V-COLOR today introduced a series of overclocking memory RDIMM kits for workstations powered by AMD Ryzen Threadripper 7000WX processors on the WRX90 platform that features 8-channel DDR5 memory. The kits include 8 RDIMMs, with densities ranging between 16 GB per RDIMM (128 GB per kit), to 96 GB per RDIMM (768 GB per kit); and comes in speeds ranging between DDR5-5600 and DDR5-7200. The best part? These modules feature AMD EXPO profiles, which should make enabling their advertised speeds as easy as a couple of clicks in the motherboard's UEFI setup program.

An EXPO profile not just applies the kit's memory speed, timings, and voltages, but also several sub-timings and settings that are specific to the AMD platform, which are not found on Intel. V-COLOR has tested its overclocking RDIMMs on popular AMD WRX90 chipset motherboards, namely the ASRock WRX90 WS EVO, ASUS PRO WS WRX90E-SAGE SE, and certain unreleased WRX90 workstation motherboards by Supermicro. Although the RDIMMs lack heatspreaders for the DRAM chips, V-COLOR is including what it calls "micro heatsinks" for the PMIC and RCDs. The RCD in particular is crucial to get Threadrippers to operate at speeds such as DDR5-7200. The kits should be available starting today, with all models available from mid-March. The company didn't reveal pricing.

The current crop of PCIe Gen 5 based M.2 NVMe SSDs run scorching hot to deliver sequential transfer speeds of 10 GB/s, requiring some massive cooling solutions with tiny fans. All this might change, as Phison, a leading SSD controller manufacturer, unveiled three new controllers at the 2024 International CES. One of these that stands out, is the PS5031-E31T, which is built on the 7 nm node, and could power the first Gen 5 SSDs delivering 10 GB/s without elaborate cooling solutions. This is a big upgrade from the 12 nm node used by their first Gen 5 controllers. The PS5031-E31T is a DRAMless controller meant for mainstream Gen 5 SSDs. This controller has a 4-channel flash interface (16 CE), a PCI-Express 5.0 x4 host interface, supports capacities of up to 8 TB, and is claimed by Phison to offer sequential transfer rates of up to 10.8 GB/s, and up to 1500K IOPS random access; exceeding the fastest Gen 4 SSDs.

Phison also updated its high-end controller lineup with the new PS5026-E26 Max14um. This is a variant of the E26 that's designed for the upcoming Micron B58R NAND flash chip that offers 2400 MT/s per channel transfers. Over the 8-channel interface of the E26, this finally unlocks sequential transfer speeds exceeding 14 GB/s reads, and 12.7 GB/s sequential writes. This is merely a revision of the existing E26 with updated power-optimized firmware, the underlying silicon is identical. The E26 Max14um is the first controller to surpass 1000 MB/s in all three PCMark 10 storage tests. We have a sample of an SSD powered by the E26 Max14um in our labs, and will post our review soon.

Chinese chipmaker Montage Technology has unveiled new data center processors under its Jintide brand based on Intel's latest Emerald Rapids Xeon architecture. The 5th generation Jintide lineup offers anywhere from 16-core to 48-core options for enterprise customers needing advanced security specific to China's government and enterprise requirements. Leveraging a long-running joint venture with Intel, Jintide combines standard high-performance Xeon microarchitectures with added on-die monitoring and encryption blocks, PrC (Pre-check) and DSC (Dynamic Security Check), which are security-hardened for sensitive Chinese use cases. The processors retain all core performance attributes of Intel's vanilla offerings thanks to IP access, only with extra protections mandated by national security interests. While missing the very highest core counts, the new Jintide chips otherwise deliver similar Emerald Rapids features like 8-channel DDR5-5600 memory, 80 lanes of speedy PCIe 5.0, and elevated clock speeds over 4.0 GHz at peak. The Jintide processors have 2S scaling, which allows for dual-socket systems with up to 96 cores and 192 threads.

Pricing remains unpublished but likely carries a premium over Intel list prices thanks to the localized security customization required. However, with Jintide uniquely meeting strict Chinese government and data regulations, cost becomes secondary for target customers needing compliant data center hardware. After matching lockstep with Intel's last several leading Xeon generations, Jintide's continued iteration highlights its strategic value in enabling high-performance domestic infrastructure as China eyes IT supply chain autonomy. Intel gets expanded access to the growing Chinese server market, while Chinese partners utilize Intel IP to strengthen localized offerings without foreign dependency. It manifests the delicate balance of advanced chip joint ventures between global tech giants and rising challengers. More details about the SKUs are listed in the table below.

