Reuters has been informed this week by a trusted insider source that the higher-ups at Intel Corporation are holding talks with Japan's SoftBank about becoming a possible anchor investor in the latter's initial public offering (IPO) of Arm. The British semiconductor and software design company was wholly acquired by the Japanese multinational investment holding firm in 2016. This was followed by a failed takeover bid by NVIDIA—six years later. Arm is aiming to sell its shares via Nasdaq in Q3 or Q4 2023, with a goal of raising around $8 - $10 billion. It also formulated plans to adjust pricing models earlier this year, with news reports labelling the strategic act as an attempt to rake in more royalties.

Intel and Arm have already formed a relationship in recent times—thanks to the development of the former's low-power compute system-on-chips (SoCs). These are set to be built on Intel Foundry's 18A process. The two companies have signed a multi-generation agreement to collaborate on the design of a series of mobile chipsets as an opening product range—diversified options will follow in the future. Arm is rumored (according to Reuters) to be working on its own proprietary chip, but the deal with Intel allows it to use its partner's "open system foundry model."

After 1 year, 9 months, and 28 days of development, the Debian project is proud to present its new stable version 12 (code name bookworm). bookworm will be supported for the next 5 years thanks to the combined work of the Debian Security team and the Debian Long Term Support team.

Following the 2022 General Resolution about non-free firmware, we have introduced a new archive area making it possible to separate non-free firmware from the other non-free packages:

• non-free-firmware
• Most non-free firmware packages have been moved from non-free to non-free-firmware. This separation makes it possible to build a variety of official installation images.

Debian 12 bookworm ships with several desktop environments, such as:

• Gnome 43,
• KDE Plasma 5.27,
• LXDE 11,
• LXQt 1.2.0,
• MATE 1.26,
• Xfce 4.18

ECS showed off a large array of products at their booth at Computex this year, demonstrating the range of markets they cater to, from consumer to industrial. To start with, their long lived LIVA series of mini PCs have received an update to Intel's 13th gen Core series of processors with the LIVA Z5. The LIVA Z5 lineup includes three new models: the Z5 Plus, a more spacious Z5E Plus, and a completely passive Z5F Plus. Each of these feature the new processor generation up to 15 W and are designed for smart retail and kiosk deployments. The series not only boasts the new processor generation, but also expandable DDR4-3200 with capacities up to 64 GB, M.2 PCI-E NVMe Gen 4x4 SSD storage (plus 2.5" SATA in the Z5E and Z5F), optional Wi-Fi 6 module, dual 2.5 GbE, three USB 3.2 Gen 2x1 Type-A, USB Type-C, HDMI, and COM ports. Each of these new models can support up to four simultaneous 4K displays. ECS had the Z5 and Z5E Plus running as a multi-display automated self-service kiosk in their booth where visitors could order a bubble tea. Beside these was also the new LIVA P300, a slightly larger ITX barebones machine with a Q670 motherboard supporting both 12th and 13th Gen processors on LGA 1700, up to 65 W TDP.

The HYTE Thicc FT12 is a stand-out at the company's booth at the 2023 Computex. It's probably the most feature-rich fan specs-sheet we've come across, all to justify its price of $80 for a 3-pack SKU. The 120 mm fan derives its name from its 32 mm thickness, which is a bit more than the 25 mm that's industry standard, and more than double the 15 mm slimline form-factor. The impeller has a liquid-crystal polymer coating that minimizes dust build-up over timeand improves airflow characteristics. The fan's motor has sensors that can detect airflow temperature, as well as the exact position of the impeller. The onboard electronics also has support for HYTE's Nexus Link unified interface over USB type-C (legacy adapter included). As a fan, the HYTE THICC FT12 has a speed-range between 500 to 2,000 RPM, and has zero-RPM capability. At its top speed, it pushes over 70 CFM of airflow, with over 3.3 mm H₂O static-pressure. The company didn't reveal noise figures, though. HYTE is backing the fan with a 6-year warranty.

Mobile devices touch every aspect of our digital lives. In the palm of your hand is the ability to both create and consume increasingly immersive, AI-accelerated experiences that continue to drive the need for more compute. Arm is at the heart of many of these, bringing unlimited delight, productivity and success to more people than ever. Every year we build foundational platforms designed to meet these increasing compute demands, with a relentless focus on high performance and efficiency. Working closely with our broader ecosystem, we're delivering the performance, efficiency and intelligence needed on every generation of consumer device to expand our digital lifestyles.

