Jonsbo today unveiled the HXW ARGB White AIO CPU cooler series. Available in two variants based on radiator size—240 mm and 360 mm—these coolers are characterized by a custom-design 32 mm-thick set of 120 mm fans that push higher air-flow thanks to their greater impeller sweep area compared to 25 mm-thick fans, which allows you to run them at lower RPMs for comparable cooling performance, making them potentially quieter. The 240 mm variant is capable of handling thermal loads of up to 260 W, while the 360 mm variant is specified for up to 300 W thermal loads.

The cuboidal-shaped pump-block features a unique vertical ARGB diffuser stripe design. The pump turns at speeds of up to 2,500 RPM, with noise-level under 30 dBA. The included fans do speeds ranging from 900 to 1,800 RPM, pushing 40.1 to 85.4 CFM of airflow, with a maximum noise output of 35.1 dBA. Among the CPU socket types supported by these coolers are LGA1700, AM5, AM4, LGA1200, and LGA115x. The company didn't reveal pricing.

Leading global motherboard manufacturer, ASRock, has built new BIOS decreasing AM5 booting time. ASRock is dedicated to providing products with the best user-experience. The new BIOS providing better compatibility and shorter booting time has been built, and it will be available on ASRock website after product launch. Besides, all ASRock X670E/X670 motherboards support BIOS flashback, which allows users to update their motherboards to the newest BIOS with merely 24-pin power supply and a USB drive.[Editor's Note: This news post will provide more context.]

Kingston FURY, the gaming division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, announced today the addition of AMD EXPO certified DDR5 modules to the Kingston FURY Beast line of memory. Always aiming to provide the latest options to gamers and enthusiasts, these new overclock specs modules and kits are optimized for AMD's upcoming AM5 platform with two factory tuned profiles, plus one user customizable profile.

Qualified by the world's leading motherboard manufacturers, the Kingston FURY Beast line offers aggressive speeds up to 6000MT/s1 with a bold low-profile heatspreader design. Now with AMD EXtended Profile for Overclocking, users can trust that their selected Kingston FURY Beast DDR5 modules and kits are exactly what their AMD AM5 system needs to maximize performance, while also maintaining stability.

Here are some of the first pictures of the GoodRAM IRDM Ultimate PCIe Gen 5 M.2 NVMe SSD. Built in the M.2-2580 form-factor, the drive combines Phison's upcoming E26 controller, with what's likely KIOXIA 162-layer 3D TLC NAND flash memory. The controller takes advantage of the PCI-Express 5.0 x4 interface, and NVMe 2.0 protocol, offering sequential transfer speeds of around 10 GB/s reads, with around 9.5 GB/s writes. The drive comes in capacities of 1 TB, 2 TB, and 4 TB. It comes with a fairly large heatsink included. AMD Socket AM5 will be the first platform to feature CPU-attached PCIe Gen 5 M.2 slots, which goes on sale by late-September. The first PCIe Gen 5 NVMe SSDs, according to AMD, should be here by November.

EK, the market leader in high-end water cooling for PC products, wishes to inform existing and future customers regarding the compatibility of our existing cooling solutions with the highly anticipated AMD Socket AM5 platform. Compared to Socket AM4, the backplate mounting hole pattern is still 54 x 90 mm and uses UNC 6-32 threads, but the AM5 motherboards now have an integrated CPU-socket backplate. The stock backplate is best kept untouched since removing it also means fiddling with the CPU loading mechanism and exposing the socket pins. To avoid such risks, some EK products need to be updated, but fear not, as compatibility is handled for all existing EK products.

With AMD announcing an October 2022 debut of its mid-range Socket AM5 motherboard chipset, the AMD B650E and B650; manufacturers appear to be ready with a fairly broad selection of products targeting various price-points. The B650E and B650 are expected to have a lighter I/O feature-set than the X670E/X670, and will enable manufacturers to sell motherboards at prices starting at $125. Two of the leading manufacturers, ASUS and ASRock, are ready with their product lists.

