The AMD Ryzen 5 7500F CPU has been popping up via various leaks—with no official announcements made despite photos, basic specifications and benchmark results appearing online. Tom's Hardware could not extract a comment directly from Team Red, so it pivoted to inside sources instead to find out more about the mysterious Zen 4 iGPU-less processor. The news site discovered that this model is very likely going to be a Chinese market exclusive—insiders reckon that it will be released closer to the end of this month. Retailers and e-tailers in the region are getting first dibs, with the Ryzen 5 7500F also made available to SIs (system integrators), so pre-built computers featuring this AM5 CPU could be released soon after.

Tom's Hardware believes that the: "Ryzen 5 7500F is very similar to the Ryzen 5 7600 and will operate with a 65 W TDP, and thus have slightly lower boost clock speeds than the 7600." It suspects that a recently published benchmark showing that single-core performance edges past the Ryzen 5 7600X (105 W TDP) is not all that accurate—these results should be "taken with a grain of salt." According to their verified sources, the Ryzen 5 7500F should "perform slightly slower than the regular 65 W Ryzen 5 7600 (non-X)." The article presents some hope that AMD is simply market testing the CPU prior to a possible USA rollout, but insiders indicate that company plans have the Ryzen 5 7500F marked for launch in China only.

Gamers Nexus recently visited AMD's headquarters in Austin, Texas—a previous video documented company employees discussing the history of Zen CPUs, and the showcasing of historical prototypes including (unreleased) Ryzen 9 5950X3D and 5900X3D models. The YouTube channel promised that more AMD HQ tour footage would be shared over the next couple of weeks—their latest upload has (host) Steve Burke talking to representatives from various internal labs.

A notable detail extracted from Team Red's thermal laboratory was an old heat spreader concept for Zen 4 processors—the team evaluated whether a concealed vapor chamber would offer improved cooling performance versus conventional metal solutions. Their tests determined that the extra cost (not disclosed) required to integrate a vapor chamber was not worth the resultant 1°C temperature difference, when lined up against a traditional metal design IHS. AMD confirmed that the concept was not developed further since prototype chips were also found to generate heat exceeding expected normal levels, under continuous long-term workload conditions.

Scythe, the CPU cooling brand originated from Japan is proudly announcing its high-performance flagship dual tower CPU cooler Fuma 3 today. With over 20 years of professional experience accumulated, the Japanese CPU cooling brand Scythe finally launches its new flagship model, the king of dual tower - Fuma 3 Dual Tower CPU cooler. The cutting-edge Fuma 3 twin tower CPU cooler is the true successor of the legendary Fuma 2. Built on the basis of the award-winning Fuma 2 twin tower design concept, the Fuma 3 presents optimized aerodynamic engineering on a new heatsink that yields more efficient heat dissipation and is ready for the most demanding overclocked CPUs.

The sturdy dual tower Fuma 3 is a 154 mm tall high-performance CPU air cooler backed with 6x6mm high-quality nickel-plated heat pipes that work firmly with the premium aluminium heatsink. Thanks to the higher fin density array and a new asymmetrical design, the Fuma 3 obtains increased thermal conductivity which results in improved cooling performance yet better compatibility even on the Mini-ITX motherboards.

A screenshot from Puget Systems benchmark database reveals a new upcoming desktop processor model by AMD, the Ryzen 5 7500F. The screenshot details the 7500F as a 6-core processor, and the machine features an ASUS ROG Strix X670E-F Gaming motherboard, along with an RTX 4080 graphics card. At this point it's hard to tell what the "F" brand extension means in AMD nomenclature. On Intel, it denotes a lack of integrated graphics.

There are two possible theories on what the 7500F could be. One holds that it's a down-rated "Raphael" MCM with a disabled iGPU; while the other holds that it could be based on the 4 nm Phoenix-2 monolithic silicon. Detailed in an older article, the Phoenix-2 is a 137 mm² monolithic silicon that physically features no more than 6 "Zen 4" CPU cores, and an iGPU with just 4 RDNA 3 compute units, besides I/O that's identical to that of the regular 178 mm² 8-core/12-CU Phoenix silicon. Phoenix-2 on AM5 might just end up with a lower bill of materials than a single-CCD "Raphael" MCM.

Update 06:13 UTC: A Korean retailer has posted the first picture of the Ryzen 5 7500F in the flesh. They claim a street price of around $170-180 (KRW equivalent), and availability slated for July 7.

