an unshakable belief in America's future."

Panasonic announced today the world's premier rugged notebook for the Defence industry can now be equipped with the Eclypt Core Encrypted Internal Solid State Drive from global communications company, Viasat Inc. (NASDAQ: VSAT), making the Panasonic TOUGHBOOK 40 unrivalled in its capabilities for the military, border control and emergency services. Available in May 2023, the TOUGHBOOK 40 notebook with solid state self-encrypting hard drive is certified for use in the UK for securing Top Secret information and all security levels below, as well as certified for use by NATO and other European countries.

"This is the next step in extending our partnership with Viasat to offer the highest-level security drives across the TOUGHBOOK range," said Jon Tucker, General Manager Engineering, Product & Mobility Solutions, at Panasonic Mobile Solutions Business Division. "With the current geopolitical tensions across Europe and beyond, the demand for this type of highly secure, rugged and modular flexible device is growing every day."

Ericsson is boosting its Open RAN and Cloud RAN ecosystem commitment through an agreement with US-based global ICT industry leader AMD. The agreement - intended to strengthen the Open RAN ecosystem and vendor-agnostic Cloud RAN environment - aims to offer communications service providers (CSPs) a combination of high performance and additional flexibility for open architecture offerings.

The Ericsson-AMD collaboration will see additional processing technologies in the Ericsson Cloud RAN offering. The expanded offering aims to enhance the performance of Cloud RAN and secure high-capacity solutions. The collaboration will enable joint exploration of AMD EPYC processors and T2 Telco accelerator for utilization in Cloud RAN solutions, while also investigating future platform generations of these technologies.

DFI, a global leader in embedded motherboards and industrial computers, today announced that they will be participating in Embedded World 2023 and joining Qualcomm Technologies, Inc. to showcase the world's first SBC equipped with the high-performance Qualcomm QRB5165 processor. With high integration capability and anti-vibration features, the product can be applied in fields such as industrial automation and AMR. It is expected to increase the overall AI edge computing efficiency and bring more capabilities to the industry.

For the first time during the three-day Embedded World 2023 exhibition, DFI will integrate the QRB551 industrial-grade motherboard built with the Qualcomm Robotics RB5 platform with 5G connectivity and AMR requirements. The solution will be applied to a smart factory environment while executing appearance recognition, defect detection, and human body posture recognition, which are commonly seen in industrial automation.

Qualcomm Technologies' 6th generation modem-to-antenna solution is the first ready to support 5G Advanced, the next phase of 5G. It introduces a new architecture, a new software suite and includes numerous world's first features to push the boundaries of connectivity including coverage, latency, power efficiency and mobility. Snapdragon X75 technologies and innovations empower OEMs to create next generation experiences across segments including smartphones, mobile broadband, automotive, compute, industrial IoT, fixed wireless access and 5G private networks.

Snapdragon X75 is the first Modem-RF System with a dedicated hardware tensor accelerator, Qualcomm 5G AI Processor Gen 2, enabling over 2.5 times better AI performance compared to Gen 1 and introduces Qualcomm 5G AI Suite Gen 2 with new AI-powered optimizations to achieve better speeds, coverage, mobility, link robustness and location accuracy. The Qualcomm 5G AI Suite features advanced AI-based capabilities including world's first sensor-assisted mmWave beam management and AI-enhanced GNSS Location Gen 2, which uniquely optimize Snapdragon X75 for superior 5G performance.

Getac has today announced the expansion of its flagship X600 rugged mobile workstation range with the launch of the X600 Server and X600 Pro-PCI. The new models will sit alongside the recently launched X600 and X600 Pro, creating a comprehensive lineup of rugged mobile workstations that are purpose-built to meet the demands of professionals working in challenging industries, such as defence, manufacturing and oil & gas.

X600 Server: The fully rugged mobile server
The all-new Getac X600 Server delivers a powerful commercial off-the-shelf (COTS) rugged mobile server that can be folded to a slim profile for easy transportation.

Qualcomm Technologies, Inc. today announced Snapdragon X35 5G Modem-RF System, the world's first 5G NR-Light modem-RF system. NR-Light, a new class of 5G, fills the gap in between high-speed mobile broadband devices and extremely low-bandwidth NB-IoT devices. NR-Light devices, powered by Snapdragon X35, can be smaller, more cost-efficient, and provide longer battery life than traditional mobile broadband devices.