Today we are announcing Arm Total Compute Solutions 2023 (TCS23), which will be the platform for mobile computing, offering our best ever premium solution for smartphones. TCS23 delivers a complete package of the latest IP designed and optimized for specific workloads to work seamlessly together as a complete system. This includes a new world-class Arm Immortalis GPU based on our brand-new 5th Generation GPU architecture for ultimate visual experiences, a new cluster of Armv9 CPUs that continue our performance leadership for next-gen artificial intelligence (AI), and new enhancements to deliver more accessible software for the millions of Arm developers.

Imagination Technologies is bringing seamless visual experiences to cost-sensitive consumer devices with the new IMG CXM GPU range which includes the smallest GPU to support HDR user interfaces natively.

Consumers are looking for visuals on their smart home platforms that are as detailed, smooth, and responsive as the experience they are accustomed to on mobile devices. At the same time, ambitious content providers are aligning the look and feel of their applications' user interfaces with their cinematic content, by integrating advanced features such as 4K and HDR.

NVIDIA today announced a supercomputer built on the NVIDIA Grace CPU Superchip, adding to a wave of new energy-efficient supercomputers based on the Arm Neoverse platform. The Isambard 3 supercomputer to be based at the Bristol & Bath Science Park, in the U.K., will feature 384 Arm-based NVIDIA Grace CPU Superchips to power medical and scientific research, and is expected to deliver 6x the performance and energy efficiency of Isambard 2, placing it among Europe's most energy-efficient systems.

It will achieve about 2.7 petaflops of FP64 peak performance and consume less than 270 kilowatts of power, ranking it among the world's three greenest non-accelerated supercomputers. The project is being led by the University of Bristol, as part of the research consortium the GW4 Alliance, together with the universities of Bath, Cardiff and Exeter.

With more countries creating initiatives to develop homegrown processors capable of powering powerful supercomputing facilities, India has just presented its development milestone with Aum HPC. Thanks to information from the report by The Next Platform, we learn that India has developed a processor for powering its exascale high-performance computing (HPC) system. Called Aum HPC, the CPU was developed by the National Supercomputing Mission of the Indian government, which funded the Indian Institute of Science, the Department of Science and Technology, the Ministry of Electronics and Information Technology, and C-DAC to design and manufacture the Aum HPC processors and create strong, strong technology independence.

The Aum HPC is based on Armv8.4 CPU ISA and represents a chiplet processor. Each compute chiplet features 48 Arm Zeus Cores based on Neoverse V1 IP, so with two chiplets, the processor has 96 cores in total. Each core gets 1 MB of level two cache and 1 MB of system cache, for 96 MB L2 cache and 96 MB system cache in total. For memory, the processor uses 16-channel 32-bit DDR5-5200 with a bandwidth of 332.8 GB/s. To expand on that, HBM memory is present, and there is 64 GB of HBM3 with four controllers capable of achieving a bandwidth of 2.87 TB/s. As far as connectivity, the Aum HPC processor has 64 PCIe Gen 5 Lanes with CXL enabled. It is manufactured on a 5 nm node from TSMC. With a 3.0 GHz typical and 3.5+ GHz turbo frequency, the Aum HPC processor is rated for a TDP of 300 Watts. It is capable of producing 4.6+ TeraFLOPS per socket. Below are illustrations and tables comparing Aum HPC to Fujitsy A64FX, another Arm HPC-focused design.

Goldkey and IIoT technology manufacture company SECO have announced a strategic collaboration for the Asia-Pacific (APAC) region. The collaboration involves mutual specification of both companies' products, joint customer approach, and promotion of CLEA, the IoT-AI platform developed by SECO, towards existing and potential opportunities with Goldkey DRAM solutions under the auspices of SECO Microelectronics and Goldkey Technology Corporation. The Memorandum of Understanding (MoU) was signed at NürnbergMesse on 14th March 2023.

Complementing the company's expansion of DRAM development in the Industrials sector Vicky Tseng, CEO of Goldkey Technology Corporation states: "The collaboration underlines the symbiosis between both companies. SECO's innovations in IoT hardware which include cyber-security firmware and the AI software-platform address the need for all-encompassing least-complicated answers to modern IoT requirements," adding "SECO is indeed an industry forerunner in highly advanced IIoT technology, and together with Goldkey's industrial-DRAM portfolio, we are confident to providing comprehensive solutions to meeting unique requirements of customers in the region."