The initial ASUS motherboard lineup for the AMD B650E and B650 chipsets include just one product in the mainline Prime series, as many as four from the TUF Gaming series, and two from the ROG Strix series. From these, only one is based on the B650E (meaning, it gets a PCI-Express 5.0 x16 slot besides the M.2 Gen 5 slot). The others are based on the vanilla B650 (PCI-Express 4.0 x16 slot besides M.2 Gen 5 slots). None of the boards has more than 4 SATA 6 Gbps ports. The board to watch out for will be the ROG Strix B650E-E Gaming WiFi, as it could bring several high-end features into the mid-range, and if previous generations of AMD chipset are anything to go by, the B650/E retains CPU overclocking support.

ASRock is planning to introduce a new line of motherboards probably targeted at value-conscious creators, with the new LiveMixer series. The company's first LiveMixer product is based on the AMD B650 mid-range chipset. The Socket AM5 motherboard's PCB was leaked to the web, revealing a fairly mid-range feature-set, notwithstanding the 17-phase VRM. We spy at least three M.2 slots, from which one should be Gen 5, an M.2 E-key slot for the WLAN card; addon slots that include a PCI-Express 4.0 x16, and two Gen 3 x4 slots. For all its talk of live-mixing, the onboard audio solution appears to be rather basic, with jacks for just 6-channels, and the CODEC pin-out seems to be made out for an entry-level CODEC, such as the ALC892.

AMD CEO Lisa Su, who has supervised the company's rise from the ashes, looked to assuage fears of reduced stock for the launch of AMD's next-gen Ryzen 7000 series CPUs. Hardware enthusiasts being understandably burned from the last generation of GPU and CPU's lack of availability (and ensuing scalping practices), the CEO in today's announcement of the Ryzen 7000 series carried a promise: "It is true that if you look at the past 18 months there have been a number of things, whether its capacity limitations or logistics," she said. "From an AMD standpoint, we have dramatically increased our overall capacity, in terms of wafers, as well as substrates and on the back end. So with our launch of Zen 4 we don't expect any supply constraints."

AMD's Zen 4 family is being launched with the new AM5 socket, which AMD says will live through 2025+ for subsequent CPU releases. The company has managed to increase IPC by 13% while decreasing the overall CCD size by 18% compared to that of Zen 3 (reducing the area/cost impact of adding integrated graphics throughout the lineup). Frequencies have gone up to a maximum 5.7 GHz thanks to smart circuitry redesign and TSMC's 5 nm node. AMD says its Ryzen 7000 can thus be expected to provide up to 29% higher single-core and 45% higher multi-core performance. Of course, with macroeconomics being what they are, and recent reports on lack of low-price chips throughout the market, it's not only the availability of Ryzen 7000 CPUs that matters: AM5 motherboards and DDR5 memory chip stocks have to be taken into account as well. But all in all, AMD seems to be prepared for a successful and quantity-adequate launch.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce two new DDR5 memory series, the Trident Z5 Neo and Flare X5 series, designed for the new AMD Ryzen 7000 Series processors and 600 series motherboards. The Trident Z5 Neo family offerings include RGB (Trident Z5 Neo RGB) and non-RGB (Trident Z5 Neo) variants. Programmed with AMD EXPO technology and created with hand-screened memory ICs, the Trident Z5 Neo and Flare X5 series allow PC enthusiasts, gamers, and overclockers to experience the performance of the new AMD AM5 platform.

Designed for DDR5 memory-enabled AMD Ryzen 7000 Series desktop processors, the Trident Z5 Neo and Flare X5 series are pre-programmed with the latest AMD EXPO (EXtended Profiles for Overclocking) memory profiles, which allow users to easily overclock the memory kits. By simply enabling the AMD EXPO profile in the BIOS with a compatible motherboard and processor, users can unleash overclocked memory speeds on AMD Ryzen 7000 Series processors.

AMD today announced the Ryzen 7000 series "Zen 4" desktop processors. These debut the company's new "Zen 4" architecture to the market, increasing IPC, performance, with new-generation I/O such as DDR5 and PCI-Express Gen 5. AMD hasn't increased core-counts over the previous-generation, the Ryzen 5 series is still 6-core/12-thread, the Ryzen 7 8-core/16-thread, and Ryzen 9 either 12-core/24-thread, or 16-core/32-thread; but these are all P-cores. AMD is claiming a 13% IPC uplift generation over generation, which coupled with faster DDR5 memory, and CPU clock speeds of up to 5.70 GHz, give the Ryzen 7000-series processor an up to 29% single-core performance gain over the Ryzen 5000 "Zen 3."