AMD has designed a physically smaller version of its 4 nm "Phoenix" mobile processor silicon. The chip could power lower-end mobile SKUs in the Ryzen 3 and Ryzen 5 series, and it's likely that it could make it to Socket AM5, where it will power Ryzen 3 and lower-end versions of Ryzen 5 desktop processors. Built on the same 4 nm foundry process as the standard "Phoenix" silicon, the so-called "Phoenix 2" or "PHX2" die physically features a 6-core/12-thread CPU based on the "Zen 4" microarchitecture, and a physically smaller iGPU with just two WGPs (workgroup processors), or 4 CU (compute units), which work out to 256 stream processors. This iGPU is based on the same RDNA3 graphics architecture as the one powering the regular "Phoenix" silicon. At this point we don't know if the Ryzen AI component gets the axe, but given AMD's enthusiasm with consumer AI acceleration, the die might just retain it.

The PHX2 die likely retains the I/O of the regular "Phoenix," including a dual-channel (4 sub-channel) DDR5 and LPDDR5 memory interface, and a 24-lane PCI-Express Gen 4 root complex. These changes result in a die that appears to be around three-quarters the size of the regular "Phoenix," with an area of around 137 mm², compared to 178 mm² of the regular "Phoenix." The smaller die will save AMD big on costs and yields. At this time, there are at least two processor models reported to be based on this die, the Ryzen 5 7540U and Ryzen 3 7440U. Both are 15 W to 28 W class mobile processors aimed at thin-and-light notebooks.

Noctua today introduced its new NM-DD1 direct die kit. Developed in cooperation with professional overclocker and direct die cooling expert Roman "der8auer" Hartung, the NM-DD1 is a mounting spacer kit that makes it possible to use a wide range of Noctua CPU coolers on delidded AMD AM5 processors. Removing the processor's integrated heat spreader (delidding) and putting the heatsink directly onto the dies allows for much more efficient thermal transfer and can thereby lower CPU temperatures significantly, with typical gains in the range of 10-15°C.

"Delidding and direct die cooling will void your CPU's warranty and bear a certain risk of damaging it, so this certainly isn't for everyone," explains Roland Mossig (Noctua CEO). "However, the performance gains to be had are simply spectacular, typically ranging from 10 to 15°C but in some cases, we've even seen improvements of almost 20°C in combination with our offset mounting bars, so we're confident that this is an attractive option for enthusiast users. Thanks to Roman for teaming up with us in order to enable customers to implement this exciting tuning measure with our CPU coolers!"

Thermaltake today introduced the UX200 SE ARGB, an updated version of its popular tower-type CPU cooler. The cooler gets several design updates in its second generation, which improve its cooling capacity to 170 W, from 130 W on the original. This includes a heavier aluminium fin-stack with more fins and added surface area for heat-dissipation. It uses a heatpipe direct-touch base, from which four 6 mm-thick copper heat pipe convey heat to the aluminium fin-stack.

The included 120 mm fan features 30,000 hours rated hydraulic bearing, takes in 4-pin PWM input for its main function, turns at speeds ranging between 800 to 1,800 RPM, pushing up to 62.72 CFM of airflow, at up to 25 dBA of noise output. The lighting setup uses a 3-pin addressable RGB input, and has LEDs studded in the impeller hub. With its fan installed, the UX200 SE ARGB measures 122 mm x 61 mm x 156.2 mm (WxDxH), weighing 771 g. There are two color based variants, black (model: CL-P105-AL12SW-A), and white (CL-P116-AL12SW-A). Among the CPU socket types supported are LGA1700, AM5, LGA1200, and AM4. Available now, the UX200 SE ARGB is priced around USD $35.

Gigabyte has added three additional AMD A620 based motherboards to its lineup after the initial two that were announced on the launch day. The three new models are the A620M DS3H, A620M S2H and A620M H, all three models being mATX motherboards. The A620M DS3H is the board with most features and it's the only model to include a VRM heatsink as well as four memory slots. Common features among the three boards include a single PCIe 4.0 x16 slot, a PCIe 3.0 x1 slot, a single PCIe 4.0 M.2 NVMe slot—that supports the slightly wider 2580 form factor—four SATA ports and somewhat surprisingly for this range of boards, a DP 1.4 port and an HDMI 2.1 port.