According to Tom's Hardware, Microsoft is busy hiring engineers to help the company design its own Arm based SoC for Windows 12. Based on job listings, Microsoft is adding people to its "Silicon team," which is currently involved in designing products for Microsoft's Azure, Xbox Surface and HoloLens products. That said, the specific job listings mentioned by Tom's Hardware mentions "optimizing Windows 12 for Silicon-ARM architecture" suggesting we're looking at a custom Arm SoC, with others mentioning "internally developed silicon components" and "building complex, state-of-the-art SOCs using leading silicon technology nodes and will collaborate closely with internal customers and partners."

That said, Microsoft is currently working with Qualcomm and the Microsoft SQ3 found in the Surface Pro 9 is the latest result of that partnership. This brings the question if Microsoft has decided to make its own chip to compete with the Apple M-series of silicon, or if Microsoft is simply looking at working closer with Qualcomm by hiring inhouse talent that can help tweak the Qualcomm silicon to better suit its needs. With Windows 12 scheduled for a 2024 release, it looks like we'll have to wait a while longer to find out what Microsoft is cooking up, but regardless of what it is, it looks like Windows on Arm isn't going anywhere.

According to the latest report from Reuters, Arm Ltd has filled the documents for its initial public offering (IPO) efforts in hopes of getting publically traded later this year. The stock exchange of choice is Nasdaq, where Softbank plans to list Arm's shares publicly. Seeking to raise anywhere between 8-10 billion US Dollars, the company's market capitalization has yet to be determined. If any factor is to go by, NVIDIA tried to acquire Arm Ltd for 40 billion US Dollars, which ultimately failed due to regulators rejecting the deal.

As a reminder, Arm is changing its licensing model to boost royalties, which we reported about here. Goldman Sachs, JPMorgan Chase & Co, Barclays, and Mizuho Financial Group guide the IPO efforts.

According to Ming-Chi Kuo, an industry analyst known for making accurate predictions about Apple, we have some new information regarding Intel's Sapphire Rapids Xeon processors. As Kuo notes, Intel's major Cloud Service Provider (CSP) client, Microsoft, has notified the supply chain that the company is cutting orders of Sapphire Rapids Xeons by 50-70% in the second half of 2023. Interestingly, Intel's supply chain has notified the company to cut chip orders by around 50% amidst weak server demand. This comes straight after Intel's plans to start shipping Sapphire Rapids processors in the second quarter of 2023 and deliver the highly anticipated lineup to customers.

Additionally, Kuo has stated that Intel isn't only competing for clients with AMD but also with Arm-based CPUs. Microsoft also plans to start buying Arm-based server processors made by Ampere Computing in the first half of 2024. This will reduce Microsoft's dependence on x86 architecture and induce higher competition in the market, especially if other CSPs follow.

The Financial Times this weekend has published details about an interesting development project that is currently in-the-works at British semiconductor specialist firm Arm Ltd. The article states that several executives in the industry have divulged (anonymously) that Arm's engineering team is designing a proprietary chip - these insider sources opine that this new creation could be one of the company's most advanced undertakings. The SoftBank-owned chipmaker is having a bumper year in terms of financial success and has invested in its future - it is speculated that their own semiconductor design will be showcased as a prototype product to potential new clients - with the main goal being to drum up more business and growth. Parent group SoftBank is likely pushing for maximum profit margins as it prepares Arm for an initial public offering (IPO) this year.

Arm's modus operandi involves partnering up with other chip manufacturers in order to license out its semiconductor intellectual properties. In turn these partners are expected to deal with the overall design and manufacturing processes of chips (plus sales of). Arm has teamed up with foundries TSMC and Samsung in the past to create prototypes for software testing purposes, but not much has been heard about those proofing projects in the following years. In an unusual turn (from certain industry perspectives) from its traditional working methodologies, it seems that Arm is embracing a different approach by producing its own compelling designs, with the hope of demonstrating greater potential to customers. FT's sources have provided evidence that Arm has expanded its operations and that a newly formed "solutions engineering" team is focused on prototyping new silicon for usage in mobile hardware and related devices.