At their press event, AMD showed us an up to 35% increase in gaming performance over the previous-generation, and an up to 45% increase in creator performance (which is where it gets the confidence to stick to its core-counts from). The "Zen 4" CPU core dies (CCDs) are built on the TSMC 5 nm EUV (N5) node. Even the I/O die sees a transition to 6 nm (N6), from 12 nm. The switch to 5 nm gives "Zen 4" 62 percent lower power for the same performance, or 49% more performance for the same power. versus the Ryzen 5000 series on 7 nm. The "Zen 4" core along with its dedicated L2 cache is 50% smaller, and 47% more energy efficient than the "Golden Cove" P-core of "Alder Lake."

EK, the leading computer cooling solutions provider, is announcing the latest generation of EK-Quantum Velocity² water blocks. These socket-specific water blocks are engineered specifically for the upcoming AMD AM5 socket and Ryzen 7000-series CPUs. Like its AM4 predecessor, the AM5 water block features EK-Matrix7 compatibility, which means it's designed according to the standard where the product's height and port distance are managed in 7 mm increments.

The product deploys a modified Velocity² cooling engine optimized for Ryzen 7000-series CPUs to ensure the best cooling performance and optimal coolant flow. While the mounting hole pattern of the new AM5 socket is still 54 x 90 mm, the AM5 motherboards now have an integrated CPU socket backplate with #UNC 6-32 threads, therefore requiring a new mounting system.

Possible launch SEP pricing of AMD's Ryzen 7000 series "Zen 4" desktop processors leaked to the web by Wccftech, which appear to be similar to those of the Ryzen 5000 "Zen 3" at launch. AMD will launch a slim set of four SKUs in its first round of these processors—the flagship Ryzen 9 7950X (16-core/32-thread), followed by the second-best Ryzen 9 7900X (12-core/24-thread), the Ryzen 7 7700X (8-core/16-thread), and the mid-range Ryzen 5 7600X (6-core/12-thread).

Apparently, the series debuts with the Ryzen 5 7600X at $299, or the same SEP of the Ryzen 5 5600X at launch. The Ryzen 7 7700X launches at $449. The Ryzen 9 7900X comes in at $549, and the flagship Ryzen 9 7950X at $799, which again, is identical to that of the 5950X. Besides processors, motherboard vendors are expected to launch their first Socket AM5 motherboards, debuting with the AMD X670E and X670 chipsets. There's talk of mid-range chipsets such as the B650 and B650E, but we haven't seen any confirmed products show up on motherboard vendors' websites, yet. Pre-launch pricing for the X670E and X670 put them at a significant premium over the current Socket AM4 flagship boards based on the X570. Besides processors and motherboards, we could see announcements from memory vendors launching their first DDR5 memory products to feature AMD EXPO technology.

AMD's upcoming launch of Ryzen 7000 series processors will bring an entirely new AM5 platform that will enable newer technologies and protocols. We have DDR5 memory and PCIe 5.0 connection with everything at level five. However, the upcoming chipsets AMD has designed to work alongside the new processors will be available in several variants. There will be regular X670 and B650 versions that support either a PCIe 5.0 GPU or a PCIe 5.0 M.2 NVIMe SSD. Today, we got a confirmation that not only the big X670 chipset has an "E" or "Extreme" version, but its smaller brother B650 as well. With X670E and B650E, users get both PCIe 5.0 connectivity for their GPU and M.2 NVIMe SSD. For more information, we have to wait for AMD's official launch information later today.

BIOSTAR finalized the design of its flagship Socket AM5 motherboard, the X670E Valkyrie. While the PCB design appears identical to the board BIOSTAR showed at Computex 2022, there are some aesthetic improvements, such as some ARGB lighting elements with acrylic diffusers on the large VRM heatsink and the chipset heatsink. The board draws power from a combination of 24-pin ATX, and two 8-pin EPS connectors. Powering the CPU is a 22-phase VRM that uses 105 A DrMOS. The Socket AM5 is wired to four DDR5 slots, two PCI-Express 5.0 x16 slots (x16/NC or x8/x8), and a couple of M.2 Gen 5 slots.

