MediaTek today announced the new Dimensity 920 and Dimensity 810 chipsets, the latest additions to its Dimensity 5G family. This debut gives smartphone makers the ability to provide boosted performance, brilliant imaging and smarter displays to their customers.

Designed for powerful 5G smartphones, the Dimensity 920 balances performance, power and cost to provide an incredible mobile experience. Built using the 6nm high-performance manufacturing node, it supports intelligent displays and hardware-based 4K HDR video capture, while also offering a 9% boost in gaming performance compared to its predecessor, the Dimensity 900.

Qualcomm is trying to get into the PC space with their mobile Snapdragon chips, which offer great battery and decent performance. However, so far only Apple managed to get the right formula for developing custom low-power, high-performance chips. It is exactly Apple's M1 processor in question that Qualcomm intends to mimic. According to the recent interview with Qualcomm's new CEO Cristiano Amon, we are informed that Qualcomm plans to produce laptop chips that would directly compete with Apple's. That means that, despite the ecosystem differences of Apple M1 (macOS) and Qualcomm Snapdragon (Windows-on-Arm), the company wants to deliver equal if not better performance and great battery life.

With the recent acquisition of Nuvia, Qualcomm has a team of very talented engineers to back up its claims. The company also recently hired some of the developers behind Apple's M1 chip. The company notes that it will be using only the best solutions for its upcoming SoC, which will include a 5G modem. Mr. Amon has also noted the following:

We needed to have the leading performance for a battery-powered device. If Arm, which we've had a relationship with for years, eventually develops a CPU that's better than what we can build ourselves, then we always have the option to license from Arm.

GLOBALFOUNDRIES (GF ), the global leader in feature-rich semiconductor manufacturing, today announced it is expanding its global manufacturing footprint with the construction of a new fab on its Singapore campus. In partnership with the Singapore Economic Development Board and with co-investments from committed customers, GF's more than US $4B (S$5B) investment will play an integral role in meeting the growing demand for the company's industry-leading manufacturing technologies and services to enable companies worldwide to develop and scale their business.

In a virtual groundbreaking ceremony, Singapore Minister for Transport and Minister-in-charge of Trade Relations S. Iswaran and Mubadala Investment Company Managing Director and Group CEO H.E. Khaldoon Khalifa Al Mubarak, were joined by: UAE Ambassador to Singapore H.E. Jamal Abdulla Al Suwaidi; Singapore Ambassador to the UAE H.E. Kamal R Vaswani; Singapore Economic Development Board Managing Director Chng Kai Fong; GF Board Chairman Ahmed Yahia Al Idrissi; along with GF executives including CEO Tom Caulfield; CFO David Reeder; SVP and Head of Global Operations KC Ang; SVP of Global Sales Juan Cordovez; VP of Human Resource for APAC and International Fabs Janice Lee; and VP of Technology Development in Singapore Dr. Soh Yun Siah.

GLOBALFOUNDRIES (GF ), the global leader in feature-rich semiconductor manufacturing, and GlobalWafers Co., Ltd. (GWC), one of the top silicon wafer manufacturers in the world, today announced an $800 million agreement to add 300 mm silicon-on-insulator (SOI) wafer manufacturing and expand existing 200 mm SOI wafer production at GWC's MEMC facility in O'Fallon, Missouri.

The silicon wafers produced by GWC are key input materials for semiconductors and an integral part of GF's supply chain. The wafers are used in GF's multi-billion dollar manufacturing facilities, or fabs, where they are used to manufacture the computer chips that are pervasive and vital to the global economy. Today's announcement expands GF's domestic silicon wafer supply from the United States.

Samsung Electronics Co., Ltd. today unveiled the Galaxy Book Go and Galaxy Book Go 5G, new additions to the Galaxy Book lineup, powered by the latest Qualcomm Snapdragon compute platforms. The Galaxy Book Go series provides more choices at accessible prices to consumers looking to achieve more anytime, anywhere.

"PCs continue to enable our digital lives, helping us connect to our friends and family, work remotely, and find outlets for creativity and relaxation," said Woncheol Chai, SVP and Head of Experience Planning Team, Mobile Communications Business, Samsung Electronics. "The Galaxy Book Go series is built for today's mobile-first users, who expect seamless communication, sustained productivity, and immersive entertainment—all in one device. With the new addition to the Galaxy Book, Samsung offers wider options to our consumers to choose a device that best fits their needs."