Early details of MediaTek's next generation mobile chipset have emerged this week, courtesy of renowned leaker Digital Chat Station via their blog on Weibo. The successor to MediaTek's current flagship Dimensity 9200 mobile chipset will likely be called "Dimensity 9300" - a very imaginative bump up in numbering - with smartphone brand Vivo involved as a collaborator. The tipster thinks that the fabless semiconductor company has contracted with TSMC for fabrication of the Dimensity 9300 chipset - and the foundry's N4P process has been selected by MediaTek, which could provide a bump in generational performance when compared to the older 4 nm and 5 nm standards used for past Dimensity SoC ranges. It should be noted that the current generation Dimensity 9200 chipset is presently manufactured via TSMC's N4P process.

MediaTek is seeking to turnaround its fortunes in the area of flagship mobile chipsets - industry watchdogs have cited a limited uptake of the Taiwanese company's Dimensity 9200 SoC as a motivating factor in the creation of a very powerful successor. Digital Chat Station suggests that the upcoming 9300 model will pack enough of a hardware punch to rival Qualcomm's forthcoming Snapdragon 8 Gen 3 SoC - both chipsets are touted to release within the same time period of late 2023. According to previous speculation, Qualcomm has also contracted with TSMC's factory to pump out the Snapdragon 8 Gen 3 via the N4P (4 nm) process.

ASUS Republic of Gamers (ROG) today announced the all-new ROG Phone 7 series of gaming smartphones at its For Those Who Dare virtual launch event. The ROG Phone 7 series includes the ROG Phone 7 and ROG Phone 7 Ultimate models and is the latest step in the high-performance evolution of the world's greatest gaming phone. This futuristically-styled phone—which sports a new two-tone design—combines the game-winning power of the flagship Snapdragon 8 Gen 2 Mobile Platform with the advanced GameCool 7 thermal system and special ROG tuning to deliver a truly breathtaking mobile gaming experience—and impressively low power consumption. The key to this power efficiency is the revolutionary new rapid-cycle vapor chamber design, which increases heat dissipation efficiency by up to 168%, allowing the ROG Phone 7 series to run games at full speed while maintaining low temperatures.

To make ROG Phone 7 a powerful and portable theater, we've increased the effective volume of the ROG Phone 7 series' speakers by 50% and tuned the system in cooperation with audio specialists Dirac. ROG Phone 7 series now delivers amazing 2.1-channel sound when the new AeroActive Cooler 7 accessory—which houses a powerful subwoofer—is attached.

Intel Foundry Services (IFS) and Arm today announced a multigeneration agreement to enable chip designers to build low-power compute system-on-chips (SoCs) on the Intel 18A process. The collaboration will focus on mobile SoC designs first, but allow for potential design expansion into automotive, Internet of Things (IoT), data center, aerospace and government applications. Arm customers designing their next-generation mobile SoCs will benefit from leading-edge Intel 18A process technology, which delivers new breakthrough transistor technologies for improved power and performance, and from IFS's robust manufacturing footprint that includes U.S.- and EU-based capacity.

"There is growing demand for computing power driven by the digitization of everything, but until now fabless customers have had limited options for designing around the most advanced mobile technology," said Pat Gelsinger, CEO of Intel Corporation. "Intel's collaboration with Arm will expand the market opportunity for IFS and open up new options and approaches for any fabless company that wants to access best-in-class CPU IP and the power of an open system foundry with leading-edge process technology."

Personal computers (PCs) based on Arm architecture will grow in popularity and their market share will almost double from 14% now to 25% by 2027, according to Counterpoint Research's latest projections. The ability of Arm-based hardware to run Mac OS has allowed Apple to capture 90% of the Arm-based notebook computer market. However, the full support of Windows and Office365 and the speed of native Arm-based app adoption are also critical factors in determining the Arm SoC penetration rate in PCs. Once these factors are addressed, Arm-based PCs will become a viable option for both daily users and businesses.

As more existing PC OEMs/ODMs and smartphone manufacturers enter the market, they will bring their expertise in Arm-based hardware and software, which will further boost the popularity of Arm-based PCs. The availability of more native Arm-based apps will also increase user comfort and familiarity with the platform. Overall, the trend towards Arm-based PCs is expected to continue and their market share will likely increase significantly in the coming years.