Thanks to the information from Windows Report, we have received numerous details regarding Qualcomm's upcoming Snapdragon Elite X chip for laptops. The Snapdragon Elite X SoC is built on top of Nuvia-derived Oryon cores, which Qualcomm put 12 off in the SoC. While we don't know their base frequencies, the all-core boost reaches 3.8 GHz. The SoC can reach up to 4.3 GHz on single and dual-core boosting. However, the slide notes that this is all pure "big" core configuration of the SoC, so no big.LITTLE design is done. The GPU part of Snapdragon Elite X is still based on Qualcomm's Adreno IP; however, the performance figures are up significantly to reach 4.6 TeraFLOPS of supposedly FP32 single-precision power. Accompanying the CPU and GPU, there are dedicated AI and image processing accelerators, like Hexagon Neural Processing Unit (NPU), which can process 45 trillion operations per second (TOPS). For the camera, the Spectra Image Sensor Processor (ISP) is there to support up to 4K HDR video capture on a dual 36 MP or a single 64 MP camera setup.

The SoC supports LPDDR5X memory running at 8533 MT/s and a maximum capacity of 64 GB. Apparently, the memory controller is an 8-channel one with a 16-bit width and a maximum bandwidth of 136 GB/s. Snapdragon Elite X has PCIe 4.0 and supports UFS 4.0 for outside connection. All of this is packed on a die manufactured by TSMC on a 4 nm node. In addition to marketing excellent performance compared to x86 solutions, Qualcomm also advertises the SoC as power efficient. The slide notes that it uses 1/3 of the power at the same peak PC performance of x86 offerings. It is also interesting to note that the package will support WiFi7 and Bluetooth 5.4. Officially coming in 2024, the Snapdragon Elite X will have to compete with Intel's Meteor Lake and/or Arrow Lake, in addition to AMD Strix Point.

Phison Electronics, a global leader in NAND controllers and storage solutions, announced today that the company has expanded its portfolio of PCIe 5.0 high-speed transmission solutions with PCIe 5.0, CXL 2.0 compatible redriver and retimer data signal conditioning IC products. Leveraging the company's deep expertise in PCIe engineering, Phison is the only signal conditioners provider that offers the widest portfolio of multi-channel PCIe 5.0 redriver and retimer solutions and PCIe 5.0 storage solutions designed specifically to meet the data infrastructure demands of artificial intelligence and machine learning (AI+ML), edge computing, high-performance computing, and other data-intensive, next-gen applications. At the 2023 Open Compute Project Global Summit, the Phison team is showcasing its expansive PCIe 5.0 portfolio, demonstrating the redriver and retimer technologies alongside other enterprise NAND flash, illustrating a holistic vision for a PCIe 5.0 data ecosystem to address the most demanding applications of the AI-everywhere era.

"Phison has focused industry-leading R&D efforts on developing in-house, chip-to-chip communication technologies since the introduction of the PCIe 3.0 protocol, with PCIe 4.0 and PCIe 5.0 solutions now in mass production, and PCIe 6.0 solutions now in the design phase," said Michael Wu, President & General Manager, Phison US. "Phison's accumulated experience in high-speed signaling enables our team to deliver retimer and redriver design solutions that are optimized for top signal integration, low power usage, and high temperature endurance, to deliver interface speeds for the most challenging compute environments."

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announced today the latest AORUS Gen5 12000 SSD with an M.2 2280 form factor. Harnessing the power of a PCIe 5.0 controller with ultra-fast 3D-TLC NAND Flash, the AORUS Gen5 12000 SSD delivers a boosted performance of more than 70% over PCIe 4.0 SSDs with easy installation and superb capability. Equipped with the ultimate thermal design of M.2 Thermal Guard Extreme, the AORUS Gen5 12000 SSD becomes the perfect choice for power users, content creators, and gamers.