Storage options on the BIOSTAR X670E Valkyrie include two M.2 slots with PCI-Express 5.0 x4 wiring, two additional M.2 slots with PCI-Express 4.0 x4 wiring, and six SATA 6 Gbps ports. Besides the Gen 5 x16 slots from the CPU, there's one PCI-Express 4.0 x16 (electrical x4) slot wired to the chipset, and an M.2 E-key slot for the WLAN card. There's no WLAN module included with the board, but there's preparation that includes two coaxial antenna jacks, and a cable leading up to the M.2 E-key slot. Wired networking comes from a 2.5 GbE interface powered by an Intel i225 controller. The board is expected to go on sale alongside Ryzen 7000 series processors, in September.

Just in time for the launch of the new AMD processors in September 2022, we can announce that all CPU coolers and All-in-One solutions in the Alphacool product range are compatible with AMD's AM5 socket. The required mounting kit is included with all coolers and AIOs and enables the new Ryzen 7000 Series processors to be water-cooled with Alphacool products right from the start.

Someone with access to an AMD Ryzen 7 7700X "Zen 4" processor posted one of the first pictures of an AMD Ryzen 7 7700X "Zen 4" desktop processor installed on a motherboard. The picture shows the 7700X seated in the Socket AM5. The retention brace of the socket only clutches against two side protrusions of the IHS. AMD explained in its recent interview with us that the odd shape of the IHS is to accommodate the various electrical SMDs outside the IHS for better thermal management. With the processor installed, we can see that they're exposed and not covered up by the retention brace. The IHS is taller than the brace, so there will be some passive ventilation for the SMDs. Installing a Ryzen 7000 processor on Socket AM5 involves familiar steps to installing Intel mainstream-desktop processors for the past 15 years. This particular processor has the "D" marking on the IHS, which denotes a non-retail sample (possibly a review sample).

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced its readiness for the new AMD Ryzen 7000 Series processors and accompanying motherboard chipsets. Featuring all new Zen 4 CPU architecture, AMD Ryzen 7000 Series chips deliver a substantial performance boost over previous-generation processors, and CORSAIR has the components to help support this generational upgrade. Those looking to build a new AMD system can take advantage of the free online CORSAIR PC Builder to help shortlist compatible parts for their new system.

CORSAIR has been working closely with AMD in the lead-up to the AMD Ryzen 7000 Series launch, and has already updated its PC Builder database to include the new processors so that you can curate a parts list for a powerful new AMD PC in minutes. The CORSAIR PC Builder takes your chosen CPU, graphics card, and motherboard and checks them for compatibility against a vast database of PC parts, coming up with a comprehensive list of CORSAIR parts guaranteed to work with your system. From a correctly sized case and appropriate fans, to a PSU rated to power your build and even RGB lighting, the CORSAIR PC Builder takes the guesswork out of building your new Ryzen 7000 Series powered PC. The CORSAIR PC Builder is even able to intelligently optimize the parts selected, so that you don't overspend or bottleneck your build with a mismatched component.

PC Canada has drawn first blood in registering pricing for AMD's upcoming Ryzen 7000 series, the successor to the successful 5000 series. As spotted by renowned leaker momomo_us and shared on Twitter, the specialist retailer based in Canada listed pricing for the Ryzen 7 7600X, 7700X, 7900X and 7950X CPUs. The pricing, if representative, shows an average increase that averages to 10%-12% across SKUs when compared to the previous generation Ryzen. The prices could be placeholders based on the retailers' own expectations, so this information should be taken with a grain of salt (or two).

After conversion from CAD to US dollars, pricing settles at $340 for the Ryzen 7 7600X ($299 for the 5600X at launch, for a 13% premium); $494 for the Ryzen 7 7700X (against the later-released, $299 Ryzen 7 5700X for a 65% premium); $625 for the Ryzen 9 7900X ($549 for the launch Ryzen 9 5900X, for a 13% increase) and finally, the Ryzen 9 7950X for $906 (against the Ryzen 9 5950X's $799 asking price, for another 13% premium).

AMD has reportedly pushed market-availability date of its next-generation Ryzen 7000 series "Zen 4" desktop processors from September 15 to September 27, 2022. This would clash with the rumored product-announcement date of the Intel 13th Generation Core "Raptor Lake" processor series. If true, this is possibly a move designed to prevent Intel from sharing performance numbers of Ryzen 7000-series processors in the product-announcement presentation of "Raptor Lake," as Intel can only compare the chips it is announcing with competing AMD products that are available in the market at the time.