Intel CEO Pat Gelsinger, speaking at the company's 2021 Computex Opening Keynote address stated that the explosive demand for chips caused by recent inflections of technology, accelerated by the COVID-19 pandemic, has resulted in demand outstripping supply by such extent, that it could "still take a couple of years for the ecosystem to address the shortages."

Gelsinger detailed how the world of information technology is at its biggest crossroads ever, with the emergence of Cloud, 5G, AI, and smarter edge computing changing the way people work, learn, and interact. This has caused a huge growth in the demand for semiconductors straining technology supply chains around the world. Gelsinger stated that his company is working with partners across the technology ecosystem to increase output to meet demand. He detailed how Intel has nearly doubled its own chip wafer manufacturing capacity over the past four years. "But while the industry has taken steps to address near-term constraints, it could still take a couple of years for the ecosystem to address chip shortages of foundry capacity, substrate, and components.

Today at Computex 2021, Intel announced two new additions to the lineup of 11th Gen Intel Core processors. These new processors, combined with Intel's co-engineering work with independent software vendors (ISVs) and original equipment manufacturers (OEMs), continue Intel's leadership in mobile compute—delivering the world's best processors for thin-and-light Windows-based laptops. Intel also introduced its first 5G product for the next generation of PC experiences, Intel 5G Solution 5000, following the previously announced collaboration with MediaTek and Fibocom.

"We've taken the world's best processor for thin-and-light Windows laptops and made the experience even better with the addition of our two new 11th Gen Intel Core processors with Intel Iris Xe graphics. In addition, we know real-world performance and connectivity are vital to our partners and the people who rely on PCs every day, so we're continuing that momentum with more platform capabilities and choice in the market with the launch of our first 5G product for PCs: the Intel 5G Solution 5000," said Chris Walker, Intel corporate vice president and general manager of Mobility Client Platforms.

Owing to the impact of the COVID-19 pandemic in 2020, not only did LED revenue experience a downward trajectory, but this decline also reached a magnitude rarely seen in recent years, according to TrendForce's latest investigations. However, as vaccinations begin taking place in 1H21, the LED market's long-stifled demand is expected to rebound from rock bottom. Hence, global LED market revenue will likely undergo a corresponding recovery this year as well, with a forecasted US$16.53 billion, an 8.1% increase YoY, in 2021. Most of this increase can be attributed to four major categories, including automotive LED, Mini/Micro LED, video wall LED, and UV/IR LED.

MediaTek today announced the new Dimensity 900 5G chipset, the latest addition to its Dimensity 5G family. The Dimensity 900 chipset, built on the 6nm high-performance manufacturing node, supports Wi-Fi 6 connectivity, ultra-fast FHD+ 120Hz displays and a 108MP main camera for an all-around incredible experience. "Dimensity 900 brings a suite of connectivity, display and 4K HDR visual enhancements to high-tier 5G smartphones and gives brands great design flexibility for their 5G portfolios," said Dr. JC Hsu, Corporate VP and GM of MediaTek's Wireless Communications Business Unit. "The chipset's support for 5G and Wi-Fi 6 ensures users get the most of out their devices with super-fast and reliable connectivity."

The Dimensity 900 chipset is integrated with a 5G New Radio (NR) sub-6GHz modem with carrier aggregation and support for bandwidth up to 120 MHz. The chipset is equipped with an 8-core central processing unit (CPU) consisting of two Arm Cortex-A78 processors with a clock speed of up to 2.4 GHz and six Arm Cortex-A55 cores operating at up to 2.00 GHz. Dimensity 900 supports flagship LPDDR5 memory and UFS 3.1 storage, and can adapt to a 120 Hz screen refresh rate, bringing excellent performance improvements and a seamless experience to 5G mobile devices.