All three boards also sport Gigabit Ethernet and a Realtek based audio solution, as well as a 90 degree angled USB 3.2 5 Gbps header. The A620M DS3H is the only model that gets a USB Type-C port around the back, but it's limited to 5 Gbps data speeds. All three models also support Gigabyte's QFlash Plus UEFI recovery/flashing solution, making it possible to update the UEFI/BIOS without having a CPU in the board. All three boards support the full range of AM5 CPUs up to 170 W, courtesy of a 5+2+2 PWM design. These might not be the most exciting boards, but they seem like a solid budget range.

In addition to the Ryzen PRO 7045 series mobile processors for commercial notebooks, AMD announced the Ryzen PRO 7000 processors for commercial desktops. These are desktops deployed by medium-large businesses and enterprises in their offices, which remain connected to the enterprise network at all times, and require remote management and security features. This particular segment is addressed by Intel using its 13th Gen Core vPro processors. The Ryzen PRO 7000 processors are based on the Socket AM5 platform, which is ready for next-generation connectivity. AMD is also introducing a new motherboard chipset to go with these processors, although they are compatible with consumer AMD 600-series chipset motherboards.

The Ryzen PRO 7000 series processor models being launched today are based on the "Raphael" MCM, which depending on the model, comes with one or two 5 nm "Zen 4" CCDs, and a 6 nm I/O die. What makes these processors especially formidable compared to past attempts by AMD at commercial desktop processors, is that while the previous-generation chips were based on monolithic APU dies for their integrated graphics; these chips are based on the full-featured MCM for this generation, with integrated graphics as standard. AMD's decision to make integrated graphics standard should prove particularly helpful for adoption in the commercial desktop space.

ZALMAN, of the cooling noise prevention system (CNPS) legacy, introduced a slew of PC cooling products at the 2023 Computex. The lineup was led by the innovative Reserator5 Z-series AIO CPU coolers, which use two sets of impellers in the pump-block. One of these is dedicated for the coolant intake, after the coolant passes through the block's micro-fin lattice, it's picked up by a second impeller, which pushes it to the radiator. The dual-impeller design also provides a degree of redundancy in case one of them fails. This ZALMAN's original design, which it has patented. This cooler comes in two models, the Reserator5 Z24 (240 mm x 120 mm radiator), and the Reserator 5 Z36 (360 mm x 120 mm radiator). The impellers turn at synchronized speeds ranging between 1,000 to 2,100 RPM, while each of the included fans do 800 to 2,000 RPM, pushing up to 77.37 CFM of airflow, at 37 dBA noise output.

The next major AIO series showcased by ZALMAN is the Alpha series, which comes in three variants—Alpha 24 (240 mm x 120 mm radiator), Alpha 28 (280 mm x 140 mm), and Alpha 36 (360 mm x 120 mm). This cooler uses a more traditional single-impeller design, although the pump-block has an interesting design that resembles a heatsink. It's topped with 7-segment LED display that puts out coolant temperature in real-time. The pump runs at speeds of up to 3,200 RPM, while each of the included fans do 500 to 1,800 RPM, pushing up to 71.1 CFM at 38 dBA. Both of ZALMAN's new AIO series support the latest CPU socket types, including LGA1700, AM5, LGA1200, and AM4. Among the air-based CPU coolers shown were the new CNPS13X (single fin-stack with push-pull fans), and the CNPS13X Plus (dual fin-stack). The CNPS13X uses a single large aluminium fin-stack, and two 120 mm fans in push-pull mode. The CNPS13X Plus is a D-type dual-fin-stack cooler, with two included fans. Both coolers come with CPU surface temperature displays.

XIGMATEK is one of the pioneers of high-end air cooling solutions. The company is putting up a strong presence at Computex 2023, with the introduction of several new coolers and fans. Although a specialist with large heatsinks and air-based CPU coolers, the company showcased its flagship AIO liquid CPU cooler, the FROZR-O II. Designed squarely as a high-end AIO solution, the FROZR-O II is characterized by a smart pump-block that features a round, true-color display that interfaces with software over USB, and displays real-time CPU temperature (as measured by the cooler's software), pump and fan RPM, and pretty much anything you can program it to (such as pretty backgrounds, clan logos, etc).

The models shown at Computex were the FROZR-O II 360 (360 mm x 120 mm radiator), and its white alter-ego, the FROZR-O II 360 Arctic. Each of the three included PWM fans feature fluid-dynamic bearings, turn at speeds of up to 1,800 RPM, pushing up to 82.2 CFM of airflow, and 2.55 mm H₂O static pressure. The radiator is 27 mm-thick and is made of aluminium channels. Besides software-based control, the cooler includes a Galaxy II 8-channel ARGB controller with an RF remote, so you can cycle between the various lighting presets. The cooler supports Intel LGA1700 and AMD AM5 sockets.