A September 27 market availability could still mean a late-August product announcement along the sidelines of Gamescom, with product reviews in the following weeks. It's just that the market availability date is now pushed to late-September. Intel's launch cycle for "Raptor Lake" could see a late-September announcement, but it remains to be seen if product availability is immediate, or timed weeks later. The 13th Gen Core "Raptor Lake" processor is built on the same LGA1700 package as current "Alder Lake," and compatible with existing Intel 600-series motherboards with a UEFI firmware update; although will be launched alongside new Intel 700-series chipset motherboards. AMD's Ryzen 7000-series product launch will be timed with those of compatible Socket AM5 motherboards based on the AMD 600-series chipset, and a new line of DDR5 memory modules featuring the AMD EXPO technology.

G.Skill is readying variants of its DDR5 memory series that feature the AMD EXPO technology. A rival to Intel XMP 3.0, EXPO makes it easy to use overclocked memory modules with AMD Ryzen 7000 series platforms, by applying the advertised settings of the memory with one click in the motherboard's UEFI setup program, or Ryzen Master. What sets EXPO apart from XMP 3.0 is that it includes not just the memory frequency and main timings, but also fine-grained settings that are unique to the AMD platform. It's also different from DOCP, which was essentially a motherboard UEFI setup program-based feature that translates XMP settings to AMD-compatible settings on a "nearest neighbor" principle.

We've learned from earlier reports that DDR5-6000 will be the "sweetspot" memory frequency for the Ryzen 7000 "Raphael" processor, much in the same way DDR4-3600 is for the Ryzen 5000 "Vermeer," as this is when you'll be able to run the FClk at its highest possible frequency—3000 MHz in case of Raphael and 1800 MHz in case of Vermeer—without engaging a 1:2 divider between FClk and memory clock. At least one G.Skill SKU featuring EXPO has been confirmed, the Trident Z5 "F5-6000J3038F16G." G.Skill already sells Trident Z5 DDR5-6000 kits in the market, but those only feature XMP 3.0, and run the memory at CL30-40-40-96 instead of CL30-38-38-96 that the EXPO-equipped kit will. This is because the EXPO profile includes all the various AMD-specific sub-timings needed to tighten the tRCD, tRP, and tRAS. Various memory manufacturers are expected to announce AMD EXPO memory kits late-August, alongside Socket AM5 motherboards, and the Ryzen 7000 processors themselves; with market availability expected in mid-September.

GIGABYTE today showed off its upcoming AMD X670E and X670 chipset-based Socket AM5 motherboard lineup for the Ryzen 7000-series "Zen 4" desktop processors due to launch in September. Given AMD's push for PCI-Express Gen 5 connectivity beyond just the PEG slot, the new X670E chipset, with multiple Gen 5 M.2 slots, covers the upper end of the GIGABYTE AORUS motherboard series, with the X670E AORUS Xtreme and the X670E AORUS Master. The lower-end of the lineup is based on the X670, with the AORUS Pro and AORUS Elite tiers.

Both the X670E and X670 offer at least one PCI-Express 5.0 x16 slot (which can be further split into two x8 Gen 5 slots); and at least one PCI-Express 5.0 x4 M.2 NVMe slot wired to the AM5 processor. The X670E is differentiated in having an additional Gen 5 M.2 slot that is wired to the SoC, besides downstream Gen 5 PCIe connectivity from the chipset. The AORUS Xtreme leads the pack with a monstrous 18-phase VRM that uses 105 A DrMOS, an 8-layer PCB, four Gen 5 M.2 slots, the highest-grade onboard audio with ESS-made headphones DAC, AQuantia 10 GbE, WiFi 6E, and a plethora of overclocker-friendly features.

It's pretty clear that we're getting very close to the launch of AMD's AM5 platform and the Ryzen 7000-series CPUs, with spec details and even pricing brackets tipping up online. Wccftech has posted what the publication believes will be the lineup we can expect to launch in just over a month's time, if rumours are to be believed. The base model is said to be the Ryzen 5 7600X, which the site claims will have a base clock of 4.7 GHz and a boost clock of 5.3 GHz. There's no change in processor core or thread count compared to the current Ryzen 5 5600X, but the L2 cache appears to have doubled, for a total of 38 MB of cache. This is followed by the Ryzen 7 7700X, which starts out a tad slower with a base clock of 4.5 GHz, but it has a slightly higher boost clock of 5.4 GHz. Likewise here, the core and thread count remains unchanged, while the L2 cache also gets a bump here for a total of 40 MB cache. Both these models are said to have a 105 W TDP.