With its optimized design and breakthrough performance, Snapdragon X35 offers a device platform that bridges the complexity and capability gap between the extremes in 5G today and addresses the need for mid-tier use cases. This lower cost option provides device makers with a long-term migration path to replace LTE CAT4+ devices, ultimately increasing 5G adoption and allowing for faster transition to a unified 5G network.

NETGEAR, Inc the leading provider of award-winning connected products designed to simplify and improve people's lives, today raised the bar once again by supporting the new 6 GHz band for client devices on its Nighthawk M6 mobile hotspot routers. The ultra-fast M6 Pro 5G WiFi 6E Hotspot Router (MR6450) supports 5G internet up to 6 Gbps‡ and WiFi speeds up to 3.6 Gbps. Evolving work and lifestyle changes have spurred the growing need for always-on, secure, high-speed internet connectivity for multiple connected devices anywhere and everywhere. On the road, traveling for business or pleasure, via commercial transport or in a car or RV, WiFi you can trust is imperative. Public WiFi, while convenient, is not secure and not worth risking a critical business transaction or personal bank transfer.

The M6 Pro provides a portable, secure WiFi connection with a built-in firewall for up to 32 devices in any place that has cellular coverage. Travelers and/or mobile workforces can enjoy uninterrupted video streaming, Zoom calls, online games, social media updates and large file uploads/downloads, all at the same time without risk of intrusion. And worldwide roaming support helps them stay connected no matter where they go. Also ideal for home or holiday home use, the M6 Pro can boost WiFi coverage up to 1,000 square feet with In-Home Performance Mode, simply by removing the battery and using the power adapter. In larger homes, the hotspot can be used together with an existing WiFi router by plugging it into the 2.5 Gbps Ethernet port. For locations where cellular signal is not strong, external antennas (sold separately) can increase 5G reception when plugged into the M6 Pro's antenna ports. The onboard USB-C port can be used to charge devices or as an ultra-fast wired connection, up to 5 Gbps, to a computer or a laptop.

ASUS today announced Mini PC PL64, an industrial mini PC featuring a fanless design and powered by up to a 12th Generation Intel Core i7 (15 W) processor. Each PL64 unit has been subjected to a battery of reliability tests, and the fanless design ensures optimal performance even in ambient temperatures of up to 50°C. This mini PC features dual LAN ports, including 2.5 Gbps Ethernet, dual COM ports, five USB ports, along with triple 4K display support at 60 Hz.

Mini PC PL64 employs a new, almost-silent fanless design that minimizes dust ingress into the chassis to prolong product life. The fanless design and 15-watt CPU support make PL64 ideal for industrial applications where reliability, durability, and low noise are paramount. The cooling system in PL64 efficiently dissipates heat, enabling this mini PC to be deployed in hot environments reaching 50°C.

MediaTek today announced the Dimensity 8200, the company's newest chipset for premium 5G smartphones. Smartphones powered by the Dimensity 8200 will offer flagship level experiences - including connectivity, gaming, multimedia, displays and imaging - at a more accessible price point. Built on the 4 nm-class process, the new chipset delivers unparalleled power efficiency. It also integrates an octa-core CPU with four Arm Cortex-A78 cores operating at up to 3.1 GHz, along with a powerful Mali-G610 graphics engine, for better performance across applications.

To enhance gaming performance, the chipset takes advantage of MediaTek's HyperEngine 6.0 gaming technologies so users can enjoy smooth high framerate gameplay without suffering connection drops, FPS jitter, or gameplay hiccups. MediaTek's Intelligent Display Sync 2.0 technology intelligently adjusts the display refresh rate according to the game frame rate detected, which helps provide smoother viewing experiences.

During the Snapdragon Summit 2022, Qualcomm Technologies, Inc. introduced its latest premium mobile platform, Snapdragon 8 Gen 2. The Snapdragon 8 Gen 2 Mobile Platform will define a new standard for connected computing, intelligently engineered with groundbreaking AI across the board to enable extraordinary experiences. This new mobile platform will be adopted by global OEMs and brands including ASUS Republic of Gamers, HONOR, iQOO, Motorola, nubia, OnePlus, OPPO, REDMAGIC, Redmi, SHARP, Sony Corporation, vivo, Xiaomi, XINGJI/MEIZU, and ZTE, with the first commercial devices expected by the end of 2022.