MSI in its Computex 2023 booth demonstrated its inverted cabling motherboard concept dubbed "Project Zero." The idea behind this is that all the connectors and headers of the motherboard are located on the reverse side of the PCB, and compatible cases have cutouts at just the right places, so all the cabling—including power—is routed to the motherboard in the crawl-space behind the motherboard tray. No cable is visible on the obverse side of the case (with notable exceptions being the CPU cooler cables, and the power cables of your graphics card). The prototype motherboard MSI showed off has Socket AM5, and is based on the AMD B650 chipset. The demo build reveals that it's preferable to have individually stranded EPS and 24-pin ATX cables, versus sleeved/braided ones that are tougher to bend and route.

Liquid cooling major Bitspower, which sells both DIY and AIO liquid cooling solutions under its own brand, as well as serves as OEM for other brands, came out with a comprehensive lineup of new products at the 2023 Computex. We begin our stroll of their booth with the Summit lineup of CPU water-blocks and CPU area monoblocks. The company showed us their Summit series LGA4677 block for Intel Xeon W workstations, made of nickel-plated copper and POM acetal tops. These completely dwarf the company's Summit series blocks for AMD sWRX8/sTRX4 Threadripper sockets. The company also showed off a series of CPU area monoblocks. These are motherboard model-specific rather than socket-specific, because they have to be tailored not just for the socket, but also the components in its vicinity, such as CPU VRM.

The innovative new Summit M Silent is designed to reduce noise caused due to coolant flow (by bubbles and vortexes). This is essentially a nickel-plated copper plate that guides coolant through the micro-fin lattice. While the block material is copper with acrylic top, these blocks have additional brushed aluminium top-plates. The Summit M Pure lacks this feature, and is a typical copper+acetal block. Both the Summit M Pure and Summit M Silent come in Socket LGA1700 and Socket AM5 variants. The AMD variants have design-level optimization for the MCM layout of "Raphael," "Vermeer," and "Matisse." Bitspower also showed us a plethora of new fittings, including 45° extenders, 90° extenders, rotary fittings, and static ones. These come in four color options—black, brass, white, and chrome. All four are made of brass. The company also showed us their CR series flat-type and cuboidal reservoirs with provision for integrated pumps.

Newegg has been running various discount promotions on Ryzen 7000-series desktop processors over the past month, but their latest offer finally affects one of AMD's lower end models. The Ryzen 5 7600X CPU is on offer over at the American e-tailer - by using a time limited promo code (MDSCS2342) when checking out you can get the price down to $209 - resulting in a saving of about $31 (from the normal $240). The Ryzen 5 7600 (non-X) CPU is not part of this Memorial Weekend promotion - it is currently listed at $223, with no active Newegg promo code granting a generous saving.

Both of these Zen 4 (Raphael) Ryzen 5 processors were awarded TPU's Editor's Choice accolade - despite receiving criticism for "high platform costs," so it is nice to see that the 7600X is available for just north of $200 in the United States - this saving can offset the added premium of an AM5 motherboard, DDR5 RAM and necessary CPU cooling solution (no Wraith unit is included in the slimline box). Customers in China are fortunate to get an even better online deal - the Ryzen 5 7600X and 7600 are available for way below MSRP via JD.com, with both CPUs priced at an all-time low of $183 (1299 RMB) each.

TYAN, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, will be showcasing its latest HPC, cloud and storage platforms at Computex 2023, Booth #M0701a in Taipei, Taiwan from May 30 to June 2. These platforms are powered by AMD EPYC 9004 Series processors, which offer superior energy efficiency and are designed to enhance data center computing performance.

"As businesses increasingly prioritize sustainability in their operations, data centers - which serve as the computational core of an organization - offer a significant opportunity to improve efficiency and support ambitious sustainability targets," said Eric Kuo, Vice President of the Server Infrastructure Business Unit at MiTAC Computing Technology Corporation. "TYAN's server platforms powered by 4th Gen AMD EPYC processor enable IT organizations to achieve high performance while remaining cost-effective and contributing to environmental sustainability."