Amid the push for technology independence, Chinese companies are pushing out more products to satisfy the need for the rapidly soaring demand for domestic data processing silicon. Today, we have information that Chinese Loongson has launched a 3D5000 CPU with as many as 32 cores. Utilizing chiplet technology, the 3D5000 represents a combination of two 16-core 3C5000 processors based on LA464 cores, based on LoongArch ISA that follows the combination of RISC and MIPS ISA design principles. The new chip features 64 MB of L3 cache, supports eight-channel DDR4-3200 ECC memory achieving 50 GB/s, and has five HyperTransport (HT) 3.0 interfaces. The TDP configuration of the chip is officially 300 Watts; however, normal operation is usually at around 150 Watts, with LA464 cores running at 2 GHz.

Scaling of the new chip goes beyond the chiplet, and pours over into system, as 3D5000 supports 2P and 4P configurations, where a single motherboard can become a system of up to 128 cores. To connect them, Loongson uses a 7A2000 bridge chip that is reportedly 400% faster than the previous solution, although we have no information about the last chip bridge. Based on the LGA-4129 package, the chip size is 75.4x58.5×6.5 mm. Regarding performance, Loongson compares it to the average Arm chip that goes into smartphones and claims that its designs are up to four times faster. In SPEC2006, performance reaches 425 points, while maintaining a single TeraFLOP at dual-precision 64-bit format. On the other hand, the processor was built for security, as the chip has a custom hardware-baked security to prevent Spectre and Meltdown, has an on-package Trusted Platform Module (TPM), and has a secret China-made security algorithm with an embedded custom security module that does encryption and decryption at 5 Gbps.

Softbank, the owner of Arm Ltd., is preparing everything it can to ensure a successful initial public offering (IPO) of Arm. However, ahead of the IPO, we have more information about Arm's plans to change its licensing and pricing structures to collect more royalties and ensure higher cash flow for future investors. Currently, Arm licenses technology in the form of intellectual property (IP), usually in different flavors of Cortex-A CPU cores that go inside processors for phones and laptops. Chipmakers that use the IP have additional expenses such as Arm ISA license fee and per-chip royalty, which is based on the chip's average selling price.

However, according to Financial Times, we have a new pricing structure that changes how Arm bills its partners and customers. From now on, Arm will grant licenses to chipmakers and ask them to only ship to device makers with an agreement with Arm. Additionally, these device makers now pay per-device royalty based on the device's average selling price (ASP). This ensures that Arm's fee applies to the higher margin product, which means that ultimately Arm will collect more cash flow from its customers and partners. Currently, the old model charges around 1-2 percents per chip in each smartphone, considering the ASP of smartphone chips to be $40 for Qualcomm, $17 for MediaTek, and $6 for Unisoc. However, taking the ASP of a mobile phone at $335, as recorded in 2022, the fee would be much higher. People familiar with the matter noted that Arm will apply this pricing structure as early as 2024. Apple and Samsung are not impacted by this change, as both companies enjoy their own agreements with Arm.

Kernel information for a chipset code-named 'Quadra' has been leaked by Home IT. It appears that this SoC is under development at Samsung Electronics, and could be featured in the company's next generation flagship smartphone range. The recently released Galaxy S23 smartphone series is powered by Qualcomm's cutting-edge Snapdragon 8 Gen 2 processor, which ended up being a fine choice for the end user. This was not an ideal partnership for the semiconductor giant, considering its constant push to promote internally developed hardware.

Industry experts have praised Samsung for not integrating an Exynos processor into this generation of devices, including regional model variations, but that has not stopped the company's persistent development cycle of proprietary mobile CPUs. Rumors point to a collaboration with Google, and the Exynos 2300 SoC looks to form the basis of the latter's next generation Tensor G3 chipset. The leak reveals that the standard 2300 has been designed as a 1+4+4 core configuration, comprised of four performance cores, four efficiency cores, and one super core.

MediaTek, a fabless semiconductor company powering two billion devices a year, and Kontron, a leading global provider of IoT and Embedded Computer Technology (ECT), today announced that Kontron is integrating MediaTek's Genio 1200 and Genio 700 chipsets into its new modules for IoT applications.

MediaTek Genio is a complete platform stack for IoT, offering brands powerful and efficient chipsets, open platform software development kits (SDK), and a developer portal with comprehensive resources and tools. Genio chipsets are ideal for a wide variety of commercial, industrial, and retail applications that require highly responsive processing, advanced multimedia support, and multi-tasking.

NETGEAR, Inc., the leading provider of award-winning connected products designed to simplify and improve people's lives, today launched the first WiFi 7 router with its new addition to the award-winning Nighthawk line. Built by an experienced team with 25+ years of pioneering WiFi expertise, the NETGEAR Nighthawk RS700 Router is spearheading the WiFi 7 revolution. Packed with unprecedented power, the all-new RS700 delivers up to 19 Gbps of blazing-fast WiFi, more than doubling the speed of previous generations.