"We are passionate about enabling people to do more, so we design Snapdragon with the user at the center. Snapdragon 8 Gen 2, will revolutionize the landscape of flagship smartphones in 2023," said Chris Patrick, senior vice president and general manager of mobile handsets, Qualcomm Technologies, Inc. "Snapdragon 8 Gen 2 delivers groundbreaking AI, unparalleled connectivity, and champion-level gameplay, enabling consumers to enhance every experience on their most trusted device."

MediaTek today launched the Dimensity 9200, its latest 5G chipset powering the next era of flagship smartphones. Boasting extreme performance and intelligent power efficiency, the new SoC brings immersive all-day gaming experiences, ultra-sharp image capturing and support for both mmWave 5G and sub-6 GHz connectivity to consumers around the globe.

"MediaTek's Dimensity 9200 combines ultimate performance with significant power savings, extending battery life and keeping smartphones cool," said JC Hsu, Corporate Vice President and General Manager of MediaTek's wireless communications business unit at MediaTek. "With notably brighter image capturing and improved gaming speeds, along with the latest display enhancements, the Dimensity 9200 will bring new possibilities for next-gen smartphones that come in a variety of stylish and foldable form factors."

Handheld Group, a leading manufacturer of rugged mobile computers, today announced the release of the all-new Algiz 10XR, an ultra-rugged 10-inch Windows tablet that combines durability with robust field performance, 5G and future-proof features. The Algiz 10XR is a smaller, lighter, 10-inch Windows tablet that achieves more even while taking up less space. It brings two times better graphics and measurably faster performance. Future-proof 5G communication can handle live video streams and bandwidth-heavy tasks like mapping. The Algiz 10XR was developed for field work or other challenging environments within logistics, mining, public transport, public safety, waste management or GIS and has also been designed with modulization and customization in mind.

"The Algiz 10XR will bring some great performance gains for our partners and customers who rely on Windows tablets in the field," says Johan Hed, Handheld chief product officer. "We've worked with this segment for decades now and are confident that we've developed a device with not only great specs, but a complete accessory package to help our customers with their fieldwork."

Apple today announced the new iPad Pro with the M2 chip, delivering the ultimate combination of portability, versatility, and unbelievable performance. The new iPad Pro features a next-level Apple Pencil hover experience and superfast wireless connectivity, along with the world's most advanced mobile display, pro cameras, Face ID, Thunderbolt, and a four-speaker audio system. New features in iPadOS 16—including Stage Manager, full external display support, desktop-class apps, and Reference Mode—take pro workflows on iPad even further. Enabled by its advanced hardware and iPadOS 16, iPad Pro has an incredible ecosystem of powerful pro apps unlike any other device of its kind. The new iPad Pro is available to order starting today, and in stores beginning Wednesday, October 26.

"The next-generation iPad Pro pushes the boundaries of what's possible on iPad, bringing even more versatility, power, and portability to the ultimate iPad experience," said Greg Joswiak, Apple's senior vice president of Worldwide Marketing. "Powered by the M2 chip, the new iPad Pro features incredible performance and the most advanced technologies, including a next-level Apple Pencil hover experience, ProRes video capture, superfast wireless connectivity, and powerful iPadOS 16 features. There's nothing else like it."

TCL, a pioneer in display technology and affordable, powerful connected experiences, unveils a new range of CPE devices at Broadband World Forum, including three latest generation 5G routers. TCL will also deliver the keynote address on the exhibition's final day on October 20th. TCL is committed to providing users with safe, high-speed, reliable, and seamless mobile broadband connection services. As a leading global broadband provider, TCL works with more than 150 carriers worldwide to meet network connection demands for home, business, mobile and machine-to-machine (M2M).

"Our vision is to create seamless connections for everyone", commented Sharon Xiao, GM of the Smart Connected Device Business at TCL Communication. "By 2027[1], 5G subscriptions are forecast to reach 4.4 billion. TCL's long-term partnership with top-tier operators means we can offer high-quality 5G Mobile Broadband (MBB) and Fixed Wireless Access (FWA) products to clients and consumers and make our vision a reality."

NETGEAR, Inc., the leading provider of award-winning connected products designed to simplify and improve people's lives, today launched a powerful addition to its unlocked 5G mobile hotspot lineup. At a time when access to fast, secure and reliable internet is more important than ever, the NETGEAR Nighthawk M6 Mobile Hotspot Router (MR6150) raises the mobile broadband experience to new heights by upping the maximum 5G speed that can be supported and adding 160 MHz capability to connect with the latest WiFi 6 client devices.