With PCIe 5.0 support on new motherboard platforms, the bandwidth and transfer performance are raised to the next level. The AORUS Gen5 12000 SSD is equipped with the latest Phison PS5026-E26 8-channel controller, providing users with superior control of random read speeds. Along with an over 232-layer stack structure of 3D-TLC NAND Flash and a built-in LPDDR4 cache design, the AORUS Gen5 12000 SSD unleashes the full potential of PCIe 5.0 performance with 12 GB/s ultra-fast access speed, which is more than a 70% increase compared to its predecessor. Furthermore, with AORUS optimized Direct Storage support, the AORUS Gen5 12000 SSD brings next-level performance with optimized stability.

V-COLOR Technology Inc, a leading memory manufacturer is proud to present the revolutionary DDR5 OC R-DIMM Workstation Memory in configurations 16 GB, 32 GB, and 64 GB. Designed for use with the latest unlocked Intel Xeon W-2400X and W-3400X series processors on respective Intel W790 chipset-based motherboards supporting quad-channel and octo-channel memory

Extreme Overclocking: Experience unrivaled power with OC R-DIMM Workstation Memory. Engineered for extreme overclocking capabilities, this memory module dares to push the limits and achieve unparalleled speeds. With v-color technology, effortlessly unlock the full potential of workstations and conquer even the most demanding tasks. Intel XMP 3.0 Certified: Seamlessly compatible with Intel XMP 3.0, OC R-DIMM Workstation Memory ensures a hassle-free and optimized experience. Effortlessly enhance system's performance and achieve the perfect balance between speed and stability.

Transcend Information (Transcend), a leading manufacturer of embedded memory products, is proud to release the latest U.2 NVMe SSD, the UTE210T. Designed for generative AI, high-performance computing (HPC), and big data analytics, this powerful SSD is built with the 112-layer 3D NAND flash, an 8-channel controller, and a PCIe Gen 4x4 interface. Experience high speeds, low latency, and minimal power consumption with your systems, but most of all, enjoy sequential R/W speeds of up to 7,200/6,500 MB/s and stable and reliable system performance that supports various applications of use.

Compliant with the NVMe 1.4 specification, Transcend's UTE210T comes bundled with a U.2 connector, enabling the drive to configure the PCIe interface with the U.2 backplane, ultimately enhancing transfer stability without compromising your servers. To address the demanding workloads associated with AI, its built-in DRAM provides exceptional random read speeds, which not only reduces NAND flash Program/Erase cycles (P/E cycles), but effectively extends drive lifespan to help manage a wide range of workloads. The UTE210T comes with up to 8 TB of storage capacity, ensuring servers and data centers are able to process vast amounts of data without compromising system performance.

XIGMATEK is one of the pioneers of high-end air cooling solutions. The company is putting up a strong presence at Computex 2023, with the introduction of several new coolers and fans. Although a specialist with large heatsinks and air-based CPU coolers, the company showcased its flagship AIO liquid CPU cooler, the FROZR-O II. Designed squarely as a high-end AIO solution, the FROZR-O II is characterized by a smart pump-block that features a round, true-color display that interfaces with software over USB, and displays real-time CPU temperature (as measured by the cooler's software), pump and fan RPM, and pretty much anything you can program it to (such as pretty backgrounds, clan logos, etc).

The models shown at Computex were the FROZR-O II 360 (360 mm x 120 mm radiator), and its white alter-ego, the FROZR-O II 360 Arctic. Each of the three included PWM fans feature fluid-dynamic bearings, turn at speeds of up to 1,800 RPM, pushing up to 82.2 CFM of airflow, and 2.55 mm H₂O static pressure. The radiator is 27 mm-thick and is made of aluminium channels. Besides software-based control, the cooler includes a Galaxy II 8-channel ARGB controller with an RF remote, so you can cycle between the various lighting presets. The cooler supports Intel LGA1700 and AMD AM5 sockets.

Transcend Memory introduced a high-capacity 4 TB variant of its MTE250H (with heatsink) and MTE250S (without heatsink) M.2 NVMe Gen 4 SSD that the company debuted in October 2022. The former comes with an extruded-aluminium heatsink, while the latter has a graphene-coated film on top of the hot components. The drive offers an NVMe 1.4-compliant 8-channel controller that uses a DRAM cache; paired with 3D TLC NAND flash memory. The drives take advantage of PCI-Express 4.0 x4 host interface. The 4 TB variant offers sequential transfer rates of up to 7.5 GB/s reads, with up to 6.7 GB/s writes; up to 540k IOPS random reads, and up to 440k IOPS random writes; along with a rated endurance of 3,120 TBW. Transcend is backing these drives with 5-year warranties.