The WiFi requirements of modern, hyper-connected homes continue to push the boundaries of today's WiFi standards. With the rise of faster multi-gig internet speeds now available to more and more households, the growing number of connected devices per family and the ever-increasing growth of bandwidth hungry 4K/8K video streaming, HD Zoom calls, hybrid collaborative graphics-intensive work, highly interactive real-time gaming and AR/VR applications and experiences, WiFi continues to evolve to support faster speeds, lower latency and increased capacity. While WiFi 6E opened the 6 GHz band as a superhighway for the latest, fastest devices, WiFi 7 makes good on that promise by unleashing unprecedented speeds and performance. Maximizing that power, NETGEAR's RS700 router, powered by Broadcom's BCM6726/3 WiFi 7 system on a chip (SOC), achieves speeds up to 19 Gbps. The tri-band WiFi 7 router, from the creators of tri-band technology, enables a dramatic decrease in latency for real-time responsiveness for next-generation AR/VR gaming or smooth UHD Zoom calls and 8K streaming for multiple simultaneous users.

Arm Holdings, the Cambridge, UK-based chip designer, is seeking public listing solely in the USA. This major decision has struck a blow to the UK Government's efforts to encourage a dual public listing. Multiple Prime Ministers and high level staff have been in regular meetings with the Arm Executive Team. The current UK Prime Minister Rishi Sunak met with Arm's CEO Rene Haas and SoftBank's founder and Chief Executive Masayoshi Son back in January of this year. It was reported that the meeting was a last ditch attempt to secure an application for UK listing from both companies. Arm Senior Team members have also been in talks with representatives from the London Stock Exchange.

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced that it will present the first live demonstrations of artificial intelligence (AI) and machine learning (ML) implementations on an MCU based on the Arm Cortex -M85 processor. The demos will show the performance uplift in AI/ML applications made possible by the new Cortex-M85 core and Arm's Helium technology. They will take place in the Renesas stand - Hall 1, Stand 234 (1-234) at the embedded world 2023 Exhibition and Conference in Nuremburg, Germany from March 14-16.

At embedded world in 2022, Renesas became the first company to demonstrate working silicon based on the Arm Cortex-M85 processor. This year, Renesas is extending its leadership by showcasing the features of the new processor in demanding AI use cases. The first demonstration showcases a people detection application developed in collaboration with Plumerai, a leader in Vision AI, that identifies and tracks persons in the camera frame in varying lighting and environmental conditions. The compact and efficient TinyML models used in this application lead to low-cost and lower power AI solutions for a wide range of IoT implementations. The second demo showcases a motor control predictive maintenance use case with an AI-based unbalanced load detection application using Tensorflow Lite for Microcontrollers with CMSIS-NN.

Once upon a time, the data center market represented a duopoly of x86-64 makers AMD and Intel. However, in recent years companies started developing custom Arm-based processors to handle workloads as complex within smaller power envelopes and doing it more efficiently. According to Counterpoint Research firm, we have the latest data highlighting a significant new player called Ampere Computing in the data center world. With the latest data center revenue share report, we get to see Intel/AMD x86-64 and AWS/Ampere Arm CPU revenue. For the first time, we see that a 3rd party company, Ampere Computing, managed to capture as much as 1.54% market revenue share of the entire data center market in 2022. Thanks to having CPUs in off-the-shelf servers from OEMs, enterprises and cloud providers are able to easily integrate Ampere Altra processors.

Intel, still the most significant player, saw a 70.77% share of the overall revenue; however, that comes as a drop from 2021 data which stated an 80.71% revenue share in the data center market. This represents a 16% year-over-year decline. This reduction is not due to the low demand for server processors, as the global data center CPU market's revenue registered only a 4.4% YoY decline in 2022, but due to the high demand for AMD EPYC solutions, where team red managed to grab 19.84% of the revenue from 2022. This is a 62% YoY growth from last year's 11.74% revenue share. Slowly but surely, AMD is eating Intel's lunch. Another revenue source comes from Amazon Web Services (AWS), which the company filled with its Graviton CPU offerings based on Arm ISA. AWS Graviton CPUs accounted for 3.16% of the market revenue, up 74% from 1.82% in 2021.