NETGEAR launched the world's first unlocked 5G hotspot in 2021 with the award-winning Nighthawk M5. Now the company is building on that achievement with the M6, which is 20 percent faster than the M5 at 2.5 Gbps over 5G and has the capacity to hit a maximum combined WiFi speed of up to 3.6 Gbps when connecting to 160 MHz WiFi 6 devices. Additionally, the M6 comes with a first of its kind new In-Home Performance Mode which boosts WiFi coverage up to 2,000 square-feet when the device is plugged in, and the battery is removed.

According to TrendForce research, due to steady weakening of overall demand for consumer electronics, inventory pressure has increased among downstream distributors and brands. Although there are still sporadic shortages of specific components, the curtain has officially fallen on a two-year wave of shortages in general, and brands have gradually suspended stocking in response to changes in market conditions. However, stable demand for automotive and industrial equipment is key to supporting the ongoing growth of foundry output value. At the same time, since the creation of a marginal amount of new capacity in 2Q22 led to growth in wafer shipments and a price hike for certain wafers, this drove output value among top ten foundries to reach US$33.20 billion in 2Q22. Quarterly growth fell to 3.9% on a weakening consumer market.

A prelude to inventory correction was officially revealed in 3Q22. In addition to intensifying severity in the initial wave of order slashing for LDDI/TDDI, and TV SoC, diminishing order volume also extended to non-Apple smartphone APs and peripheral IC PMIC, CIS, and consumer electronics PMICs, and mid-to-low-end MCUs, posing a challenge for foundry capacity utilization. However, the launch of the new iPhone in 3Q22 is expected to prop up a certain amount of stocking momentum for the sluggish market. Therefore, top ten foundry revenue in 3Q22 is expected to maintain a growth trend driven by high-priced processes and quarterly growth rate is expected to be slightly higher than in 2Q22.

Intel and MediaTek today announced a strategic partnership to manufacture chips using Intel Foundry Services' (IFS) advanced process technologies. The agreement is designed to help MediaTek build a more balanced, resilient supply chain through the addition of a new foundry partner with significant capacity in the United States and Europe. MediaTek plans to use Intel process technologies to manufacture multiple chips for a range of smart edge devices. IFS offers a broad manufacturing platform with technologies optimized for high performance, low power and always-on connectivity built on a roadmap that spans production-proven three-dimensional FinFET transistors to next-generation breakthroughs.

"As one of the world's leading fabless chip designers powering more than 2 billion devices a year, MediaTek is a terrific partner for IFS as we enter our next phase of growth," said IFS President Randhir Thakur. "We have the right combination of advanced process technology and geographically diverse capacity to help MediaTek deliver the next billion connected devices across a range of applications."

Elitegroup Computer Systems (ECS), the global leading motherboard, mini PC, notebook, mobile device, and smart solution provider, will physically and digitally participate the leading international faire for embedded technologies, Embedded World 2022 at Nuremberg, Germany from June 21 to 23 to showcasing the comprehensive LIVA Mini PC family and the latest commercial motherboards to apply in wide range applications.

ECS presents the complete LIVA Mini PC family including compact-size Q series, multi-function Z series and high-performance One series and its wide range applications during the event.

Qualcomm Technologies, Inc. announced its latest lineup of mobile platforms, Snapdragon 8+ Gen 1 and Snapdragon 7 Gen 1, to power the next generation of premium and high-tier Android smartphones. The Company's newest flagship platform, Snapdragon 8+, is a premium-tier powerhouse delivering power and performance enhancements for the ultimate boost across all on-device experiences. Snapdragon 7 offers a selection of high-end, in-demand features and technologies and enables them for more people around the world. According to the latest findings from Counterpoint Research, IDC, and Strategy Analytics, Qualcomm Technologies is the global leader in premium Android smartphone SoC industry share.

"In the mobile segment, our primary focus is to deliver new, groundbreaking features and technologies to the industry, and for our customers' flagship devices. We implement these features first in our Snapdragon 8-series and then waterfall them down our mobile roadmap," said Christopher Patrick, senior vice president and general manager, mobile handsets, Qualcomm Technologies, Inc. "The new Snapdragon 8+ and 7 Gen 1 both deliver breakthrough user experiences in their respective tiers."