IBASE Technology Inc. (TPEx: 8050), IBASE, a leading provider of industrial motherboards and embedded systems, launches its latest 3.5" SBC IB953 powered by 11th Gen Intel Core processors (codenamed Tiger Lake). Measuring 146 x 102 mm in a compact footprint, the single board computer offers impressive I/O and computing performance, making it an ideal platform for a broad range of demanding applications in factory automation, machine vision, healthcare, as well as retail environments.

The IB953 features a 5G compatible M.2 3052 socket and the latest 11th Gen. Intel Core and Celeron processors built on 10 nm SuperFin process, delivering up to 25% faster performance and greater AI acceleration. With the Intel Core i7-1185G7 (IBASE model IB953AF-I7) comes the new Iris Xe (Xe-LP) graphics architecture supporting 96 EUs (Execution Units) which equals 768 cores and runs at 1.35 GHz, an increase of 250 MHz over the previous 11-gen graphics to provide up to twice the performance and improved power efficiency. The graphics engine's hardware acceleration can drive up to four simultaneous 4K HDR displays (via 2x DisplayPort + eDP and LVDS).

As the global economy enters the post-pandemic era, technologies including 5G, WiFi6/6E, and HPC (high-performance computing) have been advancing rapidly, in turn bringing about a fundamental, structural change in the semiconductor industry as well, according to TrendForce's latest investigations. While the demand for certain devices such as notebook computers and TVs underwent a sharp uptick due to the onset of the stay-at-home economy, this demand will return to pre-pandemic levels once the pandemic has been brought under control as a result of the global vaccination drive. Nevertheless, the worldwide shift to next-gen telecommunication standards has brought about a replacement demand for telecom and networking devices, and this demand will continue to propel the semiconductor industry, resulting in high capacity utilization rates across the major foundries. As certain foundries continue to expand their production capacities this year, TrendForce expects total foundry revenue to reach a historical high of US$94.6 billion this year, an 11% growth YoY.

NVIDIA today announced the NVIDIA BlueField -3 DPU, its next-generation data processing unit, to deliver the most powerful software-defined networking, storage and cybersecurity acceleration capabilities available for data centers.

The first DPU built for AI and accelerated computing, BlueField-3 lets every enterprise deliver applications at any scale with industry-leading performance and data center security. It is optimized for multi-tenant, cloud-native environments, offering software-defined, hardware-accelerated networking, storage, security and management services at data-center scale.

Qualcomm Technologies, Inc. announced the latest addition to its 7-series portfolio, the Qualcomm Snapdragon 780G 5G Mobile Platform. Snapdragon 780G is designed to deliver powerful AI performance and brilliant camera capture backed by the Qualcomm Spectra 570 triple ISP and 6th generation Qualcomm AI Engine, allowing users to capture, enhance, and share their favorite moments seamlessly. This platform enables a selection of premium-tier features for the first time in the 7-series, making next generation experiences more broadly accessible.

"Since introducing the Snapdragon 7-series three years ago, more than 350 devices have launched based on 7-series mobile platforms. Today, we are continuing this momentum by introducing the Snapdragon 780G 5G Mobile Platform," said Kedar Kondap, vice president, product management, Qualcomm Technologies, Inc. "Snapdragon 780G was designed to bring in-demand, premium experiences to more users around the world."

The emergence of the COVID-19 pandemic in 1H20 seemed at first poised to devastate the IC design industry. However, as WFH and distance education became the norm, TrendForce finds that the demand for notebook computers and networking products also spiked in response, in turn driving manufacturers to massively ramp up their procurement activities for components. Fabless IC design companies that supply such components therefore benefitted greatly from manufacturers' procurement demand, and the IC design industry underwent tremendous growth in 2020. In particular, the top three IC design companies (Qualcomm, Broadcom, and Nvidia) all posted YoY increases in their revenues, with Nvidia registering the most impressive growth, at a staggering 52.2% increase YoY, the highest among the top 10 companies.

Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc., has completed its acquisition of the world-class CPU and technology design company, NUVIA for $1.4 billion before working capital and other adjustments.

"The world-class NUVIA team enhances our CPU roadmap, extending Qualcomm's leading technology position with the Windows, Android and Chrome ecosystems," said Cristiano Amon, President and CEO-Elect, Qualcomm Incorporated. "The broad support of this acquisition from across industries validates the opportunity we have to provide differentiated products with leading CPU performance and power efficiency, as on-demand computing increases in the 5G era."