AMD Ryzen 9 7900X3D, the 12-core/24-thread Socket AM5 processor that's been playing middle-child to the popular 8-core 7800X3D and 16-core 7950X3D flagship, just got a major retailer price-cut. It can now be had for as low as $499, down from its launch price of $599. The chip could be briefly available last month at $549. The $499 price is available on Newegg, where the chip is listed at $589.99, but with the promo-code "MDSCS2343," that shaves $90 off, you arrive at $499. The Ryzen 9 7900X3D is a 12-core/24-thread processor featuring 3D Vertical Cache technology on one of its two CCDs. The processor hence has 128 MB of L3 cache, besides 1 MB of dedicated L2 cache per core.

We would like to address the recent media reports regarding the SOC Voltage exceeding 1.3 V on GIGABYTE's AMD AM5 motherboards especially when EXPO is enabled in the latest beta BIOS.

GIGABYTE respects and appreciates media's support and favor to GIGABYTE motherboards for long time. In terms of the SOC Voltage measurement, the authentic measurement point and method is critical since the SOC Voltage will differ by that. The CPU internal SOC Voltage (SVI3 interface) is the most crucial indicator to motherboards, and, in general, the PWM Output Voltage will be higher than the CPU internal SOC Voltage (SVI3 interface) due to various physical factors.

AMD's next-generation Ryzen 8000 "Granite Ridge" desktop processor based on the "Zen 5" microarchitecture, will continue to top out at 16-core/32-thread as the maximum CPU core-count possible, says a report by PC Games Hardware. The processor will retain the chiplet design of the current Ryzen 7000 "Raphael" processor, with two 8-core "Zen 5" CCDs, and one I/O die. It's very likely that AMD will reuse the same 6 nm client I/O die (cIOD) as "Raphael," just the way it used the same 12 nm cIOD between Ryzen 3000 "Matisse" and Ryzen 5000 "Vermeer;" but with updates that could enable higher DDR5 memory speeds. Each of the up to two "Eldora" Zen 5 CCDs has 8 CPU cores, with 1 MB of dedicated L2 cache per core, and 32 MB of shared L3 cache. The CCDs are very likely to be built on the TSMC 3 nm EUV silicon fabrication process.

Perhaps the most interesting aspect of the PCGH leak would have to be the TDP numbers being mentioned, which continue to show higher-performance SKUs with 170 W TDP, and lower tiers with 65 W TDP. With its CPU core-counts not seeing increases, AMD would bank on not just the generational IPC increase of its "Zen 5" cores, but also max out performance within the power envelope of the new node, by dialing up clock speeds. AMD could ride out 2023 with its Ryzen 7000 "Zen 4" processors on the desktop platform, with "Granite Ridge" slated to enter production only by Q1-2024. The company could update its product stack in the meantime, perhaps even bring the 4 nm "Phoenix" monolithic APU silicon to the Socket AM5 desktop platform. Ryzen 8000 is expected to retain full compatibility with existing Socket AM5, and AMD 600-series chipset motherboards.

AMD has released new AGESA PI1007 to support 48 GB and 24 GB DDR5 memory module for AM5 motherboards including X670E/B650E/B650/A620 platform, boosting the maximum memory capacity from 128 GB to 192 GB on 4 DIMMs, providing performance and compatibility to enthusiasts.

Apart from the wider memory capacity support, the latest AMD AGESA PI1007 also implements the CPU voltage protection updates, please flash your ASRock AM5 motherboard to BIOS version 1.24 for the most up to date technical revision.

This update is a continuation of our response to this issue. As mentioned, ASUS has been working with AMD on defining new rules for the new BIOS updates. These updates will continue to be completed as necessary. The BIOS updates address concerns regarding potential damage that may occur when using Ryzen 7000 series processors with our AM5 motherboards by following the latest guidance from AMD. This includes a cap on SOC voltage at 1.3 V. Please download the latest version of the BIOS updates from asus.com/support.

Thank you again for choosing our product. If you still have any questions, or are concerned that your motherboard may have been affected by this issue, please contact our ASUS support team in your region. If an issue is identified, your motherboard will be covered by our warranty. Our support teams are ready to assist you.

DeepCool debuted its Assassin IV Dual Tower CPU cooler earlier this year at the CES 2023 trade show - as covered by TPU at the time - its very eye-catching design was described as looking: "like (a) big dark cube inside your case, with a shroud covering all its sheet-metal." The flagship high-performance CPU cooler seems to ready for an imminent launch, with press material and product images being released today for the Chinese market. Early impressions indicate that hardware enthusiasts are appreciative of the almost all-black monolithic aesthetic, with some folks predicting that DeepCool is going to win computer hardware product design awards.