ASUS today announced that ASUS W790 workstation motherboards support ECC R-DIMM DDR5 RAM at up to 6800 MHz, unleashing class-leading overclocking capability to unlock even more performance potential. ASUS W790 workstation motherboards feature the memory capability of up to 2 TB RDIMM DDR5 memory to power the next generation of compute-intensive professional workloads. In addition, ASUS have been working with market-leading memory partners including G.SKILL, Kingston, and V-Color to establish multiple memory validations and to widely support 8-channel and quad-channel memory architectures. The Pro WS W790E-SAGE SE now supports up to 128 GB (8x16 GB) at 6800 MT/s, and the Pro WS W790-ACE supports up to 64 GB (4x16 GB) of DDR5 RAM at 6800 MT/s. This painstakingly cultivated collection of device validations helps ensure that an ASUS W790 workstation build supports a wide variety of scenarios.

Choosing the right CPU cooler for a workstation build can also be a challenge, because CPU sockets and form factors are different from those used in desktops. Therefore, ASUS has partnered with cooling experts including Enermax, EK and Noctua to offer air and liquid coolers for the LGA4677 socket used by the latest Intel Xeon workstation processors. These solutions are designed to offer optimal heat transfer and heat dissipation capacity through the cooler base and then to coolant tubes, heat pipes and radiator fins.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to announce an all-new G.SKILL Zeta R5 memory series of high-performance, overclocked DDR5 R-DIMM memory kits. Designed for use with the latest unlocked Intel Xeon W-2400X and W-3400X series processors on respective Intel W790 chipset-based motherboards that has quad-channel and octo-channel memory support. Available in specifications up to DDR5-6400 CL32 and in large kit capacity of up to 256 GB (32 GB x8), the Zeta R5 series DDR5 R-DIMM memory kits are ideal for workstation systems built for content creation, 3D graphics, or scientific computing.

With the Intel W790 platform, memory overclock support to DDR5 R-DIMM memory is officially introduced, allowing workstation systems to achieve higher memory speeds than R-DIMM based on standard JEDEC specifications. Taking advantage of this new feature set, the G.SKILL Zeta R5 series DDR5 R-DIMM memory kits are equipped with Intel XMP 3.0 profiles for easy overclocking, allowing users to gain additional memory bandwidth and performance by simply enabling XMP in BIOS.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today announced the evolutionary AORUS Gen4 7300 SSD, which is the upgraded PCIe 4.0 SSD with read speed up to 7300 MB/s. Enhanced by the select PCIe 4.0 controller with advanced 3D-TLC NAND Flash, it provides superior performance than the previous generation PCIe 4.0 NVMe SSD. AORUS Gen4 7300 SSD with M.2 2280 interface comes in two capacity variants of 2 TB and 1 TB, along with a unique packaging design of separated SSD and heatsink packing to offer more flexible thermal solutions. Meanwhile, the GIGABYTE exclusive GCC software management platform provides the instant overview and adjustment of SSD status for a cool storage operation with high performance.

AORUS Gen4 7300 SSD equips the select Phison E18 8-channel controller, which provides users with ultimate random access rate, as well as the high-speed 3D-TLC NAND Flash and SLC cache design that brings the PCIe 4.0 into full play. Under the real test, AORUS Gen4 7300 SSD can reach a read speed up to 7300 MB/s and a write speed up to 6850 MB/s, which is faster than the previous gen. PCIe 4.0 NVMe SSD, two times faster than PCIe 3.0 SSD, and up to 13 times faster than SATA SSD. Enhanced by the multi-core architecture of the E18 controller, AORUS Gen4 7300 SSD not only improves AI multitasking to lessen the bottleneck of system performance, but powers up content creators, gamers, and users eager for extreme performance.

At the 2023 International CES, we caught a hold of Phison, makes or arguably the most popular SSD controllers, which sprung to prominence on being the first to market with PCIe Gen 4 NVMe controllers, and now hopes to repeat it with PCIe Gen 5. We'd been shown a reference-design Phison E26-powered M.2 SSD, along with some hardware specs of the controller itself. The drive itself isn't much to look at—a standard looking M.2-2280 drive with a PCI-Express 5.0 x4 host interface, and the Phison E26 controller with its shiny IHS being prominently located next to a DDR4 memory chip, and two new-generation Micron Technology 3D NAND flash memory chips.