Demand in the global foundry market remains strong in 1Q21, according to TrendForce's latest investigations. As various end-products continue to generate high demand for chips, clients of foundries in turn stepped up their procurement activities, which subsequently led to a persistent shortage of production capacities across the foundry industry. TrendForce therefore expects foundries to continue posting strong financial performances in 1Q21, with a 20% YoY growth in the combined revenues of the top 10 foundries, while TSMC, Samsung, and UMC rank as the top three in terms of market share. However, the future reallocation of foundry capacities still remains to be seen, since the industry-wide effort to accelerate the production of automotive chips may indirectly impair the production and lead times of chips for consumer electronics and industrial applications.

TSMC has been maintaining a steady volume of wafer inputs at its 5 nm node, and these wafer inputs are projected to account for 20% of the company's revenue. On the other hand, owing to chip orders from AMD, Nvidia, Qualcomm, and MediaTek, demand for TSMC's 7 nm node is likewise strong and likely to account for 30% of TSMC's revenue, a slight increase from the previous quarter. On the whole, TSMC's revenue is expected to undergo a 25% increase YoY in 1Q21 and set a new high on the back of surging demand for 5G, HPC, and automotive applications.

Addressing the demands of the modern data center, Xilinx, Inc. (NASDAQ: XLNX) today announced a range of new data center products and solutions, including a new family of Alveo SmartNICs, smart world AI video analytics applications, an accelerated algorithmic trading reference design for sub-microsecond trading, and the Xilinx App Store.

Today's most demanding and complex applications, from networking and AI analytics to financial trading, require low-latency and real-time performance. Achieving this level of performance has been limited to expensive and lengthy hardware development. With these new products and solutions, Xilinx is eliminating the barriers for software developers to quickly create and deploy software-defined, hardware accelerated applications on Alveo accelerator cards.

Intel and Google Cloud today announced a collaboration to develop telco cloud reference architectures and integrated solutions for communication service providers to accelerate 5G deployment across multiple network and edge locations.

"Communications service providers can adopt cloud-native technologies to harness the potential of 5G both as a connectivity solution and as a business services platform to deliver applications to the network edge," said Shailesh Shukla, vice president and general manager of networking at Google Cloud. "Expanding on our work with the telecommunications industry, we are excited to work with Intel to help customers plan, test and deploy the technology and infrastructure needed to accelerate the delivery of cloud-native 5G for consumer and enterprise use cases."

Driven by such factors as the continued development of autonomous driving technologies and the build-out of 5G infrastructure, the demand for automotive memories will undergo a rapid growth going forward, according to TrendForce's latest investigations. Take Tesla, which is the automotive industry leader in the application of autonomous vehicle technologies, as an example. Tesla has adopted GDDR5 DRAM products from the Model S and X onward because it has also adopted Nvidia's solutions for CPU and GPU. The GDDR5 series had the highest bandwidth at the time to complement these processors. The DRAM content has therefore reached at least 8 GB for vehicles across all model series under Tesla. The Model 3 is further equipped with 14 GB of DRAM, and the next-generation of Tesla vehicles will have 20 GB. If content per box is used as a reference for comparison, then Tesla far surpasses manufacturers of PCs and smartphones in DRAM consumption. TrendForce forecasts that the average DRAM content of cars will continue to grow in the next three years, with a CAGR of more than 30% for the period.

Qualcomm Technologies, Inc. today announced the Snapdragon X65 5G Modem-RF System, its fourth-generation 5G modem-to-antenna solution. It is the world's first 10 Gigabit 5G and the first 3GPP release 16 modem-RF system, which is currently sampling to OEMs and targeting commercial device launches in 2021. Snapdragon X65 is the Company's biggest leap in 5G solutions since the commercialization of its first modem-RF system. It is designed to support the fastest 5G speeds currently available with fiber-like wireless performance and makes best use of available spectrum for ultimate network flexibility, capacity and coverage. In addition to the Snapdragon X65, Qualcomm Technologies also announced the Snapdragon X62 5G Modem-RF System, a modem-to-antenna solution optimized for mainstream adoption of mobile broadband applications.