DeepCool press material states (via translation) that its Assassin IV CPU cooler provides super silent operation while dealing with up to 280 W of heat - Intel's latest high-end Core i9 CPUs could be tamed with relative ease. The heatsink is comprised of 7 heat pipes with a dual fan attachment that includes 120 and 140 mm FDB fans - said to operate silently at high RPMs. The fans are rated at 500 - 1700 RPM, with an airflow delivery of 79.1 / 58.06 CFM in performance mode, and 63.76 / 46.75 CFM airflow for the gentler quiet mode. Deepcool's specifications indicate that these cooling fans produce less than or equal to 29.3 dB(A) noise at peak performance, and less than or equal to 22.6 dB(A) noise in quiet mode. The entire cooling solution consumes 2.88 W in performance mode.

The latest AMD AGESA 1.0.0.7 AM5 platform microcode that the company recently released to improve stability of machines powered by Ryzen 7000X3D processors, more importantly, prevent them from physical damage due to increased voltage in voltage-assisted overclocking scenarios; reportedly impacts memory overclocking capabilities, too, reports g01d3nm4ng0. The "PROCHOT Control" and "PROCHOT Deassertation Ramp" toggles that were available in the oldest versions of AGESA for AM5, are not available in the latest production AGESA.

The memory compatibility is also affected. AMD recently added support for odd-density DDR5 memory modules, such as 24 GB and 48 GB, which make up 48 GB and 96 GB 2-module (dual-channel, four sub-channel) kits. It is possible to max out 192 GB, but while the older AGESA 1.0.0.6 allowed memory frequencies of up to DDR5-6000 with SoC voltage of 1.3 V, the newer AGESA is only stable up to DDR5-4400 at this density. To be fair, most motherboards advertise maximum memory frequencies of under DDR5-4800 for memory configurations where there are two DIMMs per channel, and both DIMMs are dual-rank (so four dual-rank DIMMs in all, which is the least optimal memory configuration from a memory frequency and latency perspective).

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today that its AMD AM5 platform with X670, B650 and A620 motherboards now support 24 GB and 48 GB DDR5 memory modules after a BIOS update. This update increases the maximum RAM support up to 192 GB across four DIMMs, and up to 96 GB across two DIMMs from the previous maximums of 128 GB and 64 GB, respectively.

By enabling support for non-binary memory on both AMD EXPO and Intel XMP platforms, GIGABYTE motherboards now offer an effortless boost in memory capacity and system performance. This translates to improved multitasking and productivity for gamers and other users with demanding RAM needs. If you want to experience the benefits of this upgrade, get your GIGABYTE motherboard today.

Thermalright today introduced the Assassin Spirit 120 V2, a slim, tower-type CPU air cooler. Measuring 120 mm x 48 mm x 154 mm (WxDxH), and weighing in at 500 g, this cooler is designed for thermal loads of up to 235 W, which means it should run even high-end processors at their stock settings, at lower noise levels from the single fan. Its design involves a copper base, from which four 6 mm-thick copper heatpipes make direct contact with the processor, conveying heat through the aluminium fin-stack, which is capped off by a die-cast metal top-plate.

The TC-C12C V2 120 mm fan included with the Thermalright Assassin Spirit 120 V2, features a fluid-dynamic bearing, takes in 4-pin PWM input, turns at speeds of up to 1,500 RPM, pushing up to 66.17 CFM of airflow, at a maximum static-pressure of 1.53 mm H₂O, and noise output of 25.6 dBA. A 2 g syringe of 9.5 W/mK Thermalright TF4 thermal paste comes included with the cooler. Among the CPU socket types supported are LGA1700, AM5, AM4, LGA1200, and LGA115x. The company didn't reveal pricing.

Overclocking expert Roman "der8auer" Hartung has unveiled the new Ryzen 7000 direct die water block, the AM5 Mycro Direct Die cooler. The new direct die water block promises significantly lower temperatures compared to all-in-one (AiO) liquid coolers.

Of course, users will have to remove the Ryzen 7000 series IHS in order for the block to be in direct contact with the processor, or more precisely, chiplets on the AMD Ryzen 7000 series CPUs. It works with Der8auer's high-performance heatspreader. As tested on the AMD Ryzen 9 7900X CPU, the new Mycro Direct Die cooler can lower the temperature down to 65°C, which is significantly lower than standard 280 mm AiO coolers. The Mycro Direct Die cooler shows its true cooling potential on overclocked CPUs, offering up to 28°C lower temperatures.