The Phison E26 controller, bearing the long-form model number PS5026-E26, is an NVMe 2.0 spec client-segment SSD controller. It has been built on the TSMC 12 nm FinFET silicon-fabrication node. The controller features an integrated DRAM controller with support for DDR4 and LPDDR4 memory types for use as DRAM cache. Its main flash interface is 8-channel with 32 NAND chip-enable (CE) lines, support for TLC and QLC NAND flash, a dual-CPU architecture, and hardware-acceleration for AES-256, TCG-Opal, and Pyrite. The controller features Phison's 5th generation LPDC ECC and internal RAID engines. For its reference-design 2 TB TLC-based drive, Phison claims sequential transfer rates of up to 13.5 GB/s reads, with up to 12 GB/s writes. The 4K random-access performance is rated at up to 1.5 million IOPS reads, with up to 2 million IOPS writes.

Team Group, the global leader in industrial memory modules, launches the brand's first industrial grade PCIe Gen4x4 M.2 2280 SSD, P845-M80. With the adoption of the ultra-fast Gen 4 x4 interface, it delivers an exceptional reading/writing performance for a large data amount. Equipped with BiCS 5 112-layer 3D NAND flash memory, it is a highly cost-competitive solution that accelerates the development of biomedical innovation and digital medicine applications. P845-M80 comes in a maximum capacity of 2 TB and meets the NVMe 2.0 standards. Its bandwidth and data transmission speed are twice that of its predecessor PCIe Gen3, making it even more ideal for the transmission of large amounts of data. Meanwhile, its 3K P/E cycles make it the best memory solution in both performance and durability.

In the wake of the global pandemic, science and digital medicine is rapidly on the rise in innovative biomedical fields. In response to the significant increase in the demand for high-performance image processing and stable storage, Team Group introduces the PCIe Gen 4 x4 industrial grade SSD with the adoption of an 8-channel controller and optional patented graphene and aluminium fin heat dissipation technologies. It effectively reduces the thermal energy generated from high-speed reading and writing and maintains system stability. The patented graphene heat dissipation technology (US invention patent number: US 110,513,92 B2 / Taiwan invention patent number: I703921) features a small volume and agility in application, suitable for machines of smaller sizes. Whereas, the patented aluminium fin heat dissipation technology (Taiwan utility model patent number: M541645) enables maximum heat dissipation and prolongs product service life. Both technologies are novel options for biomedical innovators, offering stability, high speed, and low latency.

Intel's Sapphire Rapids CPUs are designed to represent the company's finest work for the server/enterprise and high-end desktop processor (HEDT) sector. According to Wccftech, we have an idea of the launch date and availability of the HEDT Sapphire Rapids Workstation counterparts, codenamed Fishhawk Falls. The Intel Sapphire Rapids-WS CPU and W790 motherboard unveil should happen on the 7th week of 2023, which means the 12th Feb - 18th Feb launch window. For availability, April of 2023 is scheduled to meet the needs of the upcoming HEDT clients. With a declining HEDT market, Intel is in no rush to deliver the CPUs, with priority being the server Sapphire Rapids designs.

As a reminder, the HEDT models should come with up to 56 cores and 112 threads, 105 MB of L3 cache, 350 W TDP, and 112 PCIe Gen 5.0 lanes. For memory, the platform support 8-channel DDR5-4400 (1DPC) / DDR5-4800 (2DPC) configurations with a capacity of up to 4 TB.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today the latest AORUS Gen5 10000 SSD with 10 GB/s read speed. Enhanced by the new generation PCIe 5.0 controller with ultra-fast 3D-TLC NAND Flash, AORUS Gen5 10000 SSD provides boosted performance of more than 55% over PCIe 4.0 SSDs and comes in 1 TB to 4 TB capacity variants using an M.2 2280 interface to deliver easy installation and superb capability. Additionally, the separate SSD and heatsink offers more flexibility in system build and thermal options for users. GIGABYTE's exclusive SSD Tool Box application provides users real-time status of SSD to leverage performance, thermal, stability and capability.