Xilinx, Inc.,, the leader in adaptive computing, today announced that the company is supplying its leading UltraScale+ technology to Fujitsu Limited for its O-RAN 5G radio units (O-RUs). Fujitsu O-RUs using Xilinx technology will be deployed in the first O-RAN-compliant 5G greenfield networks in the U.S. Fujitsu is also evaluating Xilinx RFSoC technology to further reduce cost and power consumption for additional future site deployments.

Fujitsu O-RUs are ideal for a broad-range of spectrum and multi-band applications for 5G O-RAN networks. The Xilinx UltraScale+ devices used within Fujitsu O-RUs deliver the best balance of cost economies as well as the adaptability and scalability required for the evolving needs of 5G O-RAN network requirements. Additionally, Xilinx will continue to work with other O-RAN ecosystem partners to ensure continued validation of the hardware and software necessary for world-class 5G networks.

Intel Corporation today announced it has invested a further US $475 million in Intel Products Vietnam (IPV). This new investment is in addition to Intel's US$1 billion investment to build a state-of-the-art chip assembly and test manufacturing facility in Saigon Hi-Tech Park (SHTP), first announced in 2006. This takes Intel's total investment in its Vietnam facility to US $1.5 billion.

"As of the end of 2020, Intel Products Vietnam has shipped more than 2 billion units to customers worldwide. We're very proud of this milestone, which shows both how important IPV is to helping Intel meet the needs of its customers all around the world, and why we continue to invest in our facilities and team here in Vietnam," said Kim Huat Ooi, vice president of Manufacturing and Operations and general manager of Intel Products Vietnam Co. Ltd.

Qualcomm Technologies, Inc. unveiled the Qualcomm Snapdragon 870 5G Mobile Platform, a follow-on to the flagship Snapdragon 865 Plus, which features an enhanced Qualcomm Kryo 585 CPU prime core clock speed of up to 3.2 GHz. The new Snapdragon 870 is designed to deliver increased performance across the board for geared-up gameplay with insanely fast Qualcomm Snapdragon Elite Gaming experiences, truly global 5G sub-6 GHz and mmWave, and ultra-intuitive AI.

"Building upon the success of Snapdragon 865 and 865 Plus, the new Snapdragon 870 was designed to address OEM and mobile industry requirements," said Kedar Kondap, vice president, product management, Qualcomm Technologies, Inc. "Snapdragon 870 will power a selection of flagship devices from key customers including Motorola, iQOO, OnePlus, OPPO, and Xiaomi."

Dell Technologies (NYSE:DELL) unveiled new products and software that reimagine work so anyone can perform at their best. With a new portfolio of intelligent, collaborative and sustainable devices, Dell is transforming work experiences to give people greater flexibility to work from anywhere.

"People's expectations of their technology continue to evolve. It's why we push beyond barriers to create devices that offer better experiences and are more integrated into our lives," said Ed Ward, senior vice president, Client Product Group, Dell Technologies. "Our new intelligent PCs make it possible for us to work smarter and collaborate easier, so we can give our best selves in all that we do. Secure, sustainable and smart: that's the way forward for PCs."

NETGEAR, Inc. (NASDAQ: NTGR), the worldwide leading provider of award-winning advanced networking products for home and office has today announced, during the historic virtually-hosted CES 2021, the introduction of the world's first all-purpose WiFi 6E router, the Nighthawk RAXE500 Tri-band WiFi router. Promised to elevate the WiFi experience by providing speeds up to 10.8Gbps, this latest addition to the Nighthawk line of performance routers ushers in a new era of fast connectivity on the new 6Ghz band, free of interference and congestion.

Working, learning, and video streaming from home has placed greater demands on home WiFi networks. Devices in these ultra-connected households have been in a constant contest for bandwidth on crowded WiFi networks. WiFi 6E resolves these congestion issues by adding previously unavailable 6GHz WiFi spectrum that can be used to broadcast WiFi signals and connect to more devices with faster speeds and reliability. Up until the introduction of WiFi 6E, WiFi routers have been limited to the 2.4GHz and 5GHz bands. The new third 6GHz band will dramatically increase the capacity of networks to support more devices.