The Ryzen 9 7900X is said to have a 4.7 GHz base clock and a 5.6 GHz boost clock, so a 200 MHz jump up from the Ryzen 7 7700X. This CPU has a total of 76 MB of cache. Finally the Ryzen 9 7950X is said to have the same base clock of 4.5 GHz as the Ryzen 7 7700X, but it has the highest boost clock of all the expected models at 5.7 GHz, while having a total of 80 MB cache. These two SKUs are both said to have a 170 W TDP. Price wise, from top to bottom, we might be looking at somewhere around US$700, US$600, US$300 and US$200, so it seems like AMD has adjusted its pricing downwards by around $100 on the low-end, with the Ryzen 7 part fitting the same price bracket as the Ryzen 7 5700X. The Ryzen 9 7900X seems to have had its price adjusted upwards slightly, while the Ryzen 9 7950X seems to be expected to be priced lower than its predecessors. Take these things with the right helping of scepticism for now, as things can still change before the launch.

With AMD making it clear in investor-communications that its next-generation Ryzen 7000 "Zen 4" desktop processors will launch before October 2022; the countdown to their launch started. Wccftech got hold of a possible set of key dates. Apparently, August 28 is the big date on which AMD will formally announce its Ryzen 7000 Socket AM5 desktop processor lineup.

Following the August 28 announcement, the review NDA—the date on which you can read the first reviews of the retail products—is reportedly set at September 13. Market availability follows two days later, starting September 15. This is when you can actually buy the processor and compatible motherboards off the shelves. There's no word on a pre-order date; but it's always advisable to catch reviews before committing to purchase something that ships before launch date. These dates align with a mid-June leak of the launch date by AMD in a retailer promotion meeting held in China.

AMD in its Q2-2022 financial results call with analysts, confirmed that the company's next-generation Ryzen 7000 desktop processors based on the "Zen 4" microarchitecture will debut this quarter (i.e. Q3-2022, or before October 2022). CEO Dr Lisa Su stated "Looking ahead, we're on track to launch our all-new 5 nm Ryzen 7000 desktop processors and AM5 platforms later this quarter with leadership performance in gaming and content creation."

The company also stated that its next-generation Radeon 7000 series GPUs based on the RDNA3 graphics architecture are on-track for launch "later this year," without specifying whether it meant this quarter, which could mean launch any time before January 2023. AMD is also on course to beating Intel to the next-generation of server processors with DDR5 and PCIe Gen 5 support, with its EPYC "Genoa" 96-core processor slated for later this year, as Intel struggles with a Q1-2023 general availability timeline for its Xeon Scalable "Sapphire Rapids" processor.

A possible PCB layout diagram of the ASUS ROG Crosshair X670E APEX motherboard was leaked to the web. We could tell it's the APEX, looking at its 1DPC (one DIMM per channel) memory layout. The ROG APEX line of motherboards are geared toward extreme overclocking, with 1DPC being the best possible memory topology. We could make out several features from this diagram. The board draws power from a combination of 24-pin ATX, two 8-pin EPS, and a 6-pin PCIe. A mammoth 26-phase VRM powers the CPU. The board appears to have its power connectors and onboard buttons angled sideways, making it most suitable for bench rigs.

The AMD Socket AM5 is wired to two DDR5 DIMM slots (one DIMM per channel, with two sub-channels, each); and a PCI-Express 5.0 x16 slot. This splits to a second slot in x8 mode. The third slot is electrical x8, and wired to the X670E chipset. While there are three M.2 slots onboard, this is likely Gen 4 x4. The board's main Gen 5 M.2 slots are located on an included DIMM.2 daughterboard that inserts into a proprietary slot next to the DIMM slots. It's likely that the board offers USB4 connectivity, besides SupremeFX HD audio, Wi-Fi 6E, 2.5 GbE, and an abundance of USB 3.x connectivity in various forms.