"With PCIe 5.0 support on new motherboard platform, the bandwidth and transfer performance are raised to the next level. As the first manufacturer to have both motherboards and SSD product lines in the market, GIGABYTE is also the first to unveil the AORUS Gen5 10000 SSD. This new product brings blistering fast storage performance with ultra durability and compatibility to users for optimal quality and performance." said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division.

Nextorage Corporation will launch a PCIe Gen 4.0 x4 ("PCIe 4.0") M.2 2280 NVMe SSD "NEM-PA series" for the USA market from March. The products are initially sold on Amazon. Nextorage was established on October 1, 2019, as a company specializing in the memory storage solutions business led by engineers and staff who built on 20 years of history in memory storage at Sony.

The NEM-PA series is an M.2 2280 SSD equipped with a PCIe 4.0 / NVMe 1.4 controller and a 3D TLC NAND, and comes with a heatsink for heat dissipation. The drive achieves sequential read up to 7,300 MB/s, sequential write up to 6,900 MB/s, and random read/write up to 1,000 K IOPS (in a PC environment). The NEM-PA series delivers both high-speed loading and smooth gaming experience.

MSI Is ready with the monstrous WS WRX80 motherboard for AMD Ryzen Threadripper PRO workstation processors. Slotted in the company's MSI PRO lineup, the board is based on the AMD WRX80 chipset, features the sWRX8 CPU socket, and comes with out of the box support for Ryzen Threadripper PRO 5000WX processors based on the "Zen 3" architecture, as well as previous-generation Threadripper 3000WX "Zen 2" processors. Built in the E-ATX form-factor, the board draws power from a 24-pin ATX, two 8-pin EPS, as well as two 6-pin PCIe power. It uses an expensive 14-layer PCB, and the CPU VRM solution is made up of 11 phases, using 105 A power-stages.

The sWRX8 socket is flanked by eight DDR4, each with a dedicated 1DPC path to the processor's 8-channel memory interface. There are seven PCI-Express 4.0 x16 slot, all wired to the processor and running at full x16 bandwidth. There could be as many as four M.2 NVMe slots with PCI-Express 4.0 x4 wiring, with an included M.2 to PCIe card with four additional M.2 slots. Other storage options include two U.2 ports, and eight SATA 6 Gbps. Networking options include 10 GbE, 2.5 GbE, and Wi-Fi 6E with Bluetooth 5.2. There's also an ASpeed AST2600 BMC IPMI remote-management chip with its dedicated 1 GbE management port. USB connectivity includes 20 Gbps USB 3.2 Gen 2x2 ports. We'll know more about this board as Threadripper PRO 5000WX nears retail availability. Right now it's exclusive to the Lenovo ThinkCenter P620 pre-built workstation.

AMD today launched its first Ryzen Threadripper processors based on the "Zen 3" microarchitecture, with the Ryzen Threadripper PRO 5000WX series. Designed to be drop-in compatible with workstations and motherboards based on the AMD WRX80 chipset, these processors come in core-counts of up to 64-core/128-thread, with an enormous I/O offering that includes 8-channel DDR4 memory with ECC support, and a 128-lane PCI-Express 4.0 root complex. The biggest change over the previous generation Threadripper PRO 3000WX series has to be the use of "Zen 3" CCDs, each with 8 CPU cores, sharing a common 32 MB of L3 cache. AMD isn't using the "Zen 3" chiplets with 3DV Cache.

The full AMD PRO management feature-set from Ryzen PRO is available on these processors, including PRO Security, PRO Management, and a special support channel that includes planned parts and software availability. What's more, AMD has been working with ISVs of most professional content-creation software since the past generation of Ryzen Threadripper PRO, to optimize their software for the processors (high core-counts, NUMA topology, etc.). The benefits of these are shared with all generations of Threadrippers. Although all parts in the Threadripper PRO 5000WX series are rated for a TDP of 280 W, AMD claims to have worked on power-management, offering up to 67 percent lower power per core, compared to the competition (2P Xeon Scalable Platinum 8280).

AMD is preparing to update its Ryzen Threadripper PRO line of workstation processors, with product announcements slated for January 2022, along the sidelines of CES, with availability slated for March 8, 2022, according to a VideoCardz report. The new Ryzen Threadripper PRO 5000 series processors are likely to combine "Zen 3+" CCDs (6 nm, featuring 3D Vertical Cache memory), with full sWRX8 I/O that includes 128 PCI-Express Gen 4 lanes, and 8-channel DDR4 memory. There are no sTRX4 options on the horizon.

What's interesting with the lineup is that CPU core-counts range all the way from 12-core/24-thread to 64-core/128-thread. Past generations of Threadripper WX stuck with higher core-counts (32 and up). The series begins with the Threadripper PRO 5945WX (12-core/24-thread), followed by the PRO 5955WX (16-core/32-thread), the PRO 5965WX (24-core/48-thread), PRO 5975WX (32-core/64-thread), and the 64-core/128-thread PRO 5995WX. There's no 48-core part in the stack. The TDP of all these chips is rated at 280 W.

Intel today launched its newest generation Intel Xeon W-3300 processors, available today from its system integrator partners. Built for advanced workstation professionals, Intel Xeon W-3300 processors offer uncompromised performance, expanded platform capabilities, and enterprise-grade security and reliability in a single-socket solution.

Intel Xeon W-3300 processors are intelligently engineered to push the boundaries of performance, with a new processor core architecture that transforms for what expert workstation users can accomplish on a workstation.

The Intel Xeon W-3300 processors are designed for next-gen professional applications with heavily threaded, input/output-intensive workloads. Use cases stretch across artificial intelligence (AI), architecture, engineering, construction (AEC), and media and entertainment (M&E). With a new processor core architecture to transform efficiency and advanced technologies to support data integrity, Intel Xeon W-3300 processors are equipped to deliver uncompromising workstation performance.

Intel today, in its 2021 International Supercomputing Conference presentation, revealed that certain next-generation Xeon "Sapphire Rapids" SKUs come with on-package high-bandwidth memory (HBM). Given the context of its presentation, these could be special SKUs designed for high-density HPC setups, in which the processor package includes certain amount of "PMEM" (package memory), besides the processor's 8-channel DDR5 memory interface.

The size of the HBM PMEM, and its position in the memory hierarchy, were detailed, too. Given its high-density applications, PMEM may not serve as a victim cache for the processor, but rather be capable of serving as main memory, with none of the DDR5 DRAM channels populated with DIMMs. On machines with DIMMs, the PMEM will serve as a victim cache for the processor's on-die last-level cache, accelerating the memory I/O. "The next-generation of Intel Xeon Scalable processors (code-named "Sapphire Rapids) will offer integrated High Bandwidth Memory (HBM), providing a dramatic boost in memory bandwidth and a significant performance improvement for HPC applications that operate memory bandwidth-sensitive workloads. Users can power through workloads using just High Bandwidth Memory or in combination with DDR5," says Intel.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today the latest AORUS Gen4 7000s Prem. SSD with up to 7 GB/s read speed while optimizing passive thermal dissipation, which promises no throttling under long-lasting operation. Through the SSD Tool Box application, users can have an instant control on overall operation of SSD.

AORUS Gen4 7000s Prem. SSD adopts the PCIe 4.0 NVMe M.2 interface and it equips the latest Phison E18 selected 8-channel controller, which provides users with ultimate random access rate, as well as the high speed 3D-TLC NAND Flash and SLC cache design that brings the PCIe 4.0 into full play. With the read speed up to 7 GB/s and write speed up to 6.85 GB/s, AORUS Gen4 7000s Prem. SSD can power up content creators, gamers, and users eager for extreme performance.

AMD today announced its 3rd generation EPYC (7003 series) enterprise processors, codenamed "Milan." These processors combine up to 64 of the company's latest "Zen 3" CPU cores, with an updated I/O controller die, and promise significant performance uplifts and new security capabilities over the previous generation EPYC 7002 "Rome." The "Zen 3" CPU cores, AMD claims, introduce an IPC uplift of up to 19% over the previous generation, which when combined by generational increases in CPU clock speeds, bring about significant single-threaded performance increases. The processor also comes with large multi-threaded performance gains thanks to a redesigned CCD.

The new "Zen 3" CPU complex die (CCD) comes with a radical redesign in the arrangement of CPU cores, putting all eight CPU cores of the CCD in a single CCX, sharing a large 32 MB L3 cache. This the total amount of L3 cache addressable by a CPU core, and significantly reduces latencies for multi-threaded workloads. The "Milan" multi-chip module has up to eight such CCDs talking to a centralized server I/O controller die (sIOD) over the Infinity Fabric